South East Asia Technical Conference on Electronics Assembly Technologies 2011 Proceedings

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TITLE AUTHOR
LAND AND SOLDER GRID ARRAY SMT ASSEMBLY CHALLENGES Dudi Amir  Abstract
BIG CLEANING JOB VS. SMALL CLEANERS THE ADVANTAGES AND PITFALLS OF GOING SMALL Eric Camden  Abstract
A STUDY OF THE ENEPIG IMC FOR EUTECTIC AND LF SOLDERS G. Milad, D. Gudeczauskas, G. O’Brien, and A. Gruenwald  Abstract
LOW-SILVER BGA ASSEMBLY PHASE II – RELIABILITY ASSESSMENT SIXTH REPORT: THERMAL CYCLING RESULTS FOR UNMIXED JOINTS Gregory Henshall, Michael Fehrenbach, Chrys Shea, Quyen Chu, Girish Wable, Ranjit Pandher, Ken Hubbard, and Ahmer Syed  Abstract
FLUID FLOW MECHANICS: KEY TO LOW STANDOFF CLEANING Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, Sylvain Chamousset, Joachim Becht, Ph.D., and Steve Stach  Abstract
ELECTROSTATIC DISCHARGE (ESD), FACTORY ISSUES, MEASUREMENT METHODS AND PRODUCT QUALITY Hartmut Berndt  Abstract
COMPARISON OF VARIOUS METROLOGIES TO MEASURE VOIDS IN X-RAY IMAGES OF HIGH DENSITY BGA PACKAGE SOLDER BALLS Ife Hsu and Raiyo Aspandiar, Ph.D.  Abstract
A COUNTERFEIT PART PROTECTION PLAN AND MANAGEMENT PROCESS Jacklin Adams, John Quick, *Celine Chong, Teresa Yu, Anthony Spielberg, Stephen Chong  Abstract
MOISTURE-CURE POLYURETHANES – LATEST DEVELOPMENTS IN VOC-FREE CONFORMAL COATINGS Jade P. Bridges  Abstract
PROCESS DEVELOPMENT AND RELIABILITY STUDY WITH ANISOTROPIC CONDUCTIVE FILM BONDING WITH MULTIPLE TYPES OF PCB SURFACE FINISHES Jenson Lee, David Geiger, and Dongkai Shangguan, Ph.D.  Abstract
LEAD-FREE PTH BARREL FILL CHALLENGE FOR HIGH THERMAL MASS COMPONENTS Jinda Songninluck, Juthathip Fangkangwanwong ,Teng Hoon Ng  Abstract
Studies on a Newly Discovered White Whiskers Causing Battery Leakage Karuna Chinniah, Ph.D  Abstract
FLUX SPATTER DURING REFLOW SOLDERING Kevin Tan, Casey Ng, and Dennis Lim  Abstract
EVALUATION OF LEAD FREE SURFACE FINISHES Khaw Mei Ming  Abstract
FAILURE ANALYSIS OF “BLACK PAD” DEFECT AND ITS PREVENTION Kong Hui Lee, Ph.D. and Todd Broome  Abstract
LEAD-FREE MISPRINT BOARD CLEANING STUDIES Kong Hui Lee, Ph.D., George Oxx, & Mike Bixenman, Ph.D.  Abstract
IMPLEMENTING SILVER SURFACE FINISHING FOR BROADER SEGMENTS OF ELECTRONICS Lenora Toscano, John Swanson, Ernest Long PhD and John Ganjei PhD  Abstract
HARSH ENVIRONMENT IMPACT ON RESISTOR RELIABILITY Marie Cole, Lenas Hedlund, George Hutt, Tibor Kiraly, Levente Klein, Steve Nickel, Prabjit Singh, and Tim Tofil  Abstract
LATEST TECHNIQUES IN STENCIL PRINTING FOR HETEROGENEOUS ASSEMBLY Mark Whitmore and Clive Ashmore  Abstract
CLEANING FLUX RESIDUES UNDER LOW COMPONENT GAPS Mike Bixenman, DBA  Abstract
THE BENEFITS OF PURE PD LAYERS IN ENEP AND ENEPIG SURFACE FINISHES Mustafa Oezkoek, Gustavo Ramos, Rahmat Budiardjo, Hugh Roberts  Abstract
PRESS-FIT INTERCONNECTION ASSEMBLY CHALLENGES AND SOLUTIONS Phil Isaacs, Sven Peng, HM Chan, Wai Mun Lee, and Alex Chen  Abstract
ROOM TEMPERATURE LED AND D-PAK TYPE COMPONENT-ATTACH AND RELIABILITY TESTING T. Acchione and M. Scalzo  Abstract
LONG-TERM RELIABILITY ASSESSMENT OF A NEW LEAD-FREE AREA ARRAY CONNECTOR SYSTEM Takashi Kikuchi, Gnyaneshwar Ramakrishna, Quyen Chu, Hien Ly, Sundar Sethuraman, Chrys Shea, and Jean-Paul Clech  Abstract
NEW SOLDER ATTACH IN AREA ARRAY CONNECTOR: ASSESSING THE RELIABILITY OF SOLDER CHARGE SMT ASSEMBLY Theeraphong Kanjanupathum, Teng Hoon Ng, and Adam Stanczak  Abstract
SELECTION OF DIP TRANSFER FLUXES AND SOLDER PASTES FOR POP ASSEMBLY Yan Liu, Ph.D., Pamela Fiacco, Derrick Herron, and Ning-Cheng Lee, Ph.D.  Abstract
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