SMTA China East Technical Conference 2008 Proceedings

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TITLE AUTHOR
HALOGEN-FREE DEBATE ON SOLDERPASTE: IPC CLASSIFICATION AND APPLICATION Christine Poon, Audrey Long, James Wang  Abstract
HALOGEN-FREE DEBATE ON SOLDERPASTE: IPC CLASSIFICATION AND APPLICATION (CHINESE) Christine Poon, Audrey Long, James Wang  Abstract
RELIABILITY IMPACT OF COPPER-DOPED EUTECTIC TIN-LEAD BUMP AND ITS VOIDING UPON FLIP CHIP ASSEMBLIES David Ihms and Shing Yeh  Abstract
RELIABILITY IMPACT OF COPPER-DOPED EUTECTIC TIN-LEAD BUMP AND ITS VOIDING UPON FLIP CHIP ASSEMBLIES (CHINESE) David Ihms and Shing Yeh  Abstract
A Compliant and Creep Resistant SAC-Al(Ni) Alloy Dr. Benlih Huang, Dr. Hong-Sik Hwang, and Dr. Ning-Cheng Lee  Abstract
FUTURE LEAD-FREE SOLDER ALLOYS AND FLUXES – MEETING CHALLENGES OF MINIATURIZATION Dr. Ning-Cheng Lee  Abstract
Is it Really Impossible? Combining Superior Anti-Oxidation and Superior Print Dr. Ning-Cheng Lee  Abstract
EFFECT OF PROCESS VARIATIONS ON SOLDER JOINT RELIABILITY FOR NICKEL-BASED SURFACE FINISHES Hugh Roberts and Sven Lamprecht, et al.  Abstract
THE STUDY ON THE INTERFACIAL REACTION BETWEEN SNAGCU SOLDER AND NI(P)/AU, NI(P)/PD/AU UBMS Jui-Yun Tsai, Josef Gaida, Gerhard Steinberger and Albrecht Uhlig  Abstract
THE STUDY ON THE INTERFACIAL REACTION BETWEEN SNAGCU SOLDER AND NI(P)/AU, NI(P)/PD/AU UBMS (CHINESE) Jui-Yun Tsai, Josef Gaida, Gerhard Steinberger and Albrecht Uhlig  Abstract
Solder Micro-Bumping for 3D SiP and FlipChip Extended Abstract Klaus Ruhmer and David Hawken, et al.  Abstract
SMT BALLING TECHNOLOGY (CHINESE) May Yan, R SIVAM V RAJOO  Abstract
DEFECT STRUCTURE AND FAILURE MECHANISM OF PTH ELECTRODEPOSITS Tu Yunhua, Liu Sang, Sun Xiaoyan, Ju Yuandao  Abstract
DEFECT STRUCTURE AND FAILURE MECHANISM OF PTH ELECTRODEPOSITS (CHINESE) Tu Yunhua, Liu Sang, Sun Xiaoyan, Ju Yuandao  Abstract
MANAGING ELECTRONICS MANAUFACTURING BUSINESS IN CHINA Wei Koh, PhD, BraveWang  Abstract
MANAGING ELECTRONICS MANAUFACTURING BUSINESS IN CHINA (CHINESE) Wei Koh, PhD, BraveWang  Abstract
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