International Conference on Soldering & Reliability 2009 Proceedings

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TITLE AUTHOR
EVALUATION OF THERMAL STRESS IN A FLIP CHIP PACKAGE BY HYBRID EXPERIMENTAL-ANALYTICAL METHOD A.Shirazi, H.Lu and A.Varvani-Farahani  Abstract
WATER JET CUTTING FOR CROSS SECTIONING AND DE-PANELLING APPLICATIONS Alex Kaldor, A.C. Rinella and Bev Christian  Abstract
HIGH QUALITY REFLOW SOLDERING WITH VAPOR PHASE THE NEW APPROACH OF VAPOR PHASE TECHNOLOGY Andreas Flechtmann and Andreas Thumm  Abstract
CONFESSIONS OF A NEOPHYTE IN TEMPERATURE PROFILING A BATCH REFLOW OVEN Bev Christian  Abstract
FINE FEATURE STENCIL PRINTING 0.3MM PITCH COMPONENTS Chris Anglin, et al.  Abstract
VAPOURPHASE VACUUM-SOLDERING: A NEW PROCESS TECHNOLOGY OPENS TREMENDOUS PRODUCTION CAPABILITIES WHEN REFLOW-SOLDERING Claus Zabel and Allen Duck  Abstract
RELIABILITY ASSESSMENT OF ALTERNATIVE LEAD-FREE ALLOYS USED DURING WAVE AND REWORK Craig Hamilton, et al.  Abstract
RELIABILITY OF SAC305 AND SN3.5AG SOLDERS UNDER HIGH TEMPERATURE THERMAL CYCLING Elviz George, et al.  Abstract
MOVING TOWARDS A STABLE PROCESS: MINIMIZING VARIATION IN SOLDER PASTE PRINTING George Babka  Abstract
NANOBOND® ASSEMBLY – A RAPID, ROOM TEMPERATURE SOLDERING PROCESS Greg Caswell  Abstract
EFFECT OF ASSEMBLY VARIATIONS ON PACKAGE ON PACKAGE RELIABILITY IN THERMAL CYCLING Heather McCormick, et al.  Abstract
GUIDELINES FOR ESTABLISHING A LEAD-FREE WAVE SOLDERING PROCESS FOR HIGH-RELIABILITY APPLICATIONS J. Scott Nelson  Abstract
ELECTROPLATE BUMPING WITHOUT PHOTORESIST AND SI DICE STACKING WITH TSV FOR 3D PACKAGING Jiheon Jun, Inrak Kim, Younggon Lee and Jae Pil Jung  Abstract
HOT AIR SOLDER LEVELLING – A SOLUTION TO LEAD-FREE SOLDERABILITY PROBLEMS Keith Howell and Keith Sweatman  Abstract
Control Of Spalling in SAC Pb-Free Solder Alloys When Used with a Ni Substrate L. Snugovsky, et al.  Abstract
ADDRESSING THE CHALLENGE OF HEAD-IN-PILLOW DEFECTS IN ELECTRONICS ASSEMBLY Mario Scalzo, CSMTPE  Abstract
LEAD-FREE ASSEMBLY OF SERVER CLASS PCBAs: QUALIFICATION TRIAL RESULTS Matthew Kelly, et al.  Abstract
THERMAL CYCLE TESTING OF PWBS – METHODOLOGY Michael Freda and Paul Reid  Abstract
PROCESS CHALLENGES AND SOLUTIONS FOR EMBEDDING CHIP-ON-BOARD INTO MAINSTREAM SMT ASSEMBLY Mukul Luthra  Abstract
THE USE OF SEGREGATED HYDROFLUOROETHERS AS CLEANING AGENTS IN ELECTRONICS PACKAGING APPLICATIONS Philip G. Clark, Erik D. Olson, and Hiromi Kofuse  Abstract
EFFECT OF SILVER IN COMMON LEAD-FREE ALLOYS Ranjit Pandher and Tom Lawlor  Abstract
PROBABILISTIC ASSESSMENT OF COMPONENT LEAD-TO-LEAD TIN WHISKER BRIDGING S. McCormack and S. Meschter  Abstract
SOLDER JOINT MICROSTRUCTURE AND RELIABILITY STUDY OF PLASTIC BALL GRID ARRAY (PBGA196) AND MICRO LEAD FRAME (MLF) COMPONENTS IN LEAD FREE PROCESSES Simin Bagheri, et al.  Abstract
FLUID FLOW MECHANICS - NEW ADVANCES IN LOW STANDOFF CLEANING Sinisa Aleksic, Ph.D., et al.  Abstract
PREDICTING THE STRENGTH OF SOLDER JOINTS USING COHESIVE ZONE MODELING Siva P. V. Nadimpalli and Jan K. Spelt  Abstract
SOLDERING CHALLENGES IN A HALOGEN-FREE PCB ASSEMBLY PROCESS Timothy Jensen, Ronald Lasky and Amanda Hartnett  Abstract
IMPACT OF REWORK ON RELIABILITY OF PLASTIC BALL GRID ARRAYS SUBJECTED TO MECHANICAL BEND TEST Vikram Srinivas, et al.  Abstract
RoHS2 and REACH: The Next Steps for Restricted Substances Solutions and services for Environmental Compliance Walter Jager  Abstract
CREEP FRACTURE MECHANISM OF PLATED-THROUGH-HOLE(PTH) SOLDER JOINTS BASED ON PHYSICS-OF-FAILURE(PoF) Won Sik Hong, et al.  Abstract
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