1997 Emerging Technologies Proceedings

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TITLE AUTHOR
PCA’S: ULTRA-THIN IS IN Dale E. Lee  Abstract
Reduced Oxide Soldering Activation (ROSA): Enabling Technology for Soldering of Flip Chip Assemblies David Hillman  Abstract
INTEGRAL PASSIVE COMPONENTS David L. Wolf  Abstract
CONFORMAL HIGH DENSITY INTERCONNECTS Denis Barone  Abstract
Application of Flip Chip in Hard Disk Drive Industry Milton Buschbom  Abstract
EARLY EXPERIENCES WITH ASSEMBLY OF CHIP SCALE PACKAGES Peter Arrowsmith  Abstract
DEMYSTIFYING PC CARDS Richard Freiberger  Abstract
ADVANCED CHIP SCALE PACKAGES OFFER MANUFACTURING ADVANTAGES Ron Bauer  Abstract
ELECTRONICS: THE ROAD AHEAD Ronald C. Lasky  Abstract
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