Pan Pacific Symposium 2007 Proceedings

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TITLE AUTHOR
“WARM” MANUFACTURING Alan Rae, Marc Chason and Andrew Skipor  Abstract
JETTING ADHESIVES AND OTHER MATERIALS FOR SEMICONDUCTOR AND ELECTRONIC COMPONENT PACKAGING Alec J. Babiarz  Abstract
NEW CHALLENGES AND OPPORTUNITIES OF SYSTEM-IN-PACKAGE Anna Fontanelli  Abstract
EMBEDDING OF THINNED CHIPS IN PLASTIC SUBSTRATES Björn Vandecasteele, Jonathan Govaerts, and Jan Vanfleteren  Abstract
USING UNDERFILLS TO ENHANCE DROP TEST RELIABILITY OF Pb-FREE SOLDER JOINTS IN ADVANCED CHIP SCALE PACKAGES Brian Toleno, Ph.D., Dan Maslyk, and Tom White  Abstract
RELIABILITY ASSESSEMENT OF EMBEDDED CHIP BUILD-UP BGA PACKAGES Charles G. Woychik, Raymond A. Fillion, and James Aloise  Abstract
AN INTEGRATED APPROACH: FRAME LEVEL PACKAGING Charles Lin, Nick Wang, Len Chen, Ken Chang, Andy Lim, and Jerry Tan  Abstract
ASSUMPTIONS ARE NOT THE ANSWER! Charlie Barnhart  Abstract
BGA SOLDER VOID CORRELATION TO VIA-IN-PAD, VIA FILL, SURFACE FINISH, AND LEAD-FREE SOLDER – FINAL REPORT Chrys Shea, Rahul Raut, Lou Picchione, Quyen Chu, Nicholas Tokotch, and Paul Wang  Abstract
CONSIDERATIONS IN SELECTING FLUXES FOR LEAD-FREE WAVE SOLDERING Chrys Shea, Sanju Arora, Steve Brown, and Steven Wong  Abstract
HAVE HIGH Cu DISSOLUTION RATES OF SAC305/405 ALLOYS FORCED A CHANGE IN THE LEAD FREE ALLOY USED DURING PTH PROCESSES? Craig Hamilton, Polina Snugovsky, Ph.D., and Matthew Kelly  Abstract
OPTIMIZATION OF WIRELESS SENSOR NETWORK LIFETIME BY MEANS OF EVOLUTIONARY ALGORITHMS Davide Caputo, Alessandro Gandelli, Francesco Grimaccia, Marco Mussetta, and Riccardo E. Zich  Abstract
LEAD FREE WAVE SOLDERING: PROCESS OPTIMIZATION FOR SIMPLE TO HIGHLY COMPLEX BOARDS Denis Barbini, Paul Wang, Peter Biocca, Quyen Chu, Tim Dick, Denis Jean, Stuart Longgood, Chrys Shea, Keith Sweatman, and Mike Yuen  Abstract
CIRCUIT BOARD AND SOLDER STENCIL DESIGN EFFECTS ON LEADLESS PACKAGING Dennis Lang and Chung-lin Wu, Ph.D.  Abstract
MANUFACTURING QUALIFICATION FOR THE LATEST GAMING DEVICE WITH Pb-FREE ASSEMBLY PROCESS Ding Wang Chen, Ph.D., Alex Leung, Alex Chen Raul Rodriquez, Paul P.E. Wang, Ph.D., and Michael Miller  Abstract
COMPARISON OF THE SOLDERABILITY PERFORMANCES OF INHIBITOR CONTAINING AND INHIBITOR-FREE IMMERSION SILVER COATINGS Edwin P. Lopez, Paul Vianco, Sam Lucero, and R. Wayne Buttry  Abstract
DOE OPTIMIZATION OF SAC 305 LEAD-FREE WAVE SOLDERING AND SPRAY FLUXER USING SELECTIVE SOLDERING PALLET Eric Fremd, Sunil Gopakumar, Wyeman Chen and Chu Lin  Abstract
HIGH-DEFINITION 2D/3D X-RAY IMAGING: THE COMPLETE STORY Friedhelm Maur  Abstract
THE GREAT SAC DEBATE: COMPARING THE RELIABILITY OF SAC305 AND SAC405 SOLDERS IN A VARIETY OF APPLICATIONS Heather McCormick, Polina Snugovsky, Craig Hamilton, Zohreh Bagheri, and Simin Bagheri  Abstract
THERMAL CYCLING RELIABILITY ASSESSMENT FOR 4 ARRAY RESISTOR OF MEMORY MODULE Hyo-Jae Bang  Abstract
STUDY OF IMPACT STRESS OF CSP SOLDER JOINTS USING HOMOGENIZATION METHOD AND FEM DROP-SIMULATION Ichiro Hirata and Hirofumi Nakamura  Abstract
ANALYSIS OF LOW-K DIELECTRIC IN FLIP CHIP DEVICES USING ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler  Abstract
SOLDER-PASTE INSPECTION MACHINE - WHAT’S YOUR EXPECTATION? Jiang Xiaodong  Abstract
PACKAGE ON PACKAGE (POP) PROCESS DEVELOPMENT AND RELIABILITY EVALUATION Jonas Sjoberg, David A. Geiger, Todd Castello, and Dongkai Shangguan, Ph.D.  Abstract
A STUDY OF THE MECHANISM AND DETERMINATION OF THE ACTIVATION ENERGY FOR DIE PAD UNDER BUMP METAL RESISTANCE INCREASE ON FLIP-CHIP DIE USING SCANNING ACOUSTIC MICROSCOPY AND HIGH TEMPERATURE STORAGE Joseph Patterson, Hong Yang, and Damon Rachell  Abstract
MICRO ELECTRO MECHANICAL SYSTEMS BASED ULTRASONIC SENSORS FOR NON DESTRUCTIVE EVALUATION Karthik Tondapu  Abstract
SOLVING THE COUNTERFEIT ELECTRONICS PROBLEM Kaushik Chatterjee, Diganta Das, Michael Pecht, Christopher Ricci and Peter Suorsa  Abstract
HIGH THROUGH-PUT PRODUCTION MATERIAL SCREENING METHODS FOR ROHS COMPLIANCE Kenneth L. Smith, Drew Hession-Kunz, and Donald W. Sackett, Ph.D.  Abstract
EVALUATION OF Pb-FREE BGA SOLDER JOINT RELIABILITY ON Ni-BASED SURFACE FINISHES USING ALTERNATIVE SHEAR AND PULL METROLOGIES Kuldip Johal, Hugh Roberts, Thomas Beck, Sven Lamprecht, Hans-Juergen Schreier, and Christian Sebald  Abstract
WAFER LEVEL PACKAGE USING PRE-APPLIED ANISOTROPIC CONDUCTIVE FILMS (ACFS) FOR FLIP-CHIP ASSEMBLY Kyung-Wook Paik, Ho-Young Son, and Chang-Kyu Chung  Abstract
STUDY OF BGA SOLDER JOINTS INTERFACIAL FAILURE MECHANISM RELATED TO WAVE SOLDERING Liu Sang, Tu Yunhua, Chen Limin, Xu Yunxia, Yuan Wang, Ye Yuming, and Luo Chaoyun  Abstract
EFFECTS OF PROCESS PARAMETERS ON THE MATERIAL CHARACTERISTICS OF DIE ATTACH ADHESIVES Mark T. McMeen and Casey H. Cooper  Abstract
65nm FCBGA RELIABILITY FOR NEXT GENERATION GAMING DEVICE PHASE I-A METHODOLOGY FOR STREAMLINE PRODUCT DESIGN CYCLE AND 2ND AND SYSTEM LEVEL QUALIFICATION Paul P.E. Wang, Ph.D., DongJi Xie, Ph.D., Michael Miller, Jelena Larsen, Julia Purtell, Daniel Lau, Daniel Chang, Jerry Tzou, Brian Hung, Hector Marin, Dan Rooney, Ph.D., Chrys Shea, Ravi Bhatkal, Ph.D., and Dongkai Shangguan, Ph.D.  Abstract
SHAPE SENSITIVITY ANALYSIS OF MICROSTRIP PATCH ANTENNA FOR USE IN A WIRELESS SENSOR NET R. E. Zich, A. Gandelli, M. Forcati, D. Monopoli, A. Pirisi, and P. Pirinoli  Abstract
NANOPACKAGING Rao Tummala, P. Markondeya Raj, Ankur Agrawal, Jack K. Moon, C. P. Wong, Janagama Goud, Tapobratha Bandyopadhyay, and Mahdevan Iyer  Abstract
ACCELERATED STRESS TEST COMPARISON OF CURRENT CARRYING LIMITATIONS; FLIP CHIP VS GE EMBEDDED CHIP BUILD-UP Ray Fillion, Charles Woychik, and Don Bitting  Abstract
EFFECTS OF ADHESION PROMOTION TREATMENT ON ELECTRICAL SIGNAL ATTENUATION Roger Krabbenhoft and Bruce Lee  Abstract
UNVEILING THE NEXT GENERATION IN SUBSTATE TECHNOLOGY Ron Huemoeller, Sukianto Rusli, Steve Chiang, Tsung Yuan Chen, Dave Baron, Lutz Brandt and Bernd Roelfs  Abstract
COOLING ENHANCEMENT OF A MULTI-WICK VAPOR CHAMBER S. H.-K. Lee, C. C. C. Choi, and Y. Jaluria  Abstract
RESEARCH AND APPLICATION OF A THERMAL MANAGEMENT DEVICE (CoolCapTM) FOR ELECTRONIC ASSEMBLIES Sameer Jain, Daryl Santos, Ph.D., and Brian Lewis, Ph.D.  Abstract
SnPb, Pb-FREE, AND BACKWARD COMPATIBLE SOLDERING PROCESSES OF HIGH-SPEED BGA CONNECTORS Scott Priore, Hien Ly, and Doug Prosenik  Abstract
A STUDY ON COPPER ELECTRODEPOSITION USED FOR VIA INTERCONNECTION, FOR THE APPLICATION OF WAFER LEVEL PACKAGING SeungJin Oh, YoonChul Sohn, WoonBae Kim, KeDong Baek, and ChangYoul Moon  Abstract
MICROFABRICATED POLYIMIDE BASED ACTUATORS Stephen M. Bobbio, Stephen W. Smith, Jason M. Zara, Scott M. Goodwin  Abstract
GAS PHASE FLUXLESS SOLDERING, CHEMISTRY AND APPLICATIONS Stephen M. Bobbio, Thomas D. DuBois, and Robert F. Lipscomb  Abstract
LEAD-FREE SOLDER DURABILITY TESTING AT ACCELERATED THERMAL EXCURSIONS FOR QFN AND DFN PACKAGE INTERCONNECTS Steve Sytsma and Mark Wrightson  Abstract
FROM PRINTING TO REFLOW: PROCESS DEVELOPMENT FOR 01005 ASSEMBLY Sudeep Nambiar, Daryl Santos, Vatsal Shah, Rita Mohanty, and Joe Belmonte  Abstract
INVESTIGATING DENDRITIC GROWTH USING A LOCALIZED EXTRACTION TECHNIQUE Terry Munson  Abstract
CLEANING PROCESS CONSIDERATIONS FOR ADVANCED PACKAGING DEVICES AND ASSEMBLY Thomas M. Forsythe and Michael Bixenman  Abstract
3D PACKAGING OF IMAGING AND MIXED FUNCTION ICs FOR NEXT GENERATION ELECTRONICS Vern Solberg  Abstract
POLYIMIDE BASED EMBEDDING TECHNOLOGY FOR RF STRUCTURES AND ACTIVE COMPONENTS Wim Christiaens, Bart Vandevelde, Steven Brebels, and Jan Vanfleteren  Abstract
OPTIMIZE OXYGEN LEVEL IN SEMI-INERT WAVE SOLDERING - NITROGEN CONSUMPTION COST DOWN Xiao Shenghan  Abstract
RESEARCH ON QFN ASSEMBLY PROCESS Zhenkai Qin and Shoukai Zhang  Abstract
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