Pan Pacific Symposium 2011 Proceedings

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TITLE AUTHOR
3D Nanofabrication Using Heated Probes - Towards MHZ Patterning Rates A. W. Knoll, P. Paul, F. Holzner, M. Despont, U. Duerig, and J. L. Hedrick  Abstract
Solder Paste Stencil Manufacturing Methods And Their Impact On Precision And Accuracy Ahne Oosterhof and Stephan Schmidt  Abstract
Developments In Nano Enabled Interconnects Alan Rae  Abstract
Conformal Coating Evaluation For Use In Harsh Environments Utilizing A Modified SIR Test Protocol Casey H. Cooper  Abstract
Energy, Electronics, And Ecology; Turning A Negative Into A Positive Charles E. Bauer, Ph.D., and Herbert J. Neuhaus, Ph.D.  Abstract
Development Of Accurate Wafer Thinning, Low Stress Die Separation And Handling Technology Chuichi Miyazaki, Haruo Shimamoto, Toshihide Uematsu, Yoshiyuki Abe, Kosuke Kitaichi, and Shoji Yasunaga  Abstract
Enabling MSL-1 Capability For QFN And Other Design Leadframe Packages - Part II Dan Hart, John Ganjei, and Nilesh Kapadia  Abstract
Voiding Control At QFN Assembly Derrick Herron, Yan Liu, Ph.D., and Ning-Cheng Lee, Ph.D.  Abstract
Improved Performance, Reliability And Cost Through Integration Of Simple Components - Passives! Franck Murray  Abstract
Solutions Against ESD (Electrostatic Discharge) In A Production Line (SMT) - Today And In The Future – International ESD And Semiconductor Roadmap Hartmut Berndt, Dipl.-Ing.  Abstract
Emerging Embedded Devices Into Substrate For More Than Moore Era Henry Hisanobu Utsunomiya  Abstract
HB-LED Cavity Encapsulation Horatio Quinones, Tom Ratledge, and Heakyoung Park  Abstract
Advancements In High Frequency, High Resolution Acoustic Micro Imaging For Thin Silicon Applications Janet E. Semmens  Abstract
Laminate Resistance To Pad Crater Defects: Comparative Spherical Bend Testing John McMahon, P.Eng. and Brian Gray, P.Eng.  Abstract
Past, Present And Future Of Solderless Assembly Joseph Fjelstad  Abstract
Over-Molded Electronics and Printed Hybrid Systems Jukka-Tapani Mäkinen, Kimmo Keränen, Ph. D., Teemu Alajoki, Matti Koponen, Antti Keränen, Ph. D., Antti Kemppainen, and Kari Rönkä, Ph. D.  Abstract
The Stability Window And Mechanical Properties Of The Interfacial Intermetallic In Lead-Free Solder Joints Keith Sweatman, Kazuhiro Nogita, Hideaki Tsukamoto, and Tetsuro Nishimura  Abstract
Backlight Illumination Structure Based On Embedded Inorganic LED Chips And Hot Laminated Multilayer Polymer Kimmo Keränen, Ph. D., Jukka-Tapani Mäkinen, Mikko Heikkinen, Marianne Hiltunen, Markku Lahti, Ph. D., Antti Sunnari, Kari Rönkä, Ph. D. and Matti Koponen  Abstract
Eco-Compliance Audit – Will You Pass? Krista Botsford Crotty  Abstract
EU RoHS Recast - Are You Ready? Krista Botsford Crotty  Abstract
3D Packaging Initiatives M. Juergen Wolf and Klaus-Dieter Lang  Abstract
Innovative High Throw Copper Electroplating Process For Metallization Of PCB Maria Nikolova, Ph.D. and Jim Watkowski  Abstract
Copper Wire Bonding On Pure Palladium Surface Finishes – Eliminating The Gold Cost From The Electronic Package Mustafa Özkök, Hugh Roberts, and Horst Clauberg  Abstract
Device Level 3D Integration Technologies For High Performance/Reliability Modules Paul Houston, Brian Lewis, Keck Pathammavong, Tim Sparks, and Daniel F. Baldwin, Ph.D.  Abstract
Damage Accumulation In Pb-Free Solder Joints For Complex Loading Histories Peter Borgesen, Linlin Yang, Awni Qasaimeh, Babak Arfaei, Liang Yin, Brian Roggeman, and Michael Meilunas  Abstract
Pb-Free Thermal Cycle Acceleration Factors Phil Isaacs and Eddie Kobeda  Abstract
Assembly And Rework Of Large Surface Mount Connectors With Wafers Phil Isaacs, Sven Peng, Seow Wah Sng, Wai Mun Lee, and Alex Chen  Abstract
Low-Cost Silicon And Glass Interposers And Packages Professor Rao R. Tummala; Venky Sundaram, Ph.D.; Tapobrata Bandyopadhyay; Vivek Sridaran; and Vijay Sukumaran  Abstract
Assembly Interconnect Reliability In Solid State Lighting Applications – Part 1 Rahul Raut, Ravi Bhatkal, Westin Bent, Bawa Singh, Sujatha Chegudi, Ranjit Pandher, Justin Kolbe and Sanjay Misra  Abstract
New Process And Cost Reduction Developments In Tin Silver Electroplating Of Wafers Robert S. Forman  Abstract
Influence of Filler Modifications on the Performance of a Novel Anisotropic Conductive Adhesive Under Temperature/Humidity Aging S. Manian Ramkumar, Ph.D., Alex Chen, P.E., Hari Venugopalan, Ph.D. and Kumar Khanna, Ph.D.  Abstract
Economic Considerations In Choosing A TSV Deposition Technology Steve Lerner  Abstract
Geometric Downscaling – A Challenge For Process Chemicals And Materials Sven Lamprecht, Hugh Roberts, and Chisato Okawa  Abstract
Laser Direct Structuring For Innovative Electronics Designs Tamim P. Sidiki, Abel Pot, and Frank v.d. Burgt  Abstract
Design For Green Electronics Tamim P. Sidiki, Ph.D. and Ine Cox  Abstract
Integration Of Magnetics, Semiconductors, And PCBs In One Component Tamim P. Sidiki, Ph.D., Abel Pot, Frank van der Burgt, See-Wee Ong, Rinus v. d. Berg, and Horst Roehm, Ph.D.  Abstract
Silicon Interposer For Compact Right Angle Coupling Of Flip Chip Vcsel And Detector Arrays To Multi-Facet Endface Optical Fibers Terry Bowen, Marcel Buijs, Jeroen Duis, Mirko Schurink  Abstract
Thin Wafer Processing And Chip Stacking For 3D Integration Thorsten Matthias, Daniel Burgstaller, Markus Wimplinger, and Paul Lindner  Abstract
Simulation and Modeling of Capacitive Coupling Interconnection For 3D Integration Yu-Jung Huang, Ph.D., Shen-Li Fu, Ph.D., Yi-Lung Lin and Ming-Kun Chen, Ph.D.  Abstract
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