2000 Surface Finishes Forum Proceedings

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TITLE AUTHOR
NICKEL / PALLADIUM SURFACE FINISH FOR SEMICONDUCTOR PACKAGING APPLICATIONS C. Fan, A. Blair and J. A. Abys  Abstract
IMMERSION TIN AS A HIGH PERFORMANCE SOLDERABLE FINISH FOR FINE PITCH PWBS David H. Ormerod  Abstract
OSPS: ADDRESSING FUTURE SURFACE FINISHING NEEDS Karl Wengenroth, Eric Stafstrom, and John Fudala  Abstract
A ROOT CAUSE FAILURE MECHANISM FOR SOLDER JOINT INTEGRITY OF ELECTROLESS NICKEL / IMMERSION GOLD SURFACE FINISHES Nicholas Biunno and Michael Barbetta  Abstract
FINAL SURFACE TREATMENT FOR PKGS AND PWBS FOR LEAD FREE SOLDERING Shigeo Hashimoto, et al.  Abstract
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