Pan Pacific Symposium 2000 Proceedings

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TITLE AUTHOR
FLUXLESS SUBMICRON FLIP CHIP BONDING TECHNOLOGY USING SOLDER BUMPS Akira Yamauchi  Abstract
AUTOMATING UNDERFILL FOR NON-TRADITIONAL PACKAGES, SECONDARY CSP UNDERFILL, STACKED DIE, AND NO-FLOW UNDERFILL Alec J. Babiarz  Abstract
SHIELDING DESIGN OPTIMIZING EMC CHARACTERISTICS IN ADVANCED MCM PACKAGING Alessandro Gandelli  Abstract
LOW ALPHA PARTICLE EMITTING SILICONE MATERIALS FOR MICROELECTRONICS Ann Norris  Abstract
ENCAPSULATED, MAGNETIC-SEMICONDUCTOR DEVICE FOR POWER CONVERSION APPLICATIONS Ashraf Lotfi  Abstract
ULTRA VIA SUBSTRATE FOR ADVANCED BGA APPLICATIONS Bill Chou  Abstract
SOC (SUBSTRATE ON CHIPS) MOLD COMPOUND EVALUATION C.L. Chung  Abstract
BOARD-LEVEL THERMAL DESIGN MAPS FOR HQFP Ching-Bai Hwang  Abstract
MINIATURE SYSTEMS DRIVE CHIP-SCALE ASICS Dale Lee  Abstract
DEVELOPMENT AND QUALIFICATION OF HIGH COMPLEXITY PCB Daniel Chienhung Lai  Abstract
IMMERSION TIN AS A HIGH PERFORMANCE SOLDERABLE FINISH FOR FINE PITCH PWBS David Ormerod  Abstract
1X BROADBAND WAFER STEPPER FOR BUMP AND WAFER LEVEL CHIP SCALE PACKAGING (CSP) APPLICATIONS Doug Anberg  Abstract
HIGH DENSITY ELECTRONICS PACKAGING ASSESSMENT Emmanuel J. Siméus  Abstract
THREE-DIMENSIONAL INTELLECTUAL SENSORS OF MAGNETIC FIELD ON THE BASE OF HALL EFFECT Fuad Kasimov  Abstract
AUTOMATED OPTICAL INSPECTION OF PRINTED CIRCUIT CARD ASSEMBLIES Guy A. Eckroth  Abstract
RELIABILITY ISSUES ON THE 128M TSOP II 54L DUAL CHIP PACKAGE James Fan  Abstract
SIMULATED SCANNING FOR EFFICIENT SCANNING ACOUSTIC MICROSCOPY James McKeon  Abstract
EVALUATION OF UNDERFILL IN FLIP CHIP AND BGA ON PC BOARDS USING 3V RECONSTRUCTION AND THROUGH- TRANSMISSION IMAGING Janet Semmens  Abstract
RELIABILITY AND FAILURE ANALYSIS OF NO-CLEAN FLIP CHIP ASSEMBLY Jen-Chieh Chang  Abstract
WETTABILITY ANALYSIS FOR C4 OLGA PACKAGE Jinlin Wang  Abstract
SOLID SOLDER DEPOSITS FOR ADVANCED MICROELECTRONIC APPLICATIONS Joanne DeBlis  Abstract
NOVEL PACKAGE DESIGNS TO ENHANCE LEADFRAME BASED PACKAGES John Briar  Abstract
Advancements in Stacked Chip Scale Packaging (S-CSP), Provides System-in-a-Package Functionality for Wireless and Handheld Applications Kada Smith  Abstract
OUTSOURCING AS A STRATEGIC TOOL Kewal K. Verma  Abstract
LASER STRUCTURING AS AN ENABLING TECHNOLOGY FOR HDI AND PSGA Leo Higgins  Abstract
ASSESSMENT OF LIQUID ENCAPSULATED AND TRANSFER MOLDED WIREBONDED CAVITY FILLED PACKAGES Lisa Ryan  Abstract
FUNDAMENTALS OF BGA BALL ATTACH REFLOW PROCESS Michael Ko  Abstract
EVALUATION OF KEY UNDERFILL FORMULATION PARAMETERS ON THE PERFORMANCE OF FLIP-CHIP DEVICES Michael Todd  Abstract
ADVANCEMENTS IN STACKED CHIP SCALE PACKAGING (S-CSP), PROVIDES SYSTEM-IN-A-PACKAGE FUNCTIONALITY FOR WIRELESS AND HANDHELD APPLICATIONS Morihiro Kada  Abstract
ADVANCEMENTS IN STACKED CHIP SCALE PACKAGING (S-CSP), PROVIDES SYSTEM-IN-A-PACKAGE FUNCTIONALITY FOR WIRELESS AND HANDHELD APPLICATIONS Morihiro Kada  Abstract
AUTOMATION & CONTROL OF THE SURFACE MOUNT PROCESS Neil Douglas  Abstract
APPLICATION SPECIFIC FLIP CHIP PACKAGES: CONSIDERATIONS AND OPTIONS IN USING FCIP Paul Mescher  Abstract
WORLD WIDE DEPLOYMENT OF CSP ASSEMBLY PROCESS CSP STRESS/STRAIN ENERGY DISTRIBUTION MODELING AND FATIGUE RESISTANCE STUDY Paul P.E. Wang  Abstract
CSP SMT AND SOLDER JOINT RELIABILITY Pei-Ying Shieh  Abstract
HIGH TCE BALL GRID ARRAY FOR SINGLE CHIP CERAMIC PACKAGING Raj N. Master  Abstract
ARE OEMS BECOMING OBSOLETE AS MANUFACTURERS? Randall Sherman  Abstract
INTEGRATED LIQUID COOLING SYSTEM FOR THE THERMAL MANAGEMENT IN LTCC MULTILAYER Reinhard Bauer  Abstract
A STUDY ON MULTI-CHIP PACKAGE TECHNOLOGY – DUAL CHIP IN TSOP II 54L PACKAGE Richard Lu  Abstract
ADVANCED HEAT PIPE THERMAL SOLUTIONS FOR HIGHER POWER NOTEBOOK COMPUTERS Robert DeHoff  Abstract
IN SITU THERMAL CHARACTERIZATION OF MICRO-ELECTRONIC COMPONENTS AND SYSTEMS Roger Emigh  Abstract
NOVEL TRANSFER MOLDING TECHNIQUE FOR ENCAPSULATING PBGA PACKAGES Ron Molnar  Abstract
PBGA REWORK PROCESS WITH MINIMUM VOID FORMATION Rupert Kreuzkamp  Abstract
DIE-CRACKING RISKS IN ADDING A HEATSLUG TO A QFP PACKAGE S. H.-K. Lee  Abstract
DIE-CRACKING RISKS IN ADDING A HEATSLUG TO A QFP PACKAGE Samuel Ip  Abstract
PROCESS 'OPTIMIZATION' USING DESIGNED EXPERIMENTS IN AN EMS PROVIDER'S FACILITY Sandeep Tonapi  Abstract
THERMAL AND ELECTRICAL PERFORMANCE FOR STACK CHIP PACKAGE Sang Wook Park  Abstract
LOW COST, HIGH VOLUME PRODUCTION OF A FINE PITCH DCA ASSEMBLY Scott Joslin  Abstract
INLINE FLUX VOLUME MEASUREMENT FOR CSP PROCESS CONTROL Stacy Kalisz  Abstract
DEVELOPMENT OF MICROELECTRONIC GRADE SILICONE MATERIALS FOR CHIP SCALE PACKAGES Stanton Dent  Abstract
LEAD-FREE SOLDERING SOLUTION FOR OVERMOLDED HYBRID MCM-L PACKAGES Steve Liang  Abstract
KEY PROPERTIES AND REQUIREMENTS FOR MATERIALS USED IN CHIP SCALE PACKAGING Steven W. Wilson  Abstract
REQUIREMENTS FOR MOISTURE AND THERMAL-SHOCK RESISTANCE OF A PLASTIC BGA PACKAGE Teo Poi Siong  Abstract
A VISION OF ELECTRONICS IN THE 21st CENTURY Toru Ishida  Abstract
APPLICATION OF MICROELECTRONIC DEVICES FOR PACKAGE-INDUCED STRESS MEASUREMENT Tung-Sheng Chen  Abstract
FLEX, RIGID, AND CERAMIC CSP - LIFETIME BEHAVIOR W.H. Müller  Abstract
SILICONE, CHIP SCALE PACKAGE, AND ITS RELIABILITY Yeong J. Lee  Abstract
A SIMPLE FLEX-CSP AND ITS RELIABILITY Yii-Tay Chiou  Abstract
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