International Conference on Soldering & Reliability 2011 Proceedings

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TITLE AUTHOR
A Parametric Approach To Optimizing BGA Design For Reflow Reliability A.Shirazi, H. Lu and A. Varvani-Farahani  Abstract
Studies In The Interaction Of Moisture And PCBs, Part 2 B. Christian, Brandon Smith, Jordan Lui and Gyubok Baik  Abstract
How Using Automated 3D X-Ray Inspection Can Improve Product Reliability Barbara Koczera and An Qi Zhao  Abstract
Studies In The Interaction Of Moisture And PCBs, Part 1 Bev Christian and Gyubok Baik  Abstract
Device Sensitivity to Post Solder Attach Processes Curtis Grosskopf, Paul Krystek, Giacomo Catucci and Michael Lauri, Ai Kiar Ang, Wen Wei Low, and Matt Kelly  Abstract
Evaluation Of Tin Copper (SnCu) Modified Lead-Free Solder Alloys For Wave Solder Processes David Hillman, Tim Pearson and Jody Faust  Abstract
Voiding Control At QFN Assembly Derrick Herron, Yan Liu, Ph.D., and Ning-Cheng Lee, Ph.D.  Abstract
Microstructure and Whisker Growth of SAC Solder Alloys with Rare Earth Additions in Different Environments Doug Perovic, Leonid Snugovsky, John Rutter, Polina Snugovsky, Zohreh Bagheri, and Stephan Meschter  Abstract
Development Of A Test Vehicle For The Study Of Tin Whiskers Heather McCormick, Jimmy Chow, Polina Snugovsky, Eva Kosiba, and Stephan Meschter  Abstract
Critical Considerations for Conformal Coating Jason Keeping, P. Eng.  Abstract
Laminate Resistance To Pad Crater Defects: Comparative Spherical Bend Testing John McMahon P.Eng. and Brian Gray P.Eng.  Abstract
Assessment of Microalloyed Sn-Zn as a Solder for Electronics Assembly Keith Howell, Keith Sweatman, Takashi Nozu, Tetsuro Nishimura  Abstract
Virtual Imaging Of Interconnect Stress Test Coupon Failures M. Anthony, D. Blake, R. Hu, and D. Ramjattan  Abstract
Application Of Solder Paste In PCB Cavities Markus Leitgeb and Christopher Michael Ryder  Abstract
Lead-Free Supply Chain Management Systems: Printed Circuit Board Assembly & Test Audit And Technology Qualification Matt Kelly, Marie Cole, Larry Pymento, Celeste Zippetelli and Willie Davis  Abstract
Conductive Crystals, White Residues and Decreased Reliability - The Rush To Clean No-Clean Michael Konrad  Abstract
Optimization of the 01005 Discrete Assembly Process Mike Berry  Abstract
Cleaning Flux Residues Under Low Component Gaps Mike Bixenman, DBA  Abstract
Pb-Free Assembly With Low-Ag Solders For High Yield And Solder Joint Performance Pericles A. Kondos, Michael Meilunas, and Peter Borgesen  Abstract
Assembly And Rework Of A Large Surface Mount Connectors With Wafers Phil Isaacs, Sven Peng, Seow Wah Sng, Wai Mun Lee and Alex Chen  Abstract
Whisker-Impenetrable Metal Cap Process For Electronic Assemblies Robert J. Landman, Gordon Davy, Dennis D.Fritz  Abstract
Influence Of Filler Modifications On The Performance Of A Novel Anisotropic Conductive Adhesive Under Temperature/Humidity Aging S. Manian Ramkumar, Ph.D., Alex Chen, P.E., Hari Venugopalan, Ph.D. and Kumar Khanna, Ph.D.  Abstract
Characterization And Prediction Of Pad-Crater Fracture In Lead-Free Compatible PCBs Siva P.V. Nadimpalli and Jan K. Spelt  Abstract
Tin Whisker Testing and Risk Modeling Project Stephan Meschter, Polina Snugovsky, Jeff Kennedy, Steve McKeown and Eva Kosiba  Abstract
Case Histories in Failure Analysis of Electronics Assemblies Vladimir Igoshev  Abstract
How To Cope With The Next Wave In Substance Regulations Walter Jager  Abstract
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