International Conference on Soldering & Reliability 2008 Proceedings

While abstracts in the Knowledge Base are accessible to all visitors, the full articles (PDF format) are FREE FOR SMTA MEMBERS to download.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

< Back to Conferences List



TITLE AUTHOR
CHARACTERISTICS OF Sn-Ag-Cu-In QUATERNARY SOLDER COMPOSITIONS AND RELIABILITY EVALUATION OF THE SOLDER JOINTS A-Mi Yu, et al.  Abstract
THE CHEMICAL NATURE OF BROMIDE-CONTAINING CONDUCTIVE ANODIC FILAMENT A. Caputo, L.J. Turbini, and D.D. Perovic  Abstract
NANOSOLDER – WHAT NEXT? Alan Rae  Abstract
LEAD FREE MATERIAL AND PROCESS RE-QUALIFICATION FOR A RUGGED HANDHELD TERMINAL André Gagné and Dan Meringer  Abstract
ATTEMPTS TO CONSISTENTLY FORM VOIDS Bev Christian, Graeme Williams and Andrew Michael  Abstract
CORRELATION OF WETTING FORCES AND SOLDER SPREAD FOR CONDITIONED ENIG CIRCUIT BOARDS Bev Christian, Ph.D., and Matthew Stevens  Abstract
FINE POWDER SOLDER PASTES: STENCIL PRINTING AND REFLOW IN LEAD-FREE ASSEMBLY Chris Anglin, Ed Briggs, Tim Jensen, and Ron Lasky  Abstract
LOW-SILVER BGA ASSEMBLY PHASE I – REFLOW CONSIDERATIONS AND JOINT HOMOGENEITY - INITIAL REPORT Chrys Shea, et al.  Abstract
A STUDY OF THE PROCESS PERFORMANCE OF ALTERNATIVE LEAD FREE WAVE ALLOYS Craig Hamilton and Matthew Kelly  Abstract
SOLDER JOINT INTEGRITY IMPACT OF IMMERSION SILVER SURFACE FINISH THICKNESS FOR TIN/LEAD AND LEAD-FREE SOLDER PROCESSES David Hillman, Jon Soole, and Ross Wilcoxon  Abstract
LGA VS. CSP: A COMPARISON IN VARIOUS LEAD FREE APPLICATIONS Heather McCormick, et al.  Abstract
BROMINATED FLAME RETARDANT (BFR) AND POLYVINYL CHLORIDE (PVC) FREE MATERIAL EVALUATION REQUIREMENTS Helen Holder and Michael Roesch  Abstract
BUILDING A GLOBAL TECHNOLOGICALLY EFFICIENT SUPPLY CHAIN Jackie A. Adams, et al.  Abstract
Pb-Free Failure Analysis Case Studies – An EMS Perspective Jason Bragg  Abstract
RELATIONSHIP BETWEEN THE IMPACT STRENGTH AND MICROSTRUCTURE OF LEAD-FREE SOLDERS Keith Sweatman, et al.  Abstract
MICROSTRUCTURES RESULTING FROM THE USE OF SOLDER BALLS OF ONE COMPOSITION WITH PASTE OF A DIFFERENT COMPOSITION ON A COPPER SUBSTRATE L. Snugovsky, et al.  Abstract
SOLDER-DIRECTED SELF-ASSEMBLY BY DIFFERENT-MELTING-POINTS AND CAPILLARY FORCES FOR HIGHLY-INTEGRATED MICROELECTRONICS/MEMS SYSTEMS Mei Liu and Jun Yang  Abstract
QUANTIFYING CLEANING RELEVANCE WHEN MANUFACTURING LEAD-FREE PRINTED CIRCUIT BOARD ASSEMBLIES Mike Bixenman, DBA  Abstract
A COMPARATIVE RELIABILITY STUDY OF MICROECLECTRONICS WITH RESPECT TO HALT AND VIBRATION Mustafa A. Naviwala and Jacob Kremer  Abstract
TWO METHODS OF EVALUATING A PRINTED WIRING BOARD'S DIELECTRIC PERFORMANCE IN A LEAD FREE ASSEMBLY ENVIRONMENT Paul Reid  Abstract
WHISKER GROWTH ON SAC SOLDER JOINTS: MICROSTRUCTURE ANALYSIS Polina Snugovsky, Zohreh Bagheri, and Marianne Romansky  Abstract
ANALYZING AND PREDICTING ELECTROCHEMICAL MIGRATION FAILURES ON FIELD FAILURE RETURNS Renee J. Michalkiewicz  Abstract
PIN TRANSFERABILITY TESTING OF DIPPABLE SOLDER PASTE FORMULATIONS Rick Lathrop  Abstract
SOLDER JOINT RELIABILITY OF DIFFERENT BGAs REWORKED USING LOW MELTING POINT LEAD FREE ALLOYS Simin Bagheri, et al.  Abstract
FRACTURE BEHAVIOR OF A LEAD-FREE SOLDER/Cu JOINT SYSTEM Siva P. V. Nadimpalli and Jan K. Spelt  Abstract
ANOTHER LOOK AT LEAD-FREE SOLDER JOINT RELIABILITY UNDER RANDOM VIBRATION Stephen Bracht, Aghavni Ball, and Lisa Salerno  Abstract
METHOD FOR AUTOMATED NONDESTRUCTIVE ANALYSIS OF FLIP CHIP UNDERFILL Steven R. Martell, Ameya Mandlik, and Kieren Mercer  Abstract
Pb-Free Alloy Proliferation Project Thilo Sack  Abstract
IMPACT OF SOLDERING ATMOSPHERE ON SOLDER JOINT FORMATION Ursula Marquez de Tino, et al.  Abstract
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819