Pan Pacific Symposium 2009 Proceedings

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TITLE AUTHOR
APPLICATION OF REVERSE LOGISTICS TO FAILURE ANALYSIS OF ELECTRONIC PRODUCTS A. Gandelli and A. Caliri  Abstract
JETTING FLUIDS IN A WIDE VARIETY OF NEW ELECTRONIC AND SEMICONDUCTOR NON-TRADITIONAL PACKAGING AND ASSEMBLY APPLICATIONS Alec J. Babiarz  Abstract
A NOVEL MULTI-LAYER PATCH CONFIGURATION FOR MULTI-BAND REFLECTARRAY ANTENNAS Andrea Pirisi, et al.  Abstract
COLUMN GRID ARRAY REWORK FOR HIGH RELIABILITY Atul C. Mehta and Charles C. Bodie  Abstract
RESOLUTION OF SOLDER VOIDS IN PIN-IN-HOLE PRODUCT Condia Yu, et al.  Abstract
HEAVY THERMAL LOAD PB-FREE WAVE SOLDERING – GETTING TOP HOLE FILLETS WITH +3 OZ. COPPER PLANES Corey Peterson and Jeff Kennedy  Abstract
RELIABILITY ASSESSMENT OF ALTERNATIVE LEAD-FREE ALLOYS USED DURING WAVE AND REWORK Craig Hamilton, et al.  Abstract
ON THE USE OF 3 THERMOCOUPLES TO VERIFY A PRINTED CIRCUIT BOARD PROFILE DURING THE REFLOW OPERATION Daryl L. Santos, Arun Ramasubramanian, and Laurence A. Harvilchuck  Abstract
A HYBRID APPROACH FOR ENERGY OPTIMIZATION OF WIRELESS SENSOR NETWORK DEVICES Davide Caputo, et al.  Abstract
QUALITY ASSURANCE OF STACKED COMPONENTS USING QUICKSCAN Friedhelm W. Maur  Abstract
PLANNING AND IMPLEMENTING A SUCCESSFUL BOX BUILD, A PROCESS FMEA IMPLEMENTATION Haans Petruschke and Roy Starks  Abstract
ELECTROSTATIC DISCHARGE (ESD) AND THE REQUIREMENTS FOR PERSONNEL AND MACHINES Hartmut Berndt  Abstract
AREA ARRAY CONNNECTORS: TRANSITION TO LEAD-FREE Heather McCormick, et al.  Abstract
PoP (PACKAGE ON PACKAGE): AN EMS PERSPECTIVE ON ASSEMBLY, REWORK AND RELIABILITY Heather McCormick, et al.  Abstract
DEVELOPMENT AND CHARACTERISATION OF METAL COATED POLYMER BALLS FOR CSP APPLICATION Helge Kristiansen, et al.  Abstract
DEVELOPMENT OF LOW MODULUS CONDUCTIVE ADHESIVES FOR MEMS INTERCONNECTS Helge Kristiansen, et al.  Abstract
A NOVEL FLEXIBLE SILVER PASTE ENABLES THIN FILM PHOTOVOLTAIC FLEX SOLAR CELLS Hong-Sik Hwang, Ph.D., Lee Kresge, James Slattery, and Ning-Cheng Lee, Ph.D.  Abstract
PERFORMANCE EVALUATIONS OF SURFACE FINISH AND SOLDER ALLOY CONFIGURATIONS FOR BGA SOLDER JOINT RELIABILITY Hugh Roberts, et al.  Abstract
PERFORMANCE COMPARISON OF ADVANCED SUBSTRATE TECHNOLOGIES FOR HIGH SPEED NETWORKING APPLICATIONS John Savic, et al.  Abstract
STUDY OF APPLICATION AND RELIABILITY OF LOW MELTING POINT Sn-Zn-Bi-In-P SYSTEM LEAD-FREE ALLOYS Jusheng Ma  Abstract
SAW SINGULATION OPTIMIZATION FOR THIN MOLD-LESS PACKAGE APPLICATION IN SMT ENVIRONMENT Jusszuraini Bin Hashim, Osman Ahmad, and Teng Hoon Ng  Abstract
THE EFFECT OF VARIATIONS IN THE SILVER LEVEL AND MICROALLOYING ON THE IMPACT STRENGTH OF TIN-SILVER-COPPER BGA SPHERES Keith Sweatman, Shoichi Suenaga, Masuo Koshi, and Tetsuro Nishimura  Abstract
STUDIES ON SOLDER ELECTOMIGRATION IN LEAD-FREE FLIP CHIP JOINT SYSTEM Kimihiro Yamanaka, Takafumi Ooyoshi, Takayuki Nejime, and Yutaka Tsukada  Abstract
DATA STORAGE SYSTEM DESIGN: BEST PRACTICES FOR INDUSTRY (FOCUSING ON RoHS-TYPE LEGISLATION) Krista Botsford  Abstract
ECO-COMPLIANCE: WHAT, WHEN, & WHY FOCUSING ON EUROPEAN UNION AND CHINA Krista Botsford  Abstract
IMPACT OF PCB PAD SITE DRESS METHODS ON PAD ARRAY DAMAGE Laurence A. Harvilchuck, et al.  Abstract
COUNTERFEIT ELECTRONICS: THREATS, RISKS AND PREVENTION PRACTICES Lev Shapiro, M.Sc. E.E.  Abstract
3D INTEGRATION – FUTURE PERSPECTIVES M. Juergen Wolf, Peter Ramm, and Herbert Reichl  Abstract
3D-LSI TECHNOLOGY FOR THE IMAGE SENSOR DEVICES Makoto Motoyoshi, Hirofumi Nakamura, and Manabu Bonkohara  Abstract
STRAIN GAGE TESTING: THE DELTA EFFECT OF THERMAL CYCLE TESTING Mark T. McMeen  Abstract
LEAD-FREE ASSEMBLY OF SERVER CLASS PCBAs: QUALIFICATION TRIAL RESULTS Matthew Kelly, Marie Cole, Jim Wilcox, and David Braun  Abstract
PROGNOSTICS-BASED PRODUCT QUALIFICATION Michael Pecht and Jie Gu  Abstract
LEADING THE GLOBALLY INTEGRATED ELECTRONIC ASSEMBLY ORGANIZATION Mike Bixenman, DBA  Abstract
THE ULTIMATE ADHESION ENHANCEMENT PROCESS FOR MSL IMPROVEMENT Olaf Kurtz, et al.  Abstract
IMPLEMENTATION OF 01005s: A CASE STUDY Paul N. Houston, Gary L. Turpin, and Daniel F. Baldwin, Ph.D.  Abstract
COST EFFECTIVE COPPER iTSV INTEGRATION Paul Siblerud  Abstract
EFFECTS OF STORAGE PROCEDURES AND BAKE OUT ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, et al.  Abstract
HIGH PERFORMANCE THERMAL INTERFACE MATERIALS AND RELIABILITY IN ELECTRONIC ASSEMBLY Radesh Jewram  Abstract
SYSTEM-ON-WAFER BY 3D ALL SILICON SYSTEMS TECHNOLOGY Rao Tummala, et al.  Abstract
DOE FOR PROCESS VALIDATION INVOLVING NUMEROUS ASSEMBLY MATERIALS AND TEST METHODS Renee Michalkiewicz, Gaylon Morris, and Simin Bagheri  Abstract
NEXT LEVEL REQUIREMENTS FOR ULTRA FINE PITCH PRINTING Richard Brooks, John Carr, and Marty Carr  Abstract
ADVANCED ELECTRODEPOSITION TECHNOLOGIES FOR 3D INTEGRATION Rozalia Beica and Paul Siblerud  Abstract
SOLDER JOINT MICROSTRUCTURE AND RELIABILITY STUDY OF PLASTIC BALL GRID ARRAY (PBGA196) AND MICRO LEAD FRAME (MLF20) COMPONENTS IN LEAD FREE PROCESSES S. Bagheri, et al.  Abstract
QUALITY AND RELIABILITY TESTING OF CIRCUIT BOARDS ASSEMBLED WITH LEAD FREE COMPONENTS, FINISHES, SOLDERING MATERIALS AND PROCESSES IN SIMULATED PRODUCTION CONDITIONS Sammy Shina, Ph.D., et al.  Abstract
COPPER ELECTROPLATING PROCESS FOR NEXT GENERATION CORE THROUGH-VIA FILLING Stephen Kenny and Bernd Roelfs  Abstract
DEVELOPING A REFLOW PROCESS FOR Sn/Cu/Ni SOLDER PASTE Ursula Marquez de Tino, et al.  Abstract
WETTABLE VS. NON-WETTABLE NOZZLES FOR LEAD FREE SELECTIVE SOLDERING Ursula Marquez de Tino, Linlin Yang, and Denis Barbini  Abstract
SUPER HIGH DENSITY TWO METAL LAYER ULTRA-THIN ORGANIC SUBSTRATES FOR NEXT GENERATION SYSTEM-ON-PACKAGE (SOP), Venky Sundaram, et al.  Abstract
STUDY OF METHODS FOR ACCELERATING ELECTROCHEMICAL MIGRATION TEST Wataru Urano, et al.  Abstract
SOLID-STATE DRIVE (SSD) TECHNOLOGY AND MARKET TRENDS Wei Koh, Ph.D.  Abstract
TOWARDS THE DEVELOPMENT OF PHOTORESIST PROCESSING FOR CONTINUOUS ROLL-TO-ROLL FLEXIBLE ELECTRONICS Xiaozhe Hu, et al.  Abstract
SOCKET RELIABILITY OF HIGH-SPEED BGA PACKAGES Yu-Jung Huang, Ming-Kun Chen, and Shen-Li Fu  Abstract
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