SMTA International 2007 Proceedings

While abstracts in the Knowledge Base are accessible to all visitors, the full articles (PDF format) are FREE FOR SMTA MEMBERS to download.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

< Back to Conferences List



TITLE AUTHOR
CHINA RoHS UPDATE Abby Tsoi  Abstract
ALTERNATE SOLDER BALLS FOR IMPROVING DROP/SHOCK RELIABILITY Ahmer Syed, TaeSeong Kim, and SeWoong Cha  Abstract
LEAD-FREE SELECTIVE SOLDERING – APPLICATIONS, ADVANTAGES AND CASE STUDIES Alan Cable  Abstract
THE EFFECT OF CRITICAL TO FUNCTION PARAMETERS OF THE LEAD-FREE MINI-POT THROUGH-HOLE CONNECTOR REWORK PROCESS ON THE FINAL BARREL COPPER THICKNESS Alan Donaldson  Abstract
NANOTECHNOLOGY ADVANCES IN PRINTABLE SYSTEMS FOR CONDUCTORS AND INTERCONNECTS Alan Rae  Abstract
CHALLENGES IN SUB-MICRON TEST Alek Jaworski  Abstract
DRIVING MANUFACTURING AND TEST STRATEGY VIA DATA ANALYSIS Alek Jaworski, Dan Frame, and Mark Dickson  Abstract
SECOND LEVEL SOLDER JOINT RELIABILITY OF QUAD FLAT NO-LEAD (QFN) PACKAGES FOR USE IN IPC CLASS-2 ASSEMBLIES Alex Chan, Aman Khan, Ph.D., and Robert Kinyanjui, Ph.D.  Abstract
VAPOR PHASE TECHNOLOGY AND ITS EVOLUTION Allen W. Duck and Claus Zabel  Abstract
UNIFIED FINITE ELEMENT MODEL FOR PREDICTION OF SOLDER JOINT FATIGUE UNDER THERMAL, POWER, AND VIBRATION ENVIRONMENTS FOR CERAMIC AREA ARRAY ELECTRONIC PACKAGES Andrew Perkins and Suresh K. Sitaraman  Abstract
RELIABILITY OF SMT CONNECTORS DUE TO THERMAL AND MECHANICAL FATIGUE Arv Sinha, Ph.D., PE, Joe Kuczynski, Ph.D., Amanda Mikhail, and Theron Lewis  Abstract
IMPACT OF AGING AND STORAGE CONDITIONS OF OSP PCBs ON BGA SOLDER JOINT RELIABILITY Bala Nandagopal, Sue Teng and Mason Hu  Abstract
A COMPLIANT AND CREEP RESISTANT SAC-Al(Ni) ALLOY Benlih Huang, Ph.D., Hong-Sik Hwang, Ph.D., and Ning-Cheng Lee, Ph.D.  Abstract
METHODOLOGY FOR EVALUATING DATA FOR “REVERSE COMPATIBILITY” OF SOLDER JOINTS Bill Russell, Dennis Fritz, and Gary S. Latta  Abstract
CUMULATIVE AND SYNERGISTIC EFFECTS OF COMBINED MECHANICAL LOADING OF LEAD-FREE BGAS Brian Roggeman and Peter Borgesen, Ph.D.  Abstract
EIGHT ACTIONS TO STRENGTHEN THE EMS/OEM PROCUREMENT RELATIONSHIP Bryan Gillespie  Abstract
RELIABILITY ASSESSEMENT OF EMBEDDED CHIP BUILD-UP BGA PACKAGES – Part II Charles G. Woychik, Ph.D., Raymond A. Fillion, Tan Zhang, Paul McConnelee, and Shane M. Lewis  Abstract
FRAME LEVEL PACKAGING: FLIP CHIP APPLICATION Charles Lin, Nick Wang, Len Chen, Ken Chang, Andy Lim, and Jerry Tan  Abstract
THE INFLUENCE OF THE PWB FABRICATION ELECTRODEPOSITION PROCESS ON COPPER EROSION DURING WAVE SOLDERING Chrys Shea, Jim Kenny, Jean Rasmussen, Shiang Teng, Girish Wable, Quyen Chu, Keith Sweatman, and Kazuhiro Nogita, Ph.D.  Abstract
INVESTIGATION INTO THE MASS IMAGING ASPECTS OF 0.3mm WAFER LEVEL CHIP SCALE PACKAGE SOLDER PASTE DEPOSITION Clive Ashmore  Abstract
SILVER AND SULFUR: CASE STUDIES, PHYSICS, AND POSSIBLE SOLUTIONS Craig Hillman, Joelle Arnold, Seth Binfield, and Jeremy Seppi  Abstract
A COMPARATIVE ANALYSIS OF AQUEOUS BASED CLEANING CHEMISTRIES ON HIGH RELIABILITY ELECTRONIC ASSEMBLIES Dale Lee  Abstract
RELIABILITY AND FAILURE MODE ANALYSIS OF A VOID FREE HYBRID NO-FLOW UNDERFILL PROCESS Daniel F. Baldwin, Ph.D. and Michael Colella  Abstract
TESTING PASSIVE COMPONENTS FOR FLEXURE CRACK PERFORMANCE Daniel Skamser, Cory Riedl, Bill Sloka, John Evans, Ph.D., and Zhaozhi Li  Abstract
SOLDER JOINT INTEGRITY IMPACT OF 98% TIN/ 2% BISMUTH COMPONENT SURFACE FINISHES Dave Hillman and Jon Soole,Iver Anderson, Ph.D., Mark Bancroft, Chris Hess, and Dave Lopez  Abstract
LEAD-FREE (PbFREE) FEASIBILITY PROGRAM: ASSEMBLY AND TESTING OF A FUNCTIONAL IPC CLASS 3 AVIONICS DATA UNIT Dave Hillman and Matt Hamand  Abstract
QUALITY AND RELIABILITY INVESTIGATION OF PRINTED CIRCUIT BOARD MICRO-VIAS BY X-RAY INSPECTION David Bernard and Bob Willis  Abstract
COMMON PROCESS DEFECT IDENTIFICATION OF QFN PACKAGES USING OPTICAL AND X-RAY INSPECTION David Bernard and Bob Willis  Abstract
RELIABILITY IMPACT OF COPPER-DOPED EUTECTIC TIN-LEAD BUMP AND ITS VOIDING UPON FLIP CHIP ASSEMBLIES David Ihms and Shing Yeh  Abstract
VAPOR PHASE - A CURRENT OVERVIEW AND ITS APPLICATION FOR LEAD FREE REFLOW David Suihkonen and Atul Mehta  Abstract
LEAD FREE WAVE SOLDERING: INFLUENCE OF ALLOYS, BOARD DESIGN, AND PROCESS PARAMETERS ON DEFECT FORMATION Denis Barbini, Ph.D., Quyen Chu, Denis Jean, Stuart Longgood, Paul Lotosky, and Chrys Shea  Abstract
LIQUID SOLDERING TECHNIQUES AND PROCESS OPTIMIZATION A CASE STUDY FOR LOW DEFECT WAVE AND SELECTIVE SOLDERING PROCESSES Denis Barbini, Ph.D., Ursula Marquez de Tino, Kaustubh Kalkundri, and Gerjan Diepstraten  Abstract
MECHANICAL RELIABILITY AND THERMAL DESIGN STUDIES OF QFN PACKAGES Dongji Xie, Ph.D., Younes Shabany, Ph.D., Jonathan Wang, and Sammy Yi  Abstract
FLUX SELECTION FOR LEAD-FREE WAVE SOLDERING Douglas Watson, Jasbir Bath, Pan Wei Chi  Abstract
STRAIN GAGE ANALYSIS AS A PROCESS VALIDATION TOOL FOR LCD PANEL REPAIR Edward J. Collins  Abstract
Pb-FREE SELECTIVE SOLDERING PROCESS OPTIMIZATION Elavarasan T. Pannerselvam and S. Manian Ramkumar  Abstract
INVESTIGATION OF IMPACT RELIABILITY OF Pb-FREE SOLDER INTERCONNECTS IN BALL GRID ARRAY ASSEMBLIES Fahad Mirza, Saurabh Athavale, Krishnan Vishwanathan, Amol Kane, Mike DiPietro, Eric Cotts, James Pitarresi, and Daryl Santos, Ph.D.  Abstract
SOLDER RELIABILITY MODEL FOR BGA AND LCC JOINTS GIVEN LEAD-FREE REWORK CONCERNS Frank Liotine, Jr., PE  Abstract
SOLDERING AND SOLDER JOINT RELIABILITY FOR SELECTED SURFACE FINISHES WITH LEAD FREE SAC305 ALLOY George Milad and Don Gudeczauskas  Abstract
BOARD LEVEL RELIABILITY OF LEAD-FREE SOLDERED INTERCONNECTS - TEST METHODS H.-J. Albrecht, M. Heimann, Ch. Götze, and M. Löffler  Abstract
A NEW DEFINITION OF LOW STAND OFF CLEANING Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, Joachim Becht, Ph.D., Helmut Schweigart, Ph.D., and Dirk Ellis  Abstract
AREA ARRAY CONNECTOR RELIABILITY: IMPACT OF CONVERSION TO LEAD FREE AND OF TEST VEHICLE DESIGN PARAMETERS Heather McCormick, Alex Chan, Richard Coyle, Donald Harper, Steve Minich, Damir Jelkovic, Brent Peterman, and Mark Gray  Abstract
INTEGRATING BOUNDARY-SCAN TEST WITH FLYING PROBE IN-CIRCUIT TEST Hiroshi Yamazaki  Abstract
IMMERSION TIN AS A COST-EFFECTIVE AND RELIABLE SURFACE FINISH FOR PB-FREE AUTOMOTIVE ELECTRONICS APPLICATIONS – PHASE II INVESTIGATIONS Hugh Roberts, Sven Lamprecht, Elaine Bevan, John Coates and Steve Prosser  Abstract
THE CASE FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) AS A SURFACE FINISH Jack D. Fellman  Abstract
A NEW METHOD OF CONNECTING WIRES TO SMT BOARDS Janos Legrady  Abstract
PROCESS DEVELOPMENT AND OPTIMIZATION USING A NEWLY DESIGNED CONFORMAL COATING TEST VEHICLE Jason Keeping, PE  Abstract
PEEK FOR LEAD-FREE SOLDERING PROCESSES AND ELECTRONICS APPLICATIONS Jeff Chen, Michael Gross, and Craig Meakin  Abstract
FOUNDATIONS FOR SUCCESSFUL 01005 RESISTOR ASSEMBLY Jeff Schake  Abstract
THE SnAgCu SOLDER JOINT FAILURE OF BGA TYPE PACKAGE IN 2ND LEVEL APPLICATION Jeffrey C. B. Lee  Abstract
PROCESS AND RELIABILITY STUDY OF LEAD-FREE WAVE SOLDERING FOR LARGE THICK BOARDS Jennifer Nguyen, Robert Thalhamer, David Geiger, Dan Rooney, and Dongkai Shangguan, Ph.D.  Abstract
A PRODUCT ENVIRONMENTAL COMPLIANCE CASE STUDYESTABLISHING A RoHS FULL DISCLOSURE AUDIT TRAIL FOR AN ELECTRONICS MANUFACTURING SERVICES COMPANY Jim Dills and Rebecca Harris  Abstract
WETTING AND SPREADING STUDIES FOR LEAD FREE SOLDER AND FLUX MATERIALS IN FLIP CHIP PACKAGES Jinlin Wang, Ph.D.  Abstract
PROPOSED CURRICULUM FOR ENVIRONMENTAL ENGINEERS IN ELECTRONICS John Hawley and Manthos Economou  Abstract
EFFECT OF TEMPERATURE CYCLING PARAMETERS ON THE SOLDER JOINT RELIABILITY OF A Pb-FREE PBGA PACKAGE John Manock, Richard Coyle, Brian Vaccaro, Heather McCormick, Richard Popowich, Debra Fleming, Peter Read, John Osenbach, and Dan Gerlach  Abstract
PROCESS DEVELOPMENT AND RELIABILITY EVALUATION FOR INLINE PACKAGE ON PACKAGE (POP) ASSEMBLY Jonas Sjoberg, Todd Castello, David A. Geiger and Dongkai Shangguan, Ph.D.  Abstract
STUDIES ON THE REMOVAL OF COPPER DURING MINIPOT REWORK WITH DIFFERENT LEAD-FREE ALLOYS Kantesh Doss, Ph.D., Alan Donaldson, Andrew Tong, and Raiyo Aspandiar  Abstract
HIGH TEMPERATURE RELIABILITY LIMITS OF SILICONES Kent Larson  Abstract
SUPPORTING A FULL PRODUCT LIFE CYCLE IN THE MEDICAL INSTRUMENTATION MARKET Kevin Stokes and Paul Plante  Abstract
NEW DEVELOPMENT IN FLIP CHIP UNDERFILLS FOR LEAD-FREE PACKAGING Larry Wang, Ph.D., Violet Evans, George Sears, and Guoyun Tian  Abstract
THROUGH SILICON VIA INTERCONNECTION ENABLING 3D WAFER-LEVEL SIP Lars Boettcher, Andreas Ostmann, Dionysios Manessis, and Herbert Reichl  Abstract
ASSEMBLY PROCESS TECHNOLOGY RESEARCH OF 0201 COMPONENTS ON LARGE SIZE PCB Lei Feng, Dongqing Ding, Shoukai Zhang, and Fujiang Sun  Abstract
CREEP CORROSION ON PCB SURFACES: IMPROVEMENTS OF PREDICTIVE TEST METHODS AND DEVELOPMENTS REGARDING PREVENTION TECHNIQUES Lenora Toscano, Ernest Long, Ph.D., and John Swanson  Abstract
THE INFLUENCE OF PROCESS PARAMETERS TO DOUBLE-SIDED ASSEMBLY BGA RELIABILITY IN BACKWARD COMPATIBLE SOLDERING Limin Chen, Yuming Ye, Sang Liu, Syber Chen, Yunhua Tu, Zhiwei Song, and Zhao Xiang  Abstract
ROHS- A BUSINESS PROCESS REJUVENATION Mahesh Patil  Abstract
VOID FREE SOLDERING TECHNOLOGY FOR POWER ELECTRONICS Mathias Nowottnick, Uwe Pape, and Rolf Diehm  Abstract
QUALIFICATION OF A LEAD-FREE CARD ASSEMBLY AND TEST PROCESS FOR A SERVER COMPLEXITY PCBA Matthew Kelly, Marie Cole, Jim Wilcox, Jim Bielick, Timothy Younger, and David Braun  Abstract
RESERVOIR SOLDER PASTE PRINTING Michael R. Burgess and James A. Robbins  Abstract
YOU DON’T HAVE TO BE A BLACKBELT TO ACHIEVE IMPROVEMENT Michael R. Weekes  Abstract
SOLDER JOINT AND SOLDER FILLET OPTIMIZATION FOR SURFACE MOUNTED TERMINAL BLOCKS Michel Hodak and Dubravka Kusmic  Abstract
DEVELOPMENT AND VALIDATION OF A NEW TEST PLATFORM FOR CLEANING PROCESS DEVELOPMENT PHASE I Mike Bixenman and Steve Stach  Abstract
USING SIX SIGMA TECHNIQUES TO OPTIMIZE CLEANING IN CLASS III ELECTRONICS Mike Bixenman, Tom Gervascio, and Ronald Lasky, Ph.D., PE  Abstract
A TRANSITION STRATEGY FOR HIGH-RELIABILITY APPLICATIONS TO Pb-FREE TECHNOLOGY Mike Davisson  Abstract
FATIGUE DAMAGE PREDICTION DURING THERMO-MECHANICAL CYCLING FOR LEAD-FREE SOLDERS Milos Dusek and Chris Hunt  Abstract
BGA COMPONENT THERMAL WARPAGE AND IMPLICATION FOR BOARD-LEVEL INTERCONNECT RELIABILITY Ming Zhou and Hua Lu  Abstract
BGA BACKWARD COMPATIBILITY INTERIM TEMPERATURE CYCLE TEST DATA FOR HARSH ENVIRONMENTS Mradul Mehrotra, et al.  Abstract
METALLIZATION OPTIONS FOR OPTIMUM CHIP-ON-BOARD ASSEMBLY Mukul Luthra  Abstract
COMPARISON OF THE LEVEL 2 CHARACTERISTICS OF HITCE™ SUBSTRATE ASSEMBLED WITH SAC AND HIGH LEAD BALLS Nicole Butel  Abstract
EU RoHS AND UPCOMING LEGISLATION Nikki Johnson  Abstract
FUTURE LEAD-FREE SOLDER ALLOYS AND FLUXES – MEETING CHALLENGES OF MINIATURIZATION Ning-Cheng Lee, Ph.D.  Abstract
SOLDER JOINT SHAPE OPTIMIZATION FOR CERAMIC LEADLESS CHIP CARRIERS Olli Salmela, Ph.D.  Abstract
A STUDY OF 0201’S AND TOMBSTONING IN LEAD-FREE SYSTEMS Paul Neathway, Andrew Butterfield, Quyen Chu, Nick Tokotch, Robert Haddick, Jean-Marc Peallat, Chrys Shea and Prashant Chouta  Abstract
REWORKING PACKAGE ON PACKAGE COMPONENTS Paul Wood  Abstract
LEAD-FREE REWORK EXPERIENCES USING SAC Peter Biocca  Abstract
THERMO-MECHANICAL RELIABILITY MANAGEMENT MODELS FOR AREA-ARRAY PACKAGES ON CU-CORE AND NO-CORE ASSEMBLIES Pradeep Lall, Milan Shah, Luke Drake, Timothy Moore, Jeff Suhling  Abstract
LEAD FREE PRODUCT QUALITY IN VAPOR PHASE REFLOW Pravin Sequeira  Abstract
MITIGATING HIGH STRESS FAILURE IN A HIGH-PERFORMANCE RF/MICROWAVE MODULE ASSEMBLY Quan Qi, Ph.D., Curt Miller, Daryl Hollis, Kathleen Ullom, Jeff McDonald, Ken Vielmette, and Heidi Davis, Ph.D.  Abstract
CREEP CORROSION ON LEAD-FREE PRINTED CIRCUIT BOARDS IN HIGH SULFUR ENVIRONMENTS Randy Schueller, Ph.D.  Abstract
ELIMINATION OF FLIP CHIP ELECTROMIGRATION FAILURES USING EMBEDDED CHIP BUILD-UP TECHNOLOGY Ray Fillion, Tan Zhang, and Charles Woychik, Ph.D.  Abstract
MECHANICAL SHOCK SOLDER JOINT RELIABILITY (SJR) ASSESMENT OF THE BOARD LEVEL ADHESIVE PROPERTIES Renn Chan Ooi, Cheng Siew Tay, Alan C McAllister, Karissa J Blue, and Lian Huat Ng  Abstract
LEAD FREE APPLICATION OF FLIP CHIP UNDERFILLS Renzhe Zhao, Ph.D., Qing Ji, Ph.D., Qiaohong Huang, Ph.D., George Carson, Ph.D., and Michael Todd, Ph.D.  Abstract
THE Pb-FREE SnAgCu BALL GRID ARRAY (BGA) COMPONENTS IN SnPb ASSEMBLY PROCESS: PROCESS CHARACTERIZATION AND SOLDER JOINT RELIABILITY Robert Kinyanjui, Ph.D. and Quyen Chu  Abstract
REAL TIME X-RAY INSPECTION SYSTEM: AN ALTERNATIVE INSPECTION SCHEME FOR FINE-PITCH ICs Rodolfo del Mundo  Abstract
smtai07-Edelstein_P.pdf Rohit Patnaik, Dale Thayer, and Peter Edelstein  Abstract
LOW MELTING ALLOYS: A NEW SOLUTION TO LEAD FREE REWORK PROCESS ISSUES S. Bagheri, P. Snugovsky, Z. Bagheri, C. Hamilton, H. McCormick, and M. Romansky  Abstract
VOID FORMATION STUDY OF HIGH I/O DENSITY AND FINE PITCH FLIP CHIP IN PACKAGE USING NO-FLOW UNDERFILL Sangil Lee, Daniel F. Baldwin, Ph.D., Raj Master, Ph.D., and Srinivasan Parthasarathy  Abstract
REFLOW PROCESS ENHANCEMENT AND WETTING ANALYSIS IN 63Sn/37Pb AND Sn-Ag-Cu LEAD FREE ALLOY Scott J. Anson, Ph.D., PE, and Jacob G. Slezak  Abstract
ORGANIC SOLDERABILITY PRESERVATIVE LEAD FREE REFLOW PROCESSING Scott J. Anson, Ph.D., PE, and Jacob G. Slezak  Abstract
COPPER AS A VIABLE SOLUTION FOR IC PACKAGING Sheila Rima C. Magno, Jean Ramos, Eduardo Pecolera, and Chris Stai  Abstract
THE STUDY OF LASER REPAIR THROUGH BCB PASSIVATION IN FLIP CHIP TECHNOLOGIES Shu-Ching Ho, Hsiang-Ming Huang, Yi-Chang Lee, Yeong-Jyh Lin, and An-Hong Liu  Abstract
THE DEVELOPMENT OF A SINGLE CHAMBER, MULTI-METAL, BUMP PLATING TOOL Steven Cho, Lee Levine, and Solomon Basame, Ph.D.  Abstract
THE EFFECT OF PROCESS VOIDING ON BGA SOLDER JOINT FATIGUE LIFE MEASURED IN ACCELERATED TEMPERATURE CYCLING Sundar Sethuraman, Richard Coyle, Richard Popowich, and Peter Read  Abstract
STENCIL PRINTING EVALUATION OF A 01005 COMPONENT BASED ON A STATISTICAL APPROACH Sung Chul Joo and Daniel F. Baldwin, Ph.D., Weon Woo Nam, Ph.D.  Abstract
EXPERIENCES WITH MONOTONIC BEND TEST OF ELECTRONIC PACKAGES Thomas Koschmieder  Abstract
PROCESS CONTROL WITH AUTOMATED X-RAY INSPECTION OF SOLDER JOINTS Thomas Mayer  Abstract
THE ECONOMICAL DEVELOPMENT OF A LEAD-FREE ASSEMBLY PROCESS: A PRACTICAL CASE STUDY THAT MINIMIZED CONVERSION AND OPERATIONAL COSTS Tom Borkes and Pat McDonough  Abstract
TWISTED WIRE INTERCONNECTS: AN ALTERNATIVE TO MULTI-LAYER BOARD CONSTRUCTION FOR HIGH COMPONENT DENSITY PRINTED CIRCUIT BOARD ASSEMBLIES Tom Borkes, Steve Garcia, and Randy Boudreaux  Abstract
BRIDGING THE GAP - INDEPENDENT DISTRIBUTORS ADD FLEXIBILITY TO THE SUPPLY CHAIN Tony Musto  Abstract
CORRELATING PRINTING PROCESS DEFECTS TO END OF LINE DEFECTS Vatsal Shah, Rita Mohanty, Ph.D., Arun Ramasubramanian, and Joe Belmonte  Abstract
LOW PROFILE NAND FLASH STACKED PACKAGE-ON-PACKAGE Vern Solberg  Abstract
AIR REFLOW OF LEAD-FREE SOLDERING FOR FINE PITCH BGA Wei Wei Chin, Ching Ching Chong, Lian Huat Ng, and Cheng Siew Tay  Abstract
ELECTRICAL CHARACTERIZATIONS OF TSOP II AND FBGA PACKAGES FOR HIGH-SPEED APPLICATIONS Yi-Chang Lee, An-Hong Liu, Emerson Chiu, Vincent Tu, Chih-Ming Lin, Hsiang-Ming Huang, Shu-Ching Ho, Hao-Yin Tsai, and Yeong-Her Wang  Abstract
PCB ROUTERS FOR OPTIMAL AND LOW-STRESS DEPANELIZATION OF HIGH-DENSITY BOARDS Yoshito Kanayama  Abstract
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819