Successful Lead-Free/RoHS Strategies Conference 2007 Proceedings

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TITLE AUTHOR
TIN WHISKER RISK ASSESSMENT CASE STUDY Craig Hillman, Gerd Fischer, and Robert Esser  Abstract
LEAD FREE WAVE SOLDERING: PROCESS OPTIMIZATION FOR SIMPLE TO HIGHLY COMPLEX BOARDS Denis Barbini, et al.  Abstract
Lead-Free Rework: Lessons Learned Douglas J. Peck  Abstract
SELECTING LAMINATE MATERIALS FOR LEAD-FREE ASSEMBLY APPLICATIONS Edward Kelley  Abstract
AN EXPERIMENTAL STUDY OF A COMPONENTS TERMINATION FINISH CONVERSION PROCESS: THE ROBOTIC STRIPPING AND SOLDER DIPPING PROCESS Guhan Subbarayan, Robert Kinyanjui, Ph.D., and Joel Deutsch  Abstract
DEFLUXING OF EUTECTIC AND LEAD-FREE ASSEMBLIES IN A SINGLE CLEANING PROCESS Harald Wack, Ph.D., et al.  Abstract
RECOMMENDING A STRATEGY FOR IMPLEMETING ROHS COMPLIANT MATERIALS IN ENGINEERING FUNCTIONS Jeffrey Boian  Abstract
Six Steps to Lead Free Process Implementation Joe Belmonte  Abstract
A UNIQUE TIN WHISKER GROWTH STUDY OF NINE LEAD FREE ALLOYS Karl Seelig and Tetsuro Nishimura  Abstract
UNDER BUMP METALLURGY FOR C4NP LEAD FREE SOLDER BUMPING Klaus Ruhmer and Eric Laine, et al.  Abstract
Environmental Compliance Documentation: More than Materials Declaration Krista Botsford  Abstract
ENVIRONMENTAL COMPLIANCE DOCUMENTATION Krista Botsford  Abstract
China RoHS vs. EU RoHS Myths & Misconceptions Krista Botsford  Abstract
EU RoHS VS. CHINA RoHS Krista Botsford  Abstract
HAVE HIGH Cu DISSOLUTION RATES OF SAC305/405 ALLOYS FORCED A CHANGE IN THE LEAD FREE ALLOY USED DURING PTH PROCESSES? Matthew Kelly, Craig Hamilton and Polina Snugovsky, Ph.D.  Abstract
CASE STUDY ON THE VALIDATION OF SAC305 AND SNCU BASED SOLDERS IN SMT, WAVE AND HAND-SOLDERING AT THE CONTRACT ASSEMBLER LEVEL Peter Biocca and Carlos Rivas  Abstract
BENCHMARK ELECTRONIC’S FRAMEWORK FOR ROHS IMPLEMENTATION Scott Mazur  Abstract
Evaluating Tin Whisker Mitigation Strategies: Conformal Coatings and Plating Technique Sony Mathew, Michael Osterman and Michael Pecht  Abstract
EVALUATION OF PRESSURE-INDUCED TIN WHISKER FORMATION Tadahiro Shibutani, Ph.D. et al.  Abstract
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