SMTA International 2009 Proceedings

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TITLE AUTHOR
REINTRODUCTION OF VAPOR PHASE SOLDERING TECHNOLOGY FOR LEAD FREE APPLICATION Adzahar Samat and KL Chia  Abstract
EFFECTS OF REFLOW ATMOSPHERE AND FLUX ON TIN WHISKER GROWTH OF Sn-Ag-Cu SOLDER Alongheng Baated, et al.  Abstract
THERMAL SHOCK AND DROP TEST PERFORMANCE OF LEAD-FREE ASSEMBLIES WITH NO-UNDERFILL AND CORNER-UNDERFILL Bankeem Chheda, S. Manian Ramkumar, Ph.D., and Reza Ghaffarian, Ph.D.  Abstract
THE CHALLENGES OF PACKAGE ON PACKAGE (POP) DEVICES DURING ASSEMBLY AND INSPECTION Bob Willis and David Bernard  Abstract
RELIABILITY INVESTIGATION of Sn/Cu/Ni SOLDER JOINTS Brian Roggeman, Ursula Marquez de Tino and Denis Barbini  Abstract
ENHANCING RELIABILITY OF PB-FREE SOLDER JOINTS IN AREA ARRAY PACKAGES Brian Toleno, Tom White, Rong Zhang, and Jeff Bowin  Abstract
THERMO-MECHANICAL SIMULATION AND OPTIMIZATION ANALYSIS FOR WARPAGE-INDUCED PBGA SOLDER JOINT FAILURES Caiying He, Ph.D. and Zuyao Liu, et al.  Abstract
IMBEDDED COMPONENT/DIE TECHNOLOGY (IC/DT®): IS IT READY FOR MAIN STREAM DESIGN APPLICATIONS? Casey H. Cooper, Mark T. McMeen, and Jim D. Raby  Abstract
MERGER AND ACQUISITION OPPORTUNITIES IN THE SOLAR ENERGY MARKET Chaim Lubin  Abstract
JOINT PROPERTIES OF Sn-3.5Ag SOLDER BALLS WITH SURFACE EMBEDDED CARBON NANOTUBE Chang-Woo Lee, Young-Ki Ko, Jung-Hwan Bang, and Sehoon Yoo  Abstract
CHALLENGES OF SOLDER BUMPING CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCER (cMUT) TRENCHED DEVICES Charles G. Woychik, et al.  Abstract
PACKAGING HIGH DENSITY CAPACTIVE MICRO-MACHINED ULTRASONIC TRANSDUCER (cMUT) SENSOR ARRAYS USING HYPERBGA TECHNOLOGY Charles G. Woychik, et al.  Abstract
THE COMING Charles S. Leech Jr.  Abstract
IMPLEMENTATION AND RELIABILITY ISSUES WITH LEAD-FREE SOLDERS Christopher Hunt  Abstract
LOW-SILVER BGA ASSEMBLY PHASE II – REFLOW CONSIDERATIONS AND JOINT HOMOGENEITY FOURTH REPORT: SENSITIVITY TO PROCESS VARIATIONS Chrys Shea, et al.  Abstract
OPTIMISING THE PRINT PROCESS FOR MIXED TECHNOLOGY Clive Ashmore, Mark Whitmore, and Simon Clasper  Abstract
DOES COPPER DISSOLUTION IMPACT THROUGH-HOLE SOLDER JOINT RELIABILITY? Craig Hamilton, et al.  Abstract
AN INDUSTRY UNITED TO FIGHT COUNTERFEITING. A COUNTERFEIT EEE PARTS SOLUTION Daniel DiMase and Phillip Zulueta  Abstract
ENVIRONMENTAL CHALLENGES TO CONVENTIONAL PTH METALLIZATION - A TIME FOR CHANGE? David H. Ormerod  Abstract
FALSE TIN WHISKERS: MASQUERADING TIN COPPER INTERMETALLICS David Hillman  Abstract
VIA RELIABILITY – A HOLISTIC PROCESS APPROACH David L. Wolf, Timothy A. Estes, and Ronald J. Rhodes  Abstract
EVALUATION OF HALOGEN-FREE LAMINATES USED IN HANDHELD ELECTRONICS David Lau, Laura J. Turbini, Julie Liu, and Y. Norman Zhou  Abstract
UNUSUAL CURE MECHANISMS OF THERMOSET EPOXY RESINS David R. Tyler, Sarah E. Brady, Indre Thiel, and Robert L. Hubbard  Abstract
FRACTURE TOUGHNESS OF VARIOUS PRINTED CIRCUIT BOARD SURFACE FINISHES SOLDERED WITH LEAD FREE SOLDER Dick Casali  Abstract
LATEST DEVELOPMENTS IN BUMPING TECHNOLOGIES FOR FLIP CHIP AND WLCSP PACKAGING Dionysios Manessis and Lars Böttcher,et al.  Abstract
STRENGTHENING YOUR DOWNSIZED DESIGN TEAMS THROUGH A STRONG PROTOTYPE PARTNER Duane Benson  Abstract
HEAD–AND–PILLOW SMT FAILURE MODES Dudi Amir, Raiyo Aspandiar, Scott Buttars, Wei Wei Chin, and Paramjeet Gill  Abstract
BEST PRACTICES REFLOW PROFILING FOR LEAD-FREE SMT ASSEMBLY Ed Briggs and Ron Lasky, Ph.D., PE  Abstract
THE PROLIFERATION OF LEAD-FREE ALLOYS Eric Bastow and Timothy Jensen  Abstract
AN IMMERSION SILVER PWB SURFACE FINISH TO COMBAT HARSH ENVIRONMENTS Ernest Long, Ph.D., John Swanson, and Lenora Toscano  Abstract
NEW SOLDER BUMPING TECHNOLOGY AND ADAPTED ASSEMBLY PROCESSES FOR 100 µm PITCH FLIP-CHIP-TECHNOLOGY USING CAPILLARY FLOW OR NO FLOW UNDERFILL Florian Schüßler, et al.  Abstract
INTRODUCTION OF A NEW PCB SURFACE FINISH FOR THE ELECTRONICS INDUSTRY Frank Ferdinandi  Abstract
CHARACTERIZING THE RELATIONSHIPS BETWEEN A SOLDER PASTE'S INGREDIENTS AND ITS PERFORMANCE ON THE ASSEMBLY LINE: HEAD-IN-PILLOW TESTING Frank Murch, Derrick Moyer, Krupali Patel, John McMaster, Steve Ratner, and Martin Lopez  Abstract
SUSTAINING A ROBUST FINE FEATURE PRINTING PROCESS George Babka, David Sbiroli, Chris Anglin and Richard Brooks  Abstract
RoHS – CHANGING PRODUCTS TO CONFORM TO THE NEW EUROPEAN UNION RoHS REGULATIONS George Galyon, et al.  Abstract
OVERCOMING REPAIR DEPOT CHALLENGES Greg Bannick  Abstract
iNEMI LEAD-FREE ALLOY ALTERNATIVES PROJECT REPORT: THERMAL FATIGUE EXPERIMENTS AND ALLOY TEST REQUIREMENTS Gregory Henshall, Ph.D., et al.  Abstract
EVALUATION OF EPOXIDE CONDUCTIVE ADHESIVES CONTAINING GRAPHITE NANO PLATELETS FILLERS Guilian Gao, Ph.D., et al.  Abstract
Pb-FREE ALLOY ALTERNATIVES: RELIABILITY INVESTIGATION H.-J. Albrecht, P. Frühauf, and K. Wilke  Abstract
REAL OR FAKE? THE COUNTERFEIT CHIP CONUNDRUM Hal Rotchadl  Abstract
BRIDGING SUPPLY CHAIN GAP FOR EXEMPT HIGH-RELIABILITY OEMs Hal Rotchadl  Abstract
THE DEVELOPMENT AND IMPLEMENTATION OF AN IMPROVED IMMERSION TIN PLATING PROCESS TIN-LEAD AND LEAD-FREE SOLDERING Hank Lajoie  Abstract
WHY SWITCH FROM PURE DI-WATER TO CHEMISTRY? Harald Wack, Ph.D., Umut Tosun, Joachim Becht Ph.D., and Helmut Schweigart, Ph.D.  Abstract
ASSEMBLY AND RELIABILITY ASSESSMENT OF FINE PITCH TMV PACKAGE ON PACKAGE (PoP) COMPONENTS Heather McCormick, Lee Smith, Jimmy Chow, Ahmer Syed, Corey Reichman and CJ Berry  Abstract
RELIABILITY ASSESSMENT OF REBALLED BGAs J. Li, et al.  Abstract
DESIGN AND PROCESS DEVELOPMENT FOR THE ASSEMBLY OF 01005 PASSIVE COMPONENTS J. Li, S. Poranki, R. Gallardo, M. Abtew, R. Kinyanjui, Ph.D., and K. Srihari, Ph.D.  Abstract
THE SOLDER JOINT RELIABILITY OF CONFORMAL COATED WLCSP COMPONENTS J. Salminen  Abstract
RoHS VS. REACH WHAT DOES THIS MEAN TO I/T HARDWARE COMPANIES AND DATA MANAGEMENT? Jackie Adams, et al.  Abstract
STRATEGIES FOR FIGHTING COUNTERFEIT ELECTRONICS PRODUCTS James R. Williams, Ph.D.  Abstract
INVESTIGATION AND DEVELOPMENT OF TIN-LEAD AND LEAD-FREE SOLDER PASTES TO REDUCE THE HEAD-IN-PILLOW COMPONENT SOLDERING DEFECT Jasbir Bath and Roberto Garcia, et al.  Abstract
CLOSED-FORM, STRAIN-ENERGY BASED ACCELERATION FACTORS FOR THERMAL CYCLING OF LEAD-FREE ASSEMBLIES Jean-Paul Clech, Gregory Henshall and Jian Miremadi  Abstract
SOLDER CHARGE SMT: THE DESIGN AND VALIDATION OF NEW SOLDER ATTACH TECHNOLOGIES Jim Hines, Kirk Peloza, Adam Stanczak and David Geiger  Abstract
NEXT GENERATION PoP PASTES FOR ELECTRONICS ASSEMBLY Jim Hisert and Brandon Judd  Abstract
THIN IMMERSION TIN USING ORGANIC METALS Jim Kenny, Nils Arendt, Bernhard Wessling, and Karl Wengenroth  Abstract
IN-PLACE TRACKING FOR TIN WHISKERS AND TIN DEPLETED AREAS AT DIFFERENT STRESS STATUS Jing Cheng, Ph.D. and Paul T. Vianco, Ph.D.  Abstract
TOMBSTONE CAPACITORS REVISITED, NOW DO WE NEED A PSL (PLATING SENSITIVITY LEVEL) SPECIFICATION FOR CHIP COMPONENTS John Maxwell and Chris England  Abstract
RAPID COMPANY TRANSFORMATION: LESSONS LEARNED IN REAL TIME John Walsh, Brian Maguire, and Steve Puente  Abstract
ALTERNATIVE ASSEMBLY OPTIONS TO ACHIEVE COST EFFECTIVE AND RELIABLE HANDHELD PRODUCTS Jonas Sjoberg and Andreas Morr  Abstract
INSPECTION TO IMPROVE LEAD-FREE SOLDER TECHNOLOGIES Kazuo Kawai  Abstract
ELECTROLESS Ni/ELECTROLESS Pd/IMMERSION Au/ELECTROLESS Au (ENEPIGEG) PLATING PROCESS FOR GOLD WIRE BONDING ON ORGANIC PACKAGE SUBSTRATES Kiyoshi Hasegawa, Yoshinori Ejiri, Takehisa Sakurai, and Yosiaki Tsubomatsu  Abstract
INNOVATIVE PACKAGE REALIZATION BY CHIP EMBEDDING TECHNOLOGIES Lars Boettcher, Dionysios Manessis, Stefan Karaszkiewicz, Andreas Ostmann, and Herbert Reichl  Abstract
ASSESSING RELIABILITY OF REBALLED BALL GRID ARRAY ASSEMBLIES UNDER TEMPERATURE CYCLING TEST Lei Nie, Michael Osterman, and Michael Pecht  Abstract
ON THE COMPLETE BREAKDOWN OF MINER'S RULE FOR LEAD FREE BGA JOINTS Linlin Yang, et al.  Abstract
A COMPARISON OF ELECTROLESS AND ELECTROPLATED Ni/Au UBM STRUCTURES FOR BOARD LEVEL RELIABILITY OF WLCSP DEVICES Luke England  Abstract
SOLDER JOINT RELIABILITY ANALYSIS AND TESTING OF A DUAL ROW QFN PACKAGE Luke England and Yong Liu  Abstract
EUROPEAN UNION RoHS EXEMPTION REVIEW CASE STUDY Marie Cole, et al.  Abstract
THROUGH-HOLE CONNECTOR REWORK USING CONVECTION HEATING Mark J. Walz and Michael Berry  Abstract
AWAKENING FROM HEAD-IN-PILLOW: A NOVEL PRE-PRODUCTION TEST METHOD FOR BGA NON-WET ISSUES Masato Shimamura, Tetsuya Okuno, Satoru Akita, and Derek Daily  Abstract
PROCESSING AND RELIABILITY OF LOW-SILVER-ALLOYS Mathias Nowottnick, Andrej Novikov and Joerg Trodler  Abstract
LEAD-FREE ASSEMBLY AND QUALIFICATION OF A STORAGE CLASS PCBA Matthew Kelly and Tom Truman, et al.  Abstract
SURFACE FINISH EFFECT ON RELIABILITY OF LEAD FREE ELECTRONIC ASSEMBLIES Michael Reid, Maurice N. Collins, Richard Coyle, and Jeff Punch  Abstract
STENCIL DESIGN GUIDELINES FOR ROBUST PRINTING PROCESSES IN ELECTRONICS PRODUCTION CONSIDERING STENCIL AND SOLDER PASTE SPECIFIC PROPERTIES Michael Roesch and Joerg Franke  Abstract
CLEANING FOR RELIABIILTY POST QFN REWORK Mike Bixenman, D. B. A. and Michael Konrad  Abstract
IONIC CLEANLINESS TESTING RESEARCH OF PRINTED WIRING BOARDS FOR PURPOSES OF PROCESS CONTROL Mike Bixenman, D.B.A., Ning-Chen Lee, Ph.D., and Steve Stach  Abstract
HALOGENS IN LEAD FREE SOLDER PASTE Mitch Holtzer and Michael Liberatore  Abstract
QUALIFICATION OF PWBs OUTSOURCED FROM ASIA Mumtaz Y. Bora  Abstract
NANOTECHNOLOGY FOR LEAD-FREE PWB FINAL FINISHES WITH THE ORGANIC METAL N. Arendt, B. Wessling, M. Thun, C. Arribas-Sanchez, S. Gleeson, J. Posdorfer, M. Rischka, and B. Zeysing  Abstract
FINE-PITCH QFN REWORK Neil O'Brien and Scott Kentner  Abstract
EFFECT OF STRUCTURAL DESIGN PARAMETERS ON WAFER LEVEL CSP BALL SHEAR STRENGTH: EXPERIMENTAL AND COMPUTATIONAL Nikhil Lakhkar and Dereje Agonafer  Abstract
LEAD-FREE FLUX TECHNOLOGY AND INFLUENCE ON CLEANING Ning-Cheng Lee, Ph.D.  Abstract
ON THERMAL PERFORMANCE OF A PLANAR MAGNETIC TRANSFORMER P. Razi, Ph.D. and Bob Roohparvar, Ph.D.  Abstract
THERMAL INTERFACE MATERIALS TESTING Paul Bratt  Abstract
ASSESSING DESIGN TRADEOFFS WITH A CUSTOMIZABLE AREA-ARRAY CONNECTOR Paul Chen, Dinesh Kalakkad, Ken Matsubayashi, Woody Maynard, and John Williams  Abstract
AUTOMATIC SOLDER PASTE PRINTER POSTIONAL FEEDBACK CONTROL Paul Haugen and Rita Mohanty, Ph.D.  Abstract
REWORKING THE LATEST HIGH TECHNOLOGY SMT PACKAGES: FUSIONQUAD™ PACK Paul Wood and Bill Rugg  Abstract
EFFECT OF DWELL TIME ON THE LIFE OF LEAD FREE BGA JOINTS IN THERMAL CYCLING Peter Borgesen, Emad Al-Momani and Michael Meilunas  Abstract
MODELS FOR PREDICTION OF SHOCK RELIABILITY FOR LEADFREE AREA-ARRAY COMPONENTS IN PORTABLE ELECTRONICS Pradeep Lall, et al.  Abstract
CONDUCTIVE ANODIC FILAMENT STUDY: LAMINATES AND Pb-FREE PROCESSING Randal L. Ternes  Abstract
SECOND GENERATION Pb-FREE ALLOYS Randy Schueller, Ph.D., Nathan Blattau, Ph.D., Joelle Arnold, and Craig Hillman, Ph.D.  Abstract
EFFECTS OF AN APPROPRIATE PCB LAYOUT AND SOLDERING NOZZLE DESIGN ON QUALITY AND COST STRUCTURE IN SELECTIVE SOLDERING PROCESSES Reiner Zoch and Christian Ott  Abstract
THERMAL FATIGUE PERFORMANCE OF A QUAD FLAT NO LEAD (QFN) PACKAGE ASSEMBLED WITH Sn-Ag-Cu (SAC) AND SnPb SOLDERS Richard Coyle and Heather McCormick, et al.  Abstract
DWELL TIME, MICROSTRUCTURAL DEPENDENCIES, AND THE INTERPRETATION OF THERMAL FATIGUE TEST DATA OF SnPb AND Pb-FREE SOLDERS Richard Coyle1, et al.  Abstract
QFN MANUFACTURING: CONFIGURATIONS, MATERIALS AND PROCESSES Richard Otte  Abstract
ADVANCES IN BROADBAND PRINTING Rita Mohanty, Ph.D. and Rick Love  Abstract
RECENT ADVANCES IN THE TECHNOLOGY OF CONTAMINANT ANALYSIS USING ENERGY DISPERSIVE X-RAY FLUORESCENCE Robert D. Johnson and Jun Seok Choi  Abstract
BOARD LEVEL RELIABILITY COMPARISON OF LEAD FREE ALLOYS Robert Darveaux, et al.  Abstract
WARPAGE REDUCTION FOR FLIP-CHIP UNDER-FILL ASSEMBLIES Robert L. Hubbard and Pierino Zappella  Abstract
COMPARISONS OF SAC FLIP CHIP BGA SOLDER JOINT RELIABILITY UNDER ACCELERATED TEMPERATURE CYCLING AND POWER CYCLING CONDITIONS Ron Zhang, Chirag Shah, and Stanley Pecavar  Abstract
DOCUMENTING FABRICATION FOR PCB SOURCING SUCCESS Russ Steiner  Abstract
PREVENTING DAMAGE TO MSD'S AND BARE BOARDS BEFORE AND DURING THE ASSEMBLY PROCESS THROUGH PROPER HANDLING AND STORAGE Russell McCarten, Kevin McCarten, and Jack Leonard  Abstract
NO-FLOW UNDERFILL VOID NUCLEATION STUDY IN HIGH, STABLE YIELD, AND NEAR VOID-FREE ASSEMBLY PROCESS DEVELOPMENT Sangil Lee and Daniel F. Baldwin, Ph.D.  Abstract
MONTE CARLO SIMULATION FOR SURFACE MOUNT ASSEMBLY HEAD AND PILLOW DEFECT PREDICTION Shijiang He, Gregorio Murtagian, Ph.D., and Fay Hua, Ph.D.  Abstract
iNEMI SOLDER PASTE DEPOSITION PROJECT – FIRST STAGE REVIEW OPTIMIZING SOLDER PASTE PRINTING FOR LARGE AND SMALL COMPONENTS Shoukai Zhang, et al.  Abstract
SCREENING FOR COUNTERFEIT ELECTRONIC COMPONENTS Stephen Schoppe, Glenn Robertson, and Fabian Morales  Abstract
HEAD-AND-PILLOW DEFECTS IN BGA SOCKETS Steve Vandervoort, Dudi Amir, Raiyo Aspandiara, Fay Hua, Bin Li, Gregorio Murtagian, and Rajen S. Sidhu  Abstract
HOW SANMINA-SCI DETERMINED ITS ALTERNATIVE ENERGIES STRATEGY Sundar M. Kamath, Ph.D.  Abstract
ADHESION STUDY OF NANO-PARTICLE SILVER TO ELECTRONICS PACKAGING MATERIALS Sungchul Joo and Daniel F. Baldwin, Ph.D.  Abstract
DEVELOPING A ROBUST OFFSHORE PROGRAM MANAGEMENT MODEL Susan Mucha  Abstract
THE SMALLER THE BETTER - SIMULTANEOUS ELECTROLYTIC SOLDER DEPOSITION ON BOTH SIDES OF A FINE-PITCH PACKAGE SUBSTRATE Sven Lamprecht, Hugh Roberts, Shozo Nishida, Fumio Aiki, Bernd Roelfs, Ph.D., Steven Kenny, and Kai-Jens Matejat  Abstract
JCAA/JG-PP LEAD-FREE SOLDER PROJECT: -20°C TO +80°C THERMAL CYCLE TEST Thomas A. Woodrow, Ph.D.  Abstract
ASSESSMENT OF WHISKER GROWTH FROM TIN COATED WIRE AND CABLE Thomas Lesniewski  Abstract
PRINTED CIRCUIT BOARD TECHNOLOGIES FOR THE REALIZATION OF STRETCHABLE ELECTRONIC SYSTEMS Thomas Löher, Ph.D., Manuel Seckel, Rene Vieroth, Andreas Ostmann and Herbert Reichl, Ph.D.  Abstract
DEVELOPING THE OPTIMUM REFLOW PROCESS: A MATTER OF COST AND QUALITY Ursula Marquez de Tino, Jon Silin, and Denis Barbini  Abstract
NOZZLE TECHNOLOGY FOR LEAD FREE SELECTIVE SOLDERING Ursula Marquez de Tino, Linlin Yang and Denis Barbini  Abstract
CONTROLLING THE ASSEMBLY PROCESS WITH THE USE OF SPC William Beair, Alton Moore, and Eric Gilley  Abstract
STENCIL CONSIDERATIONS FOR MINIATURE COMPONENTS William E. Coleman, Ph.D.  Abstract
SEALING THE GAP OF SOLDER PASTE TECHNOLOGY IN LEAD-FREE HALOGEN-FREE ERA Yan Liu, Ph.D., Runsheng Mao, Ph.D., Arnab Dasgupta, Ph.D., and Ning-Cheng Lee, Ph.D.  Abstract
ELECTROLESS Ni/Pd/Au PLATING FOR PACKAGE SUBSTRATES WITH FINE PITCH WIRING Yoshinori Ejiri, Takehisa Sakurai, Shuuichi Hatakeyama, Shigeharu Arike, and Kiyoshi Hasegawa  Abstract
PAD CRATER ASSESSMENT FOR A TELECOM SYSTEM PCBA Yunxia Xu, et al.  Abstract
HOW TO RESOLVE DEFECTS RELATED TO PAD DESIGN WITH THE AID OF NON-DESTRUCTIVE (X-RAY, SPI) AND DESTRUCTIVE METHODS (CROSS SECTION, SHEAR TEST) Zhen (Jane) Feng, Ph.D., et al.  Abstract
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