Pan Pacific Symposium 2008 Proceedings

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TITLE AUTHOR
SHAPE ANALYSIS AND EFFICIENCY OF ARRAYS OF MICROSTRIP PATCH ANTENNAS FOR WIRELESS SENSOR NETWORKS A. Gandelli, D. Monopoli, A. Pirisi and R. E. Zich  Abstract
THERMAL MANAGEMENT OF DISK DRIVES USING SILICONE-FREE THERMAL INTERFACE MATERIALS Bill Rugg, Radesh Jewram and Sanjay Misra  Abstract
PROCESS AND ASSEMBLY METHODS FOR INCREASED YIELD OF PACKAGE ON PACKAGE DEVICES Brian Toleno, Ph.D. and Dan Maslyk  Abstract
RELIEVING Sn WHISKER GROWTH DRIVEN BY OXIDATION ON Cu LEADFRAME BY ANNEALING AND REFLOWING TREATMENTS C. C. Wei, et al.  Abstract
THE INFLUENCE OF THE PWB FABRICATION ELECTRODEPOSITION PROCESS ON COPPER EROSION DURING WAVE SOLDERING Chrys Shea and Jim Kenny, et al.  Abstract
A STUDY OF 0201’S AND TOMBSTONING IN LEAD-FREE SYSTEMS Chrys Shea and Prashant Chouta, et al.  Abstract
DESIGN AND OPTIMIZATION OF A MULTILAYER SHIELD OF DIELECTRIC D. Monopoli, M. Mussetta, A. Gandelli and R. Zich  Abstract
DEVELOPMENT STATUS OF AN OCCAM ELECTRONIC ASSEMBLY METHOD Edward S. Binkley, Ph. D. and Richard F. Otte  Abstract
EFFECTS OF STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF NICKEL-PALLADIUM-GOLD FINISH WITH Pb-BASED AND Pb-FREE SOLDERS Edwin Lopez, Paul Vianco, Samuel Lucero, and Carly George  Abstract
MARKET DRIVERS AND COST ANALYSIS FOR 3D TSV Eric Mounier, Ph.D., Jérôme Baron, and Jean-Christophe Eloy  Abstract
HDI VIA ARCHITECTURE EFFECT ON SIP DESIGN FLEXIBILITY AND CONSTRAINTS Happy Holden  Abstract
ELECTROSTATIC DISCHARGE (ESD) AND THE TECHNOLOGY ROADMAP TO 2020 Hartmut Berndt  Abstract
PACKAGING SUBSTRATE TECHNOLOGIES TREND IN JAPAN Henry H. Utsunomiya  Abstract
SILICONE-PHOSPHOR ENCAPSULATION FOR HIGH POWER WHITE LEDs Horatio Quinones, Brian Sawatzky, and Alec Babiarz  Abstract
EXPERIMENTAL APPROACH TO ANALYZE FAILURE SITE CONDITION IN FINAL TESTING OF BGA PACKAGE Hsiang-Chen Hsu, Ming-Kun Chen, Yu-Jung Huang, and Shen-Li Fu  Abstract
EFFECT OF PROCESS VARIATIONS ON SOLDER JOINT RELIABILITY FOR NICKEL-BASED SURFACE FINISHES Hugh Roberts and Sven Lamprecht, et al.  Abstract
SUB-10µm LINE/SPACE TECHNOLOGY ON ORGANIC SUBSTRATES FOR NEXT GENERATION SYSTEM-ON-PACKAGE (SOP) AND FLIP-CHIP PACKAGING Hugh Roberts and Venky Sundaram, et al.  Abstract
DEVELOPMENT OF ALGORITHM AND CALCULATION TOOL FOR VISCO-ELASTIC PACKAGE WARPAGE Ichiro Hirata, Ph. D.  Abstract
UPDATE ON THE EVALUATION OF STACKED DIE PACKAGES USING ACOUSTIC MICRO IMAGING Janet E. Semmens  Abstract
EVALUATING THE MANUFACTURABILITY AND OPERATIONAL COSTS FOR NEW CONFORMAL COATING PROCESSES Jason Keeping, P. Eng.  Abstract
SURFACE MOUNT ASSEMBLY CHALLENGES FOR HIGH DENSITY POP (PACKAGE-ON-PACKAGE) UTILIZING SOP (SOLDER-ON-PAD) TECHNOLOGY Joanna Kristine Wildhart and Moody Dreiza  Abstract
SOLDERLESS ASSEMBLY AND INTERCONNECTION OF ELECTRONIC PACKAGES Joseph Fjelstad  Abstract
ADVANCED DRAM Si AND PACKAGING TECHNOLOGY STATUS AND FUTURE DIRECTIONS Jung H. Yoon, Ph. D.  Abstract
A STUDY OF SOLDERING TIP LIFE ON LEAD-FREE ALLOYS Juthathip Fangkangwanwong, Jareerat Jintana, Jarinee Ketui, and Teng Hoon Ng  Abstract
STRENGTH OF LEAD-FREE BGA SPHERES IN HIGH SPEED LOADING Keith Sweatman, Shoichi Suenaga, and Tetsuro Nishimura  Abstract
MEMBRANE TYPE PRESSURE SENSITIVE SENSOR Kiwako Ohmori, et al.  Abstract
NOVEL WAFER LEVEL PACKAGES USING ANISOTROPIC CONDUCTIVE ADHESIVES (ACPs) AND NCPs FOR FLIP-CHIP ASSEMBLY ON ORGANIC SUBSTRATES Kyung-Wook Paik, Il Kim, Ho-Young Son, and Chang-Kyu Chung  Abstract
TECHNOLOGIES FOR 3D HETEROGENEOUS INTEGRATION M. Juergen Wolf, Peter Ramm, and Herbert Reichl  Abstract
VIBRATION SENSOR FOR WIRELESS CONDITION MONITORING Maaike M. V. Taklo, et al.  Abstract
DATA ANALYSIS APPROACH FOR SYSTEM RELIABILITY, DIAGNOSTICS AND PROGNOSTICS Michael Pecht and Sachin Kumar  Abstract
METHODOLOGY TO CHARACTERIZE PAD CRATERING UNDER BGA PADS IN PRINTED CIRCUIT BOARDS Mudasir Ahmad, David Senk, and Jennifer Burlingame  Abstract
LEAN MANUFACTURING - ITS IMPACT ON SUPPLY CHAIN Nick Misra  Abstract
A NOVEL NANO SMT APPROACH FOR WLSOP P. Markondeya Raj, Gopal Jha, Gaurav Mehrotra, Janagama Goud, Mahadevan Iyer and Rao Tummala  Abstract
COST EFFECTIVE COPPER TSV INTERCONNECT INTEGRATION Paul Siblerud  Abstract
IMPROVEMENTS TO THROUGH SILICON VIAS, OR TSVs Phil Marcoux  Abstract
ANALYZING AND PREDICTING ELECTROCHEMICAL MIGRATION FAILURES ON FIELD FAILURE RETURNS Renee J. Michalkiewicz  Abstract
BGA COPLANARITY REDUCTION DURING THE BALL ATTACH PROCESS Rick Lathrop  Abstract
ELECTRICAL AND THERMAL INTERFACE MATERIALS Rob Emery and Tanawan Chaowasakoo  Abstract
THE SCIENCE AND ENGINEERING WORKFORCE AND NATIONAL SECURITY Robert A. Kavetsky, et al.  Abstract
FULL METAL TIMs Ross Berntson  Abstract
EFFECT OF THICKNESS OF UNDER-BUMP-METALLIZATION ON THE ELECTROMIGRATION LIFETIME OF FLIP-CHIP SOLDER JOINTS S. W. Liang and Chih Chen  Abstract
PRECISION WAFER TO WAFER PACKAGING USING EUTECTIC METAL BONDING Shari Farrens, Ph.D.  Abstract
NEW METHODS FOR EVALUATING THE CLEANLINESS BENEATH LOW STANDOFF DEVICES Thomas M. Forsythe  Abstract
NOVEL LEADFRAME-BASED PACKAGE PROVIDES PERFORMANCE BOOST FOR HARD DISK DRIVE DATA TRANSFER PERFORMANCE Tim Olson and Bill Rugg  Abstract
LIFE-TEST STATISTICS FOR SMALL SAMPLE SIZES Tom Clifford  Abstract
EMBEDDED PASSIVES -- UNIFORMITY AND RELIABILITY Tom Clifford and Melissa Lau  Abstract
DEFECT STRUCTURE AND FAILURE MECHANISM OF PTH ELECTRODEPOSITS Tu Yunhua, Liu Sang, Sun Xiaoyan, and Ju Yuandao  Abstract
IMPACT OF SOLDERING ATMOSPHERE ON SOLDER JOINT FORMATION Ursula Marquez de Tino and Denis Barbini, et. al  Abstract
µPILR™ PACKAGE PLATFORM- A HIGHER DENSITY PACKAGE-ONPACKAGE INNOVATION FOR NEXT GENERATION ELECTRONICS Vern Solberg  Abstract
MANAGING ELECTRONICS MANUFACTURING BUSINESS IN CHINA Wei Koh, Ph. D.  Abstract
APPLY MES INTO PCBA MANUFACTURING SHOP FLOOR FOUNDATION OF ADVANCED PRODUCTION MODEL Zhu Jian and Ma Wei  Abstract
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