SMTA International 2010 Proceedings

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TITLE AUTHOR
THERMAL WARPAGE OF FLIP-CHIP PLASTIC BALL GRID ARRAY COMPONENT: EXPERIMENT AND MODELING A. Shirazi, H. Lu, and A. Varvani-Farahani  Abstract
SMT CHALLENGES IN ALTERNATIVE ENERGY Alan Rae  Abstract
UNDERSTANDING DIFFERENCES BETWEEN DEFENSE OEM/CEM AND TRADITIONAL CEM BUSINESS MODELS Allan B. Day  Abstract
DEVELOPMENT OF A PACKAGING SYSTEM FOR CLINICAL EVALUATION OF A NANOCOMPOSITE-BASED NEURAL ELECTRODE ARRAY FABRICATED FROM A CHEMORESPONSIVE POLYMER SUBSTRATE Andrew Barnes, Allison Hess, Christian Zorman; Mondhita Diewvilai  Abstract
THE Pb-FREE IN ELECTRONICS RISK MITIGATION (PERM)CONSORTIUM Anthony J. Rafanelli, Ph.D., P.E.  Abstract
NEW DEVELOPMENTS IN HIGH-TEMPERATURE, HIGH-PERFORMANCE LEAD-FREE SOLDER ALLOYS Anton-Zoran Miric  Abstract
EVALUATION OF DEFECTS IN LEAD-FREE BGA SOLDER JOINTS UNDER RANDOM VIBRATION STRESS Anurag Bansal, Kuo-Chuan Liu, and Jie Xue  Abstract
HOW TO DEAL WITH PROBLEM AREAS FOR SELECTIVE CONFORMAL COATING Arjen Koppens; Ad van Dinter  Abstract
USING X-RAY SYSTEMS TO DETECT COUNTERFEIT AND REWORKED ELECTRONIC COMPONENTS Art Ogg  Abstract
BIOCOMPATIBLE POLYMER COMPOSITE MATERIAL FOR HIGHLY SENSITIVE POINT OF CARE BIOMEMS MICROCANTILEVER SENSORS Arvind Sai Sarathi Vasan, Ravi Doraiswami, Ph.D., Michael G. Pecht, Ph.D.  Abstract
RELIABILITY TESTING OF LINEAR IMAGE SENSOR DEVICES Awni Qasaimeh, Mridula Gosavi, Frank Andros, Susan Lu, Bahgat Sammakia; Mike Joyner, Mike Sullivan, Jeff Zarnowski  Abstract
Mixed Flowing Gas Test Procedures for Creep Corrosion and How To Minimize Its Occurrence Barry S. Hindin, Ph.D., P.E.  Abstract
MECHANICAL FAILURES IN Pb-FREE PROCESSING: SELECTED MITIGATION TECHNIQUES FOR PAD CRATER DEFECTS Brian Gray, P. Eng., John McMahon, P. Eng.  Abstract
Applications of Solder Fortification with Preforms Carol Gowans and Ronald C. Lasky, Ph.D., P.E.  Abstract
ZERO-DEFECT STRATEGIES WITH COMBINED OPTICAL AND X-RAY INSPECTION (AOI/AXI) Carsten Salewski and Jesper Lykke  Abstract
READING THE FINE PRINT: CHALLENGES AND OUTLOOK FOR PRINTED ELECTRONICS Charles E. Bauer, Ph.D., Herbert J. Neuhaus, Ph.D.  Abstract
CHALLENGES OF PACKAGING Cd-Zn-Te (CZT) DETECTORS Charles G. Woychik, Ph.D., Brian D. Yanoff, Ph.D., James E. Simpson, Ph.D., Jay Cao, Ph.D., Ian M. Spinelli, Vincent S. Smetkowski, Ph.D.; James Adriance, Lawrence Harvilchuck, Brian Roggeman, George Westby  Abstract
PROCESS CONTROL-BASIS FOR A COST-EFFECTIVE SELECTIVE SOLDERING PROCESS Christian Ott, Heike Schlessmann, Reiner Zoch  Abstract
COMBINATORIAL EFFECTS OF ELECTROMIGRATION AND LOW CYCLE FATIGUE Christopher Hunt, Davide Di Maio, Charles Murdock, Owen Thomas  Abstract
ULTRAVIOLET CONFORMAL COATING PROCESS DEVELOPMENT Corey Peterson  Abstract
HIGH COMPLEXITY LEAD-FREE WAVE AND REWORK: THE EFFECTS OF MATERIAL, PROCESS AND BOARD DESIGN ON BARREL FILL Craig Hamilton, John McMahon, Jose Traya, Wang Yong Kang, Khoo Kok Wei; Matthew Kelly, Marie Cole  Abstract
VALIDATION OF A NEW R.O.S.E. CLEANLINESS TEST METHOD Curtis Hart; Steve Stach; Mike Bixenman, DBA  Abstract
NASA-DoD COMBINED ENVIRONMENTS TESTING RESULTS Cynthia Garcia  Abstract
APPLICATIONS METHODS AND MATERIAL SETS FOR PRINTED ELECTRONICS Daniel Fenner  Abstract
HOW EFFICIENT IS YOUR HIGH MIX EMS SUPPLIER Dave Cesar; Roy Starks  Abstract
NASA DoD -55°C TO +125°C THERMAL CYCLE TEST RESULTS Dave Hillman, Tim Pearson, Ross Wilcoxon  Abstract
ORGANIC AND PRINTED ELECTRONICS-A VIEW FROM THE TRADITIONAL MARKET PLACE David Baron, Frank Bruening, Ph.D., Robin Taylor  Abstract
Specification Limits Review for Solder Paste Stencil Print Inspection (SPI) David Sbiroli, Ed Briggs, and Chris Anglin  Abstract
iNEMI LEAD FREE WAVE SOLDERING PROJECT: AN INVESTIGATION OF THROUGH-HOLE ELECTRICAL INTERCONNECTS Denis Barbini; Denis Jean; Stuart Longgood; Keith Howell; Jian Miremadi  Abstract
LAND AND SOLDER GRID ARRAY SMT ASSEMBLY CHALLENGES Dudi Amir  Abstract
BIG CLEANING JOB VS. SMALL CLEANERS THE ADVANTAGES AND PITFALLS OF GOING SMALL Eric Camden  Abstract
A New Surface Finish for the Electronics Industry Ernest Long, Ph.D., and Lenora Toscano  Abstract
REAL LIFE X-RAY INSPECTION FOR BGAs, QFNs, COUNTERFEIT COMPONENTS AND 3D PACKAGES Evstatin Krastev and David Bernard  Abstract
Supporting Component Self-Alignment by Forced Oscillation During Reflow Soldering Florian Schüßler, Michael Pfeffer, Stefan Härter, and Prof. Dr.-Ing. Jörg Franke  Abstract
SELECTIVE SOLDERING TECHNOLOGY SELECTION Francisco Fernandez, Eddie Tang, Feng Lu, Ph.D.  Abstract
Experiences in Transferring Recipes from an Eight Zone Reflow Oven to A Ten Zone Oven - Unexpected Savings Fred Dimock  Abstract
A Study of the ENEPIG IMC for Eutectic and LF Solders G. Milad, D. Gudeczauskas, G. O'Brien, and A. Gruenwald  Abstract
AOI IN AN 01005 WORLD Galen Alexander, Cathy Combet and Ming-Ming Chang  Abstract
How to Implement Good Test Coverage and Eliminate Escapes for Printed Circuits Board Assembly Operation Gaosen Li, An Qi Zhao, Andrew Ho, Wei Wen, Zhen (Jane) Feng, Ph. D., and Murad Kurwa; Haolee Yang and Liang Chen  Abstract
CLEAN “NO-CLEAN” OR USE A WATER WASH SOLDER PASTE? Gerjan Diepstraten; Tim Lawrence, Ph.D.  Abstract
HOW CLEAN IS CLEAN Graham Naisbitt  Abstract
LOW-SILVER BGA ASSEMBLY PHASE II – RELIABILITY ASSESSMENT SIXTH REPORT: THERMAL CYCLING RESULTS FOR UNMIXED JOINTS Gregory Henshall, Michael Fehrenbach; Chrys Shea; Quyen Chu,Girish Wable; Ranjit Pandher; Ken Hubbard, Gnyaneshwar Ramakrishna; Ahmer Syed  Abstract
BENCHMARK STUDY: pH-NEUTRAL VS. ALKALINE CLEANING AGENTS Harald Wack, Ph.D., Umut Tosun, M.S.; John Neidermann; John Radmann  Abstract
METHODS USED IN THE DETECTION OF COUNTERFEIT ELECTRONIC COMPONENTS Harold “Woody” Hewett  Abstract
PCB Creep Corrosion and Board Design Considerations He Jingqiang, Gao Feng, Tu Yunhua, and Liu Sang  Abstract
PROCESS CONTROL - MEASUREMENT SYSTEM ANALYSIS Herb Robbins  Abstract
COMPARISON OF VARIOUS METROLOGIES TO MEASURE VOIDS IN X-RAY IMAGES OF HIGH DENSITY BGA PACKAGE SOLDER BALLS Ife Hsu and Raiyo Aspandiar, Ph.D.  Abstract
BALL GRID ARRAY COMPONENT FAILURE ANALYSIS FOR HIGH RELIABILITY ELECTRONIC SYSTEMS J. Scott Nelson  Abstract
MOISTURE-CURE POLYURETHANES – LATEST DEVELOPMENTS IN VOC FREE CONFORMAL COATINGS Jade P. Bridges  Abstract
OVERVIEW OF NEW DoD RELIABILITY REVITALIZATION INITIATIVES James G. McLeish, CRE  Abstract
Silver Corrosion in High Sulfur Environments James S. Tonge  Abstract
PCB PAD SITE DRESS METHODS ON BGA AND SOCKET PAD ARRAYS James Wade and Raiyo Aspandiar; Don Naugler and Terry Leahy  Abstract
AN INVESTIGATION INTO THE DEVELOPMENT OF LEAD-FREE SOLDER PASTE FOR PACKAGE ON PACKAGE (PoP) COMPONENT MANUFACTURING APPLICATIONS Jasbir Bath, Manabu Itoh, Gordon Clark, Masatoshi Fuji, Hajime Takahashi, and Roberto Garcia  Abstract
An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/ QFN Type Components Jasbir Bath, Manabu Itoh, Gordon Clark, Noriyoshi Uchida, Hajime Takahashi, and Roberto Garcia  Abstract
AN EVALUATION OF SEALANTS USED IN PHOTOVOLTAIC (PV) MODULE MANUFACTURE Jasbir Bath, Mike Moreau, Martin Gershenson, Cathy He, Yinbai Li, Miaosheng Zheng  Abstract
SURFACE MOUNT PERFORMANCE OF 0.4mm-PITCH SOLDER JOINTS WITH FOCUS ON STACKING MATERIALS AND PROCESSES FOR PACKAGE-ON-PACKAGE APPLICATIONS Jason Brand, Myung Jin Yim, Nanette Quevedo, Maria Ospina, Ravikumar Adimula, and Cenon Dayawon  Abstract
PROCESS DEVELOPMENT AND RELIABILITY STUDY WITH ANISOTROPIC CONDUCTIVE FILM BONDING WITH MULTIPLE TYPES OF PCB SURFACE FINISHES Jenson Lee, David Geiger, and Dongkai Shangguan, Ph.D.  Abstract
ODM OR EMS: WHICH CHOICE IS BEST FOR YOUR PROJECT? Jim Chen  Abstract
Electroless Palladium as a PCB Surface Finish - The Re-Introduction Jim Trainor  Abstract
QUAD FLAT NO LEAD (QFN) PACKAGE PROCESSING IN HIGH THERMAL MASS ASSEMBLY Jinda Songninluck, Theeraphong Kanjanupathum, and Teng Hoon Ng  Abstract
EVALUATION OF THERMAL INTERFACE MATERIAL PERFORMANCE IN A CYCLIC STRAIN ENVIRONMENT Joe Doman, Eddie Kobeda, Ph.D., Jim Bielick, Joe Kuczynski, Tim Tofil, and Mike Vaughn  Abstract
Reliability Issues Caused by Bending HDI Flexible Circuits John Dzarnoski and Kexia Sun  Abstract
A Standardized Method to Evaluate Process Material Compatibility with In-Circuit Test in High Complexity Assembly John McMahon, P.Eng., Simin Bagheri, and Lynn Klev  Abstract
INTERACTIVE PAPERLESS WORK INSTRUCTIONS USED FOR PROCESS MANAGEMENT John Stimadorakis  Abstract
ITAR COMPLIANCE: CHALLENGES AND BENEFITS IN AN OUTSOURCED RELATIONSHIP Joseph F. O’Neil  Abstract
FABRICATION OF LOW COST FLEXIBLE SOLAR CELLS USING SOLUTION-BASED COATING TECHNIQUES SOLUTION-BASED COATING TECHNIQUES Joseph Weiss, Peter Kariuki, Jasper Chiguma, Jessica Gendron, Babak Arfaei, Peter Borgesen, and Wayne Jones  Abstract
LEAD-FREE WAVE SOLDERING FOR PROCESS AND PRODUCT DESIGN IMPROVEMENT IN SnCu ALLOYS Juthathip Fangkangwanwong, Mongkhol Phuhattsuan, and Teng Hoon Ng  Abstract
CHARACTERISATION OF THERMAL-ELECTRICAL AND MECHANICAL BEHAVIOUR OF POP K. Weide-Zaage, L. Meinshausen; H. Frémont  Abstract
THE DEVELOPMENT OF AN IMPROVED TIN-ZINC SOLDER Keith Sweatman, Takashi Nozu, Tetsuro Nishimura  Abstract
STENCIL TECHNOLOGIES FOR SMALL APERTURE PRINTING Kevin Liticker, MS, CSSBB  Abstract
NASA-DoD LEAD-FREE ELECTRONICS PROJECT:OVERVIEW Kurt Kessel  Abstract
MOISTURE AND CONTAMINATION CONSIDERATIONS FOR LONG TERM STORAGE OF END OF LIFE ELECTRONIC COMPONENTS Lee Melatti  Abstract
PRINTED ELECTRONICS FOR FLEXIBLE SOLID STATE LIGHTING Marc Chason  Abstract
HARSH ENVIRONMENT IMPACT ON RESISTOR RELIABILITY Marie Cole, Lenas Hedlund, George Hutt, Tibor Kiraly, Levente Klein, Steve Nickel, Prabjit Singh, Tim Tofil  Abstract
COUNTERFEIT COMPONENTS – THE 800 POUND GORILLA Mark Pasdon  Abstract
NEW DEVELOPMENTS IN BROADBAND PRINTING TECHNIQUES Mark Whitmore, Clive Ashmore  Abstract
HEAD-IN-PILLOW: ALARM STILL RINGING? A CONTINUATION STUDY ON KNOWN CHEMICAL AND MECHANICAL FACTORS IN BGA NON-WET Masato Shimamura and Tomoko Nonaka; Tetsuya Okuno, Satoru Akita, and Derek Daily  Abstract
LEAD-FREE HASL: BALANCING BENEFITS AND RISKS FOR HIGH COMPLEXITY HIGH RELIABILITY SERVER AND STORAGE HARDWARE Matthew Kelly, Jeffrey Taylor, Brett Krull, Marie Cole, Tom Truman  Abstract
Four Ways to Reduce Voids in BGA/CSP Package to Substrate Connections Michael A. Previti, Mitch Holtzer, and Tom Hunsinger  Abstract
New Copper Electrolytes for Blind Microvia Filling Michael Dietterle, Ph.D.  Abstract
CHARACTERISTICS AND POTENTIALS OF NANO-COATED STENCILS FOR STENCIL PRINTING OPTIMIZATION Michael Rösch, Prof. Dr.-Ing. Jörg Franke; Carmina Läntzsch, Georg Kleemann  Abstract
NiPdAu PLATING QUALIFICATION OF RF-IC PACKAGES Mumtaz Y. Bora  Abstract
The Benefits of ENEPIG with Pure Pd for Gold Wire Bonding Mustafa Oezkoek, Gustavo Ramos, Dieter Metzger, and Hugh Roberts  Abstract
RESISTANCE OF COMMON PWB SURFACE FINISHES AGAINST CORROSION IN HARSH ENVIRONMENTS Mustafa Özkök, Mario Gensicke, Guenter Heinz; Hugh Roberts, Joe McGurran  Abstract
BRIDGING SUPPLY CHAIN GAP FOR EXEMPT HIGH-RELIABILITY OEM’S Nicholas Leonardi  Abstract
THERMAL CYCLING RELIABILITY OF PACKAGE ON PACKAGES ASSEMBLED BY ONE-PASS AND TWO-PASS TECHNIQUES Nicholas Williard, Preeti Chauhan, Vikram Srinivas, Michael Osterman, and Michael Pecht; Robert Farrell  Abstract
DROP TEST ASSESSMENT OF A MEDIUM COMPLEXITY ASSEMBLY FOR HIGH RELIABILITY APPLICATIONS P. Snugovsky; J. Bragg, Z. Bagheri, M. Romansky; A. Ganster; W. Russell; J. P.Tucker and C. A. Handwerker; D. D. Fritz  Abstract
TEMPERATURE CYCLING OF Pb-FREE AND MIXED SOLDER INTERCONNECTIONS USED ON A PACKAGE-ON-PACKAGE TEST VEHICLE P. T. Vianco, J. M. Grazier, J. A. Rejent, and A.C. Kilgo; F. Verdi and C. Meola  Abstract
EFFECTS OF COMPONENT WARPAGE ON BOARD ASSEMBLY DEFECTS AND EFFECTIVE MITIGATION MEASURES Peng Su and Guhan Subbarayan  Abstract
PRESS-FIT INTERCONNECTION ASSEMBLY CHALLENGES AND SOLUTIONS Phil Isaacs, Sven Peng; HM Chan, Wai Mun Lee, Alex Chen  Abstract
RESIDUAL-LIFE ESTIMATION OF LEAD-FREE ELECTRONICS IN SHOCK AND VIBRATION USING KALMAN FILTER MODELS Pradeep Lall and Ryan Lowe; Kai Goebel  Abstract
SURVIVABILITY ASSESSMENT OF ADVANCED INTERCONNECTS AND LEAD-FREE ELECTRONICS SUBJECTED TO SHOCK AND VIBRATION WITH XFEM AND CZM Pradeep Lall, Mandar Kulkarni, and Arjun Angral  Abstract
INTERROGATION OF DAMAGE-STATE IN LEAD-FREE ELECTRONICS UNDER SEQUENTIAL EXPOSURE TO THERMAL AGING AND THERMAL CYCLING Pradeep Lall, Rahul Vaidya, Vikrant More; Kai Goebel  Abstract
IONIC CONTAMINATION EXTRACTION EFFECTIVENESS AND CORRELATION OF ANALYSIS METHODS Pravin Sequeira, Kantesh Doss, Arnold Hogrefe, Minh Nguyen  Abstract
ENVIRONMENT-FRIENDLY VAPOR PHASE CONFORMAL INSULATION OPTIONS FOR RELIABILITY IMPROVEMENT OF ELECTRONICS Rakesh Kumar  Abstract
A COST-EFFECTIVE PROCESS FOR EDGE PROTECTION OF WAFERS Ramachandran K. Trichur, Gary J. Brand, Curtis Planje, Xie Shao  Abstract
Considerations for Selecting a Printed Circuit Board Surface Finish Randy Schueller, Ph.D.  Abstract
ANALYSIS OF THE INFLUENCE OF REFLOW PROFILE PARAMETERS ON PACKAGE ON PACKAGE (PoP) COMPONENT ASSEMBLY Rangaraj Dhanasekaran, Harish Gadepalli, and S. Manian Ramkumar, Ph.D.  Abstract
A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS Ranjit Pandher, Rahul Raut, Michael Liberatore, Navendra Jodhan, and Karen Tellefsen  Abstract
EFFECT OF MULTIPLE REFLOW CYCLES ON SOLDER JOINT FORMATION AND RELIABILITY Ranjit Pandher; Ashok Pachamuthu  Abstract
ISSUES AND CONCERNS IN CLEANING UNDER LOW PROFILE COMPONENTS Rich Brooks, Mike Bixenman, D.B.A.  Abstract
SOLDER JOINT RELIABILITY OF Pb-FREE TIN-SILVER-COPPER CERAMIC BALL GRID ARRAY (CBGA) PACKAGES AS A FUNCTION OF COOLING RATE AND SILVER CONTENT Richard Coyle, Peter Read, Debra Fleming, Richard Popowich, Iulia Muntele; Robert Kinyanjui, Jonathon Shirey, Mulugeta Abtew, John Manock  Abstract
RELIABILITY COMPARISON OF SAC305 AND SAC105 PLASTIC BALL GRID ARRAYS ASSEMBLED WITH BACKWARD COMPATIBLE SOLDERING PROCESSES Richard Coyle, Peter Read, Richard Popowich, Debra Fleming; Heather McCormick; John Osenbach  Abstract
THE INFLUENCE OF SOLDER VOID LOCATION ON BGA THERMAL FATIGUE LIFE Richard Coyle, Peter Read, and Richard Popowich; Heather McCormick; John Osenbach  Abstract
THE EFFECT OF SILVER CONTENT ON THE SOLDER JOINT RELIABILITY OF A Pb-FREE PBGA PACKAGE Richard Coyle, Peter Read, Richard Popowich, Debra Fleming; Heather McCormick; John Osenbach; John Manock  Abstract
PRACTICAL ISSUES AND SOLUTIONS FOR HANDLING PLASTIC ENCAPSULATED MICROCIRCUITS (PEMs) Rick Iodice  Abstract
Evaluation of Nano-Coated Stencil for Ultra Fine Pitch Component Assembly Rita Mohanty, Ph.D., Rajiv Iyer, Sharan Hoogar and Daryl Santos, Ph.D.  Abstract
HARSH ENVIRONMENTS AND VOLATILES IN SEALED ENCLOSURES Robert K. Lowry; Richard C. Kullberg; Daniel J. Rossiter  Abstract
PACKAGING HIGH DENSITY CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCERS (CMUT) SENSOR ARRAYS USING HYPERBGA® TECHNOLOGY – PART II Robert Wodnicki, Charles G. Woychik, Kai Thomenius; Glen Thomas, Irv Memis, Ulises Penaherrera, Barry Bonitz, Todd Davies  Abstract
POLYIMIDE-OVER-UBM PROCESS: THE CHALLENGES AND SOLUTIONS ON PLATING BUMP PROCESS Roden Topacio  Abstract
Use of Non Etching Adhesion Promoters in Advanced PCB Applications Roger Massey and Adrian Zee  Abstract
HIGH TEMPERATURE ELECTRONICS PACKAGING TECHNOLOGY FOR SIGNAL CONDITIONING AND PROCESSING CIRCUITS S. T. Riches; C. Johnston, M. Sousa, P. Grant, D. Shepherd  Abstract
OUTSOURCING LED PCB MANUFACTURE Scott Mauldin  Abstract
NEXT GENERATION BOARD LEVEL UNDERFILL (BLUF) FOR FINE PITCH BGA AND POP Siang Miang Yeo, Cheng Siew Tay, Ching Ching Chong, and Jin Siang Beh  Abstract
OVERCOMING COMPLEX MANUFACTURING ISSUES WITH RF MMIC PRODUCTS: A CASE STUDY Steve Greathouse, Jennifer Davisson, Gary Catlin, Jared Stockett, Teri Whipple, Richard Garcia, Steve Abrahamson, Jim Spinuzzi  Abstract
CHALLENGES IN LEAD-FREE WAVE SOLDERING Sunil Gopakumar, Francois Billaut, Eric Fremd; Chris Chu, K.Y.Tsai, Chu Lin, Toyma Lee; Jasbir Bath  Abstract
ROOM TEMPERATURE LED AND D-PAK TYPE COMPONENT-ATTACH AND RELIABILITY TESTING T. Acchione and M. Scalzo  Abstract
LONG-TERM RELIABILITY ASSESSMENT OF A NEW LEAD-FREE AREA ARRAY CONNECTOR SYSTEM Takeshi Saito, Nobuhiro Tamai, Takashi Kikuchi; Gnyaneshwar Ramakrishna; Chrys Shea; Jean-Paul Clech  Abstract
HIGH RELIABILITY BOND PADS Terence Collier, Bal Benavidez, Indira Gubeljic  Abstract
NEW SOLDER ATTACH IN AREA ARRAY CONNECTOR:ASSESSING THE RELIABILITY OF SOLDER CHARGE SMT ASSEMBLY Theeraphong Kanjanupathum, Teng Hoon Ng; Adam Stanczak  Abstract
NASA-DOD LEAD-FREE ELECTRONICS PROJECT: MECHANICAL SHOCK TEST Thomas A. Woodrow, Ph.D.  Abstract
NASA-DoD LEAD-FREE ELECTRONICS PROJECT: VIBRATION TEST Thomas A. Woodrow, Ph.D.  Abstract
Latest Developments in Surface Finishing of PCBs Using Plasma Deposition Tim von Werne, Ph.D., Andy Brooks, and Siobhan Woollard  Abstract
ELECTRONIC PRODUCT ASSEMBLY IN THE GLOBAL MARKETPLACE: THE MATERIAL PIECE OF THE COMPETITIVE PUZZLE Tom Borkes  Abstract
THE ENCAPSULATION OF MEMS/SENSORS ON PACKAGE LEVEL AND WAFER LEVEL WITH FILM ASSISTED MOLDING TECHNOLOGY Ton van Weelden and Lingen Wang  Abstract
STENCIL ENABLING PROCESSES FOR SMALL AREA RATIO’S William E. Coleman Ph.D.  Abstract
EFFECT OF PCB SURFACE FINISHES ON LEAD-FREE SOLDER JOINT RELIABILITY Xu Zheng, Hongfeng Ran, Lei Wang, Hao Kou, Yexiang Ning, Bei Wang, Xian Lin, and Zuyao Liu  Abstract
SELECTION OF DIP TRANSFER FLUXES AND SOLDER PASTES FOR POP ASSEMBLY Yan Liu, Ph.D., Pamela Fiacco, Derrick Herron, and Ning-Cheng Lee, Ph.D.  Abstract
TESTING AND PREVENTION OF HEAD-IN-PILLOW Yan Liu, Ph.D., Pamela Fiacco, M.S., and Ning-Cheng Lee, Ph.D.  Abstract
Pb-FREE REFLOW PROCESS STUDY FOR HIGH YIELD, HIGH RELIABILITY FLIP CHIP ON SILICON SUBSTRATE ASSEMBLY Zhaozhi Li, Sangil Lee, Brian J. Lewis, Paul N. Houston, Daniel F. Baldwin, Gene Stout, Ted Tessier and John L. Evans  Abstract
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