Pan Pacific Symposium 2012 Proceedings

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TITLE AUTHOR
Developing iNEMI'S Research Priorities Alan Rae Ph.D.  Abstract
Sustainable Electronics Alan Rae, Ph.D.  Abstract
2011 iNEMI Technology Roadmap and Its Place in Fulfilling the iNEMI Mission Bill Bader and Chuck Richardson  Abstract
Low Temperature Processing Conductive Adhesives for High Temperature Applications Binghua Pan, Chee Keng Yeo, and Su Liang Chan  Abstract
Material Selection and Parameter Optimization for Reliable TMV PoP Assembly Brian Roggeman, David Vicari, Lee Smith and Ahmer Syed  Abstract
EU Electronics Research and Development Direction; Highlights of Framework 7 and Expectations For Framework 8 Chris Bailey, MBA, Ph.D.  Abstract
The Richard Desich SMART Commercialization Center for Microsystems: A New Model to Drive Industry Development Chris Mather  Abstract
Training Gaps and Opportunities in Electronics Manufacturing Chris Mather  Abstract
Towards Large Area Roll-To-Roll (R2R) Flexible Multilayer Electronics Denisse E. Yepez, M.S.; Daryl L. Santos, Ph.D.; Bahgat Sammakia, Ph.D.; and Mark D. Poliks, Ph.D.  Abstract
The IPC International Technology Roadmap For Electronic Interconnections Dieter W. Bergman  Abstract
Roadmaps for ESD (Electrostatic Discharge) - True Prospects of Just Interests of the Industrial Enterprises Dipl.-Ing. Hartmut Berndt  Abstract
Automated Precision Assembly for High-Volume HB LEDs Donald J. Beck and Jessica Sylvester  Abstract
Technology Alternatives Towards Low-Cost and High-Speed Interconnect Manufacturing F. Roozebooma, B. Kniknie, A.M. Lankhorst, G. Winands, R. Knaapen, P. Poodt, G. Dingemans, W. Keuning, W.M.M. Kessels, J.E. Bullema, P.M.M.C. Bressers, G. Oosterhuis, M. Mueller and A.J. Huis in't Veld  Abstract
Investigation of Factors that Influence Creep Corrosion on Printed Circuit Boards Haley Fu, Cherie Chen, Prabjit Singh, Jing Zhang, Anil Kurella, Xu Chen, Xiaodong Jiang, Jennifer Burlingame, and Simon Lee  Abstract
JISSO Electronics Technology Roadmap Through 2020 Henry H. Utsunomiya  Abstract
3D Integration Packaging by Organic and Glass Materials Henry H. Utsunomiya  Abstract
Roadmapping Risks and Returns Herbert J. Neuhaus, Ph.D. and Charles E. Bauer, Ph.D.  Abstract
There's Plenty of Room at the Bottom: Nanomaterials Emerges as an Electronics Powerhouse Herbert J. Neuhaus, Ph.D. and Charles E. Bauer, Ph.D.  Abstract
Evaluation of Molded Underfill Packages Using Acoustic Micro Imaging Janet E. Semmens  Abstract
Stress Analysis of Multilayered Printed Circuit Board Under Mechanical Loading Jia-Shen Lan and Mei-Ling Wu  Abstract
PCB Dynamic Coplanarity at Lead-Free SMT Temperatures John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez and Ron Kulterman  Abstract
Silicon and Packaging Technology Trends in High Performance Networking Judy Priest  Abstract
Industry-University Collaboration and Advances in Lead-Free Solder Technology Kazuhiro Nogita, Ph.D.  Abstract
The Stability of Cu6Sn5 in the Formation and Performance of Lead-Free Solder Joints Keith Sweatman, Tetsuro Nishimura, and Kazuhiro Nogita  Abstract
Recent Progress In Anisotropic Conductive Adhesives (ACAs) Technology Kyung W. Paik  Abstract
3D Integration - A Promising Approach For Smart Systems Integration M. Juergen Wolf and Klaus-Dieter Lang  Abstract
Equipment and Process Solutions for Low Cost High Volume Manufacturing Of 3D Integrated Devices Markus Wimplinger, Jürgen Burggraf, Daniel Burgstaller, Thorsten Matthias, Harald Wiesbauer, Andreas Fehkührer, and Maria Schachinger  Abstract
Dielectrics for the Embedding of Active and Passive Devices N. Galster, R. Park, C. Schauer, A. Bruderer, and A. Kok  Abstract
Thin Palladium Layers as an Effective Cost Saving Strategy in Electronics Applications Olaf Kurtz, Jürgen Barthelmes, Eckart Klusmann, and Stephen Kenny  Abstract
Solder Paste Printing and Solder Paste Inspection Optimization Strategy for the PCBA SMT Process Phil Isaacs, Wayne Zhang, Alec Chen, Hill Liu, and Tracy Cai  Abstract
3D Glass and Silicon Interposers with TPV vs. 3D ICs with TSV Rao R. Tummala, Ph.D., Venkatesh Sundaram, Ph.D., Vijay Sukumaran, and Gokul Kumar  Abstract
Silver-Polyaniline-Epoxy Electrical Conductive Adhesives - A Percolation Threshold Analysis Sarang P. Gumfekar, Alex Chen, and Boxin Zhao  Abstract
Electroless Plating Process on Glass Substrate Satoshi Kawashima, Ph.D.  Abstract
The Perspectives Of 3D IC Technology In Taiwan Shen-Li Fu, Ph.D., Wei-Chung Lo, Ph.D., and Ray-Lin Yang, Ph.D.  Abstract
Silicon Interposer For A 12X10 Gb/s Electro-Optical Engine Terry Bowen and Richard Miller  Abstract
Pushing the Limits of Lead-Free Soldering Tetsuro Nishimura  Abstract
Tin-Copper-Nickel-Germanium - A Case Study in Lead-Free Implementation Tetsuro Nishimura  Abstract
Methods of Micro Ball Bumping for Wafer Level and 3-Dimensional Applications Using Solder Sphere Transfer and Solder Jetting Thomas Oppert, Andrew Strandjord, Thorsten Teutsch, Ghassem Azdasht, and Elke Zakel  Abstract
New 3D Packaging Approach For Next Generation High Performance DRAM Vern Solberg, Simon McElrea, and Wael Zohni  Abstract
An Evaluation of the Neville Distribution for Studying the Brittle Failure Mode in Microelectronics Drop Testing Studies Vikram Venkatadri, Pushkraj Tumne, Krishnaswami Srihari, and Daryl L. Santos  Abstract
Copper Pillar Bump Process Characterization on 300mm Wafers Wei Koh, Ph.D.  Abstract
3D Contactless Capacitive Coupled Interconnection Circuit Design Yu-Jung Huang, Ph.D., Shen-Li Fu, Ph.D., Yi-Lung Lin, and Ming-Kun Chen, Ph.D.  Abstract
Critical Parameters Lead to Failure of Lead-Free Solder Joint Under Thermal Cycling Yung-Wen Wang and Mei-Ling Wu  Abstract
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