1998 Chip Scale Packaging Proceedings

While abstracts in the Knowledge Base are accessible to all visitors, the full articles (PDF format) are FREE FOR SMTA MEMBERS to download.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

< Back to Conferences List



TITLE AUTHOR
GOOD CONTACT DESIGN LEADS TO IMPROVED TEST PERFORMANCE IN BGA/CSP APPLICATIONS Bert H. Brost  Abstract
THE FUTURE OF VACUUM DISPENSING FOR CHIP SCALE PACKAGE MANUFACTURING Chris Lawing  Abstract
CSP INFLUENCE ON EVOLUTIONARY DESIGNS Dale E. Lee  Abstract
BURN-IN SOCKET REQUIREMENTS FOR CSP David Pfaff  Abstract
CHIP SCALE PACKAGING DESIGN OR AEROSPACE AND MILITARY APPLICATIONS Emmanuel J. Siméus  Abstract
X-RAY STRATEGIES FOR INSPECTION OF BGA DEVICES Frank Silva  Abstract
THERMAL DYNAMICS and BGA BALL REFLOW Greg Ayers  Abstract
REMOVABLE CHIP MODULE (RCM TM) James Rathburn  Abstract
ACHIEVING HIGHER PERFORMANCE FROM DISCRETE SILICON DEVICES USING MSMT CSPS John Richards  Abstract
CSP CLEANING APPLICATIONS BY THE Megacleaner ™ PROCESS Jose A. Berbel  Abstract
MANUFACTURING METHODOLOGIES FOR HIGH DENSITY INTERCONNECT STRUCTURES (HDIS) KATHLEEN NARGI-TOTH  Abstract
IMPLEMENTATION OF A SUCCESSFUL REWORK PROCESS FOR CHIP-SCALE PACKAGES Mario J. Gislao  Abstract
THE FACE-UP CHIP, A NEW FLIP-CHIP PACKAGE OPTION Phil Marcoux  Abstract
FLUX-FREE PROCESS FOR PLACEMENT AND ATTACH OF SOLDER BALLS TO WAFERS, FLIP CHIPS AND ALL BGA PACKAGES Richard Ramos  Abstract
HIGH THERMAL CONDUCTIVITY GREASES FOR USE IN CSP, FLIP CHIP AND NEAR CSP PACKAGES Ron Hunadi  Abstract
CSPs IN JAPANESE PORTABLE PRODUCTS Thomas Goodman  Abstract
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819