NEPCON Shanghai Proceedings

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TITLE AUTHOR
Through-Silicon-Via Copper Filling for 3D Chip Integration Bioh Kim and Michael Go  Abstract
DISPENSING PROCESSES FOR UNDERFILL OF PoP Brad Perkins, Alan Lewis, China Team Member  Abstract
DISPENSING PROCESSES FOR UNDERFILL OF PoP (CHINESE) Brad Perkins, Alan Lewis, China Team Member  Abstract
A UNIQUE PROCESS THAT ELIMINATES SOLDER DROSS Daniel (Baer) Feinberg, Keith Howell, Miles Lau, and Dr. Erik Severin  Abstract
THE CT REVOLUTION: HIGH-SPEED µ-FOCUS X-RAY COMPUTED TOMOGRAPHY FOR SEMICONDUCTOR AND SMT APPLICATIONS Dr. Jens Peter Steffen, Dr. Andreas Lechner  Abstract
China Alloy SnAgCuCe in Reflow Applications Dr. Yan Liu, Paul Bachorik, Geoffrey Beckwith, Lee Kresge, Matthew Long, William Manning, Dr. Runsheng Mao, Benjamin Nieman, and Dr. Ning-Cheng Lee  Abstract
Lead Free Solder Joints Reliability and Process Control (CHINESE) Freddie Chan  Abstract
Lead Free Solder Joints Reliability and Process Control Freddie Chan  Abstract
FACTORS AFFECTING VOIDING IN UNDERFILLED FLIP CHIP ASSEMBLIES (CHINESE) George Carson PhD and Maury Edwards  Abstract
FACTORS AFFECTING VOIDING IN UNDERFILLED FLIP CHIP ASSEMBLIES George Carson PhD and Maury Edwards  Abstract
The Study of Mini-wave Soldering Process in Lead Free Assembly Harvey Chang, Jay Huang, J.L. Ku, Ander Hsieh, Andrew Lee  Abstract
The Study of Mini-wave Soldering Process in Lead Free Assembly (CHINESE) Harvey Chang, Jay Huang, J.L. Ku, Ander Hsieh, Andrew Lee  Abstract
SOLDER-PASTE INSPECTION MACHINE - WHAT’S YOUR EXPECTATION? Jiang Xiaodong  Abstract
SOLDER-PASTE INSPECTION MACHINE - WHAT’S YOUR EXPECTATION? (CHINESE) Jiang Xiaodong  Abstract
The Application Research of VOC-free Flux Liu Yunji, Zhu Ailan, Zhang Yuan  Abstract
The Application Research of VOC-free Flux (CHINESE) Liu Yunji, Zhu Ailan, Zhang Yuan  Abstract
Rework of Package on Package in Lead-Free Array Paul Wood  Abstract
ASSEMBLY CHALLENGES OF PACKAGE-ON-PACKAGE (PoP) Richard Boulanger  Abstract
The Lead-Free Wave Solder Process and Its Effect on Laminates Steve Brown, Chrys Shea  Abstract
Optimising Rheology for Package-on-Package Flux Dip Processes Steve Brown, Chrys Shea, et al.  Abstract
Optimising Rheology for Package-on-Package Flux Dip Processes (CHINESE) Steve Brown, Chrys Shea, et al.  Abstract
MATERIAL AND PACKAGE OPTIMIZATION FOR POP WARPAGE CONTROL Wei Lin, Akito Yoshida, Moody Dreiza  Abstract
OPTIMIZE OXYGEN LEVEL IN SEMI-INERT WAVE SOLDERING - NITROGEN CONSUMPTION COST DOWN Xiao Shenghan  Abstract
OPTIMIZE OXYGEN LEVEL IN SEMI-INERT WAVE SOLDERING - NITROGEN CONSUMPTION COST DOWN (CHINESE) Xiao Shenghan  Abstract
A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS (CHINESE) Yung-Herng Yau, Karl Wengenroth and Joseph Abys  Abstract
A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS Yung-Herng Yau, Karl Wengenroth and Joseph Abys  Abstract
High resolution Lead-Free Solder Inspection by X-Ray Zhenhui He, Holger Roth and Dirk Neuber  Abstract
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