SMTA International 2006 Proceedings

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TITLE AUTHOR
UPDATED SOLDER FATIGUE LIFE PREDICTION MODELS FOR SnAgCu SOLDER JOINTS Ahmer Syed  Abstract
REWORK SYSTEM-TO-SYSTEM PERFORMANCE CHARACTERIZATION Al Cabral  Abstract
NANOTECHNOLOGY AND ROOM TEMPERATURE ASSEMBLY Alan Rae and Andrew Skipor  Abstract
A NEW ENVIRONMENTALLY BENIGN METHOD FOR LEAD-FREE SOLDER DEFLUXING Albert J. Mastrangelo, Susan Chute, Jay Soma, Robe  Abstract
RoHS IMPLEMENTATION IN A CONTRACT ELECTRONICS MANUFACTURING ENVIRONMENT Amol S. Kane, Eric P. Griffen, and D.L. Santos, Ph  Abstract
“REWORK” TEST VEHICLES OF JCAA/JG-PP LEAD-FREE SOLDER PROJECT Ana L. Campuzano-Contreras  Abstract
INVESTIGATION OF THE FORWARD AND BACKWARD COMPATIBILITY OF SOLDER ALLOYS WITH COMPONENT FINISHES FOR HASL AND OSP PCB FINISH Anand Kannabiran, Elavarasan T. Pannerselvam, and  Abstract
INDUSTRY TAKES A PRO-ACTIVE APPROACH: THE AIA-AMC-GEIA LEAD-FREE ELECTRONICS IN AEROSPACE PROJECT WORKING GROUP Anthony J. Rafanelli and David Pinsky  Abstract
MODELING AND EXPERIMENTAL CORRELATION OF BGA SOLDER JOINTS UNDER PCB BENDING Anurag Bansal, Yuan Li, and Vadali Mahadev  Abstract
PROCESS CHARACTERIZATION FOR THE ASSEMBLY OF 01005 COMPONENTS Ashok Viswanathan, Krishnaswami Srihari, Ph. D., a  Abstract
AGING INDUCED VOID FORMATION AND ITS IMPACT ON THE MECHANICAL INTEGRITY OF SOLDER TO BARE Cu OR ENIG BGA SURFACE FINISHES B. Vaccaro, J. Osenbach, S. Gasper-Gerlach, G. Lib  Abstract
PROCESS FOR BLIND MICROVIA FILLING AND THROUGH HOLE METALLIZATION OF HIGH DENSITY INTERCONNECTS Bob Gallant  Abstract
FASTENING HARDWARE USING SURFACE MOUNT TECHNOLOGY Brian G. Bentrim, P.E.  Abstract
USING UNDERFILLS TO ENHANCE DROP TEST RELIABILITY OF Pb-FREE SOLDER JOINTS IN ADVANCED CHIP SCALE PACKAGES Brian Toleno, Ph.D., Dan Maslyk, and Tom White  Abstract
INFLUENCE OF PACKAGE CONSTRUCTION AND BOARD DESIGN VARIABLES ON THE SOLDER JOINT RELIABILITY OF SnPb AND Pb-FREE PBGA PACKAGES Brian Vaccaro, Dan Gerlach, Richard Coyle, Richard  Abstract
BUMP FREE FLIP CHIP ASSEMBLY USING EMBEDDED CHIP TECHNOLOGY Charles G. Woychik, Raymond A. Fillion, James Simp  Abstract
FLIP CHIP INTEGRATION OF A LARGE FORMAT ARRAY OF MOEMS Christine A. Allen, John Abrahams, Nick Costen, Larry Hess, Mary Li, Timothy Miller, S. Harvey Moseley, James Pontius, David Puckett, Eric Schulte*, and Christian Zincke  Abstract
BGA SOLDER VOID CORRELATION TO VIA-IN-PAD, VIA FILL, SURFACE FINISH, AND LEAD-FREE SOLDER – A PRELIMINARY REVIEW, PART THREE Chrys Shea, Rahul Raut, Lou Picchione, Quyen Chu,  Abstract
ELECTROMIGRATION OF SNPB FLIP CHIP SOLDER BUMPS WITH THICK NI/CU UNDER BUMP METALLIZATION Chun-Hong Chen, Chih Chen, Eric Lin, Yi-Cheng Liu,  Abstract
A STUDY OF COPPER DISSOLUTION DURING LEAD FREE PTH REWORK USING A THERMALLY MASSIVE TEST VEHICLE Craig Hamilton, Polina Snugovsky, and Matthew Kell  Abstract
EPIDEMIOLOGICAL STUDY ON Sn-Ag-Cu SOLDER: BENCHMARKING RESULTS FROM ACCELERATED LIFE TESTING Craig Hillman, Nathan Blattau, Ed Dodd, and Joelle  Abstract
KEY ISSUES IN SUPPORTING CUSTOMERS NOT TRANSITIONING TO LEAD FREE Curt Williams  Abstract
QUALITATIVE EVALUATION OF FLIP CHIP SOLDER BUMPS PRODUCED BY STENCIL PRINTING OF SOLDER PASTE ON VARIOUS ELECTROLESS NICKEL/GOLD METALLIZATIONS D. Manessis, R. Patzelt, H. Reichl, L. Boettcher,  Abstract
A UNIQUE PROCESS THAT ELIMINATES SOLDER DROSS Daniel (Baer) Feinberg  Abstract
EFFECTS OF PLASMA PRETREATMENT ON FLIP CHIP AND CSP SUBSTRATE LEVEL ASSEMBLY YIELD AND RELIABILITY Daniel Baldwin, Ph.D., Paul Houston, and Brian Lew  Abstract
CORRELATING THE PRESENCE OF POPCORNED BGA DEVICES POST REFLOW WITH SOLDER-BALL DIAMETER MEASUREMENTS FROM X-RAY INSPECTION David Bernard and Bob Willis  Abstract
LARGE AREA ARRAY PACKAGE LEAD-FREE REWORK STUDY David Geiger, Damone Phanavong, Todd Castello, and  Abstract
JCAA/JG-PP LEAD-FREE SOLDER TESTING FOR HIGH RELIABILITY APPLICATIONS: -55ºC to +125ºC THERMAL CYCLE TESTING David Hillman and Ross Wilcoxon  Abstract
TIN PEST PHENOMENA: A REAL WORLD TEST SCENARIO David Hillman, Mike Schmidt, and Bev Christian, Ph  Abstract
LEAD-FREE SOLDER ASSEMBLY FOR MIXED TECHNOLOGY CIRCUIT BOARDS David Suraski and Karl Seelig  Abstract
LEAD FREE MANUFACTURING, IS IT REALLY NEW? Donald Burr  Abstract
RELIABILITY STUDY OF LEAD-FREE SnAgCu SOLDER JOINTS VS. SnPb SOLDER JOINTS IN QFN PACKAGES Donghyun Kim, Mudasir Ahmad, and Sue Teng  Abstract
RELIABILITY EVALUATION OF PLATED-THROUGH HOLES FOR HIGH DENSITY PWB APPLICATION Donghyun Kim, Mudasir Ahmad, David Senk, Mason Hu,  Abstract
CHALLENGES TO DOING BUSINESS IN ASIA EFFECTIVELY Franz-Josef Kahlen  Abstract
A STUDY OF COPPER DISSOLUTION IN Pb-FREE SOLDER FOUNTAIN SYSTEMS Fritz Byle, Denis Jean, and Dale Lee  Abstract
IMPACT OF LEAD-FREE PCB SURFACE FINISHES ON MICROVOIDING Guhan Subbarayan, Purushothaman Damodaran, Krishna  Abstract
THE EFFECTS OF CURE PROFILE UPON THE PROPERTIES AND THERMO-MECHANICAL RELIABILITY OF FLIP CHIP UNDERFILL Guoyun Tian, Chang Lin, Jeffrey C. Suhling, Pradee  Abstract
LEAD-FREE SOLDER ALLOY OPTIMIZATION FOR IMPROVED RELIABILITY H.-J. Albrecht and M. Löffler  Abstract
EFECTIVE LEAN SIX SIGMA DEPOYMENT IN A GLOBAL ELECTRONICS MANUFACTURING SERVICES ENVIRONMENT Harjinder Ladhar  Abstract
ASSESSING THE RELIABILITY OF AREA ARRAY CONNECTORS Heather McCormick and George Riccitelli  Abstract
MIXING METALLURGY: RELIABILITY OF SAC BALLED AREA ARRAY PACKAGES ASSEMBLED USING SnPb SOLDER Heather McCormick, Polina Snugovsky, Zohreh Bagher  Abstract
IMPLEMENTING LEAD FREE IN A MANUFACTURING ENVIRONMENT: FROM TEST VEHICLE DESIGN TO HIGH VOLUME ASSEMBLY Heather McCormick, Simin Bagheri, Craig Hamilton,  Abstract
MANUFACTURABILITY AND RELIABILITY OF HIGH-SPEED BGA CONNECTORS USING SnPb, MIXED SOLDERING, AND LEAD-FREE PROCESSES Hien Ly, Doug Prosenik, and Scott Priore  Abstract
DEVELOPMENT OF MULTILAYER FLEX SUBSTRATE WITH LIQUID CRYSTAL POLYMER FILM Hiroyuki Okabe, Nagayoshi Matsuo, Kenji Saito, and  Abstract
THE EFFECT OF PACKAGING MATERIAL AND PROCESS ON DEVICE PERFORMANCE OF LIGHT EMITTING DIODE Hyungkun Kim, Yu-Sik Kim, Jeong Wook Lee, Sukho Yo  Abstract
AN EXPERIMENTAL STUDY OF PRESS-FIT INTERCONNECTION ON LEAD FREE PLATING FINISHES Ila Pal and Elena Smolentseva  Abstract
BACKWARD COMPATIBILITY, ARE WE READY - A CASE STUDY Indraneel Chatterji  Abstract
CMMI LEVEL 5 ACHIEVEMENT USING SIX SIGMA Jeevanantham Arumugam  Abstract
THE EFFECT OF SURFACE MOUNTING PROCESS ON WHISKER GROWTH IN IC PACKAGE Jeffrey C.B. Lee and C.G. Tyan  Abstract
RELIABILITY STUDY OF LEAD-FREE AREA ARRAY PACKAGES WITH TIN-LEAD SOLDERING PROCESSES Jennifer Nguyen, David Geiger, Daniel Rooney, Ph.D  Abstract
EQUALIZING PROCESS CYCLE TIME AND PROCESS THROUGHPUT, THE KEY TO “WORLD CLASS MANUFACTURING” Joe Belmonte and Rita Mohanty  Abstract
PROCESS DEVELOPMENT FOR 01005 LEAD-FREE PASSIVE ASSEMBLY: STENCIL PRINTING Joe Belmonte, Vatsal Shah, Rita Mohanty, Ph.D., Ti  Abstract
BONDING TECHNIQUES IN WAFER FABRICATION Karthik Tondapu  Abstract
SOLIDIFICATION BEHAVIOUR OF LEAD-FREE ALLOYS AND ITS RELATIONSHIP TO THEIR PERFORMANCE AS PRACTICAL SOLDERS Keith Sweatman and Tetsuro Nishimura  Abstract
WiFi, WiMax, WiMe? Kenneth D. Cornett  Abstract
PORTABLE XRF FOR ROHS COMPLIANCE AND Pb-FREE SOLDERING Kimberley A. Russell, Drew Hession-Kunz, and Brend  Abstract
A CASE STUDY ON Pb-FREE PROCESS AND MATERIAL CHALLENGES IN THE ASSEMBLY OF LARGE FINE-PITCH BGA COMPONENTS King Gonzalez, Ramgopal Uppalapati, Vasu Vasudevan  Abstract
DEVELOPMENT OF A 3D WAFER-LEVEL RE-ROUTING USING DIELECTRIC LAMINATION TECHNOLOGY L. Boettcher, A. Ostmann, Dionysios Manessis, Davi  Abstract
DOE RESULTS FOR LEAD-FREE SOLDER PROCESS DEVELOPMENT FOR HARSH ENVIRONMENT CONSIDERATIONS Lance A. Brack, Mradul Mehrotra, Emmanuel J. Siméu  Abstract
MANAGING RISK IN OUTSOURCED PRODUCT DEVELOPMENT AND MANUFACTURING Larry Fleming  Abstract
PACKAGE ON PACKAGE (PoP) STACKING AND BOARD LEVEL RELIABILITY RESULTS Lee Smith, Moody Dreiza, and Akito Yoshida  Abstract
RELIABILITY STUDY AND SOLDER JOINT MICROSTRUCTURE OF VARIOUS SnAgCu CERAMIC BALL GRID ARRAY (CBGA) GEOMETRIES AND ALLOYS Marie Cole, Matthew Kelly, Mario Interrante, Grego  Abstract
LEAD-FREE HAND SOLDERING: NEW TECHNOLOGIES FOR ENHANCING THE WEAKEST LINK IN THE LEAD-FREE REWORK AND REPAIR PROCESS CONTROL CHAIN Mark Cannon, Bob Klenke, and Phil Zarrow  Abstract
A SIMULTANEOUS AND SELECTIVE MICROWAVE SUPPORTED SOLDERING TECHNOLOGY Mathias Nowottnick, Wolfgang Scheel, Uwe Pape, Rolf Diehm, Joachim Wiese, Wolfgang Kempe, Marcel Mallah, Manfred Suppa, Peter Fink  Abstract
LEAD FREE PERFORMANCE OF FA-18 ELECTRONICS THROUGH MANUFACTURE Matthew Hamand  Abstract
MANUFACTURING IMPROVEMENTS ENABLED BY NEW LOW-PRESSURE MOLDING PROCESS Michael J. Pierce and Reimer Hansen  Abstract
IMPROVED BGA SHOCK AND BEND PERFORMANCE USING CORNER GLUE EPOXIES Michael Kochanowski and Brian Toleno  Abstract
ENABLING HIGH DENSITY SYSTEM IN PACKAGE (SiP) MANUFACTURING AND CONSUMER ELECTRONIC DEVICES THROUGH THE USE OF JETTING TECHNOLOGY TO MINIMIZE SUBSTRAT Michael Peterson and Steven J. Adamson  Abstract
NEW COATING TECHNOLOGIES AND ADVANCED TECHNIQUES IN CONFORMAL COATING Michael Szuch, Alan Lewis, and Hector Pulido  Abstract
OPTIMIZED STATIC AND DYNAMIC DRIVING FORCES FOR REMOVING FLUX RESIDUE UNDER FLUSH MOUNTED CHIP CAPS Mike Bixenman and Steve Stach  Abstract
AN EXPERIMENTAL METHOD TO INVESTIGATE TRUE STRESS DURING THE FATIGUE OF LEAD-FREE SOLDERS Milos Dusek and Chris Hunt  Abstract
AGING EFFECTS ON DYNAMIC BEND TEST PERFORMANCE OF Pb-FREE SOLDER JOINTS ON Ni/Au FINISH Min Ding and Adriana Porras  Abstract
A NEW METHODOLOGY TO PREDICT AND MINIMIZE MOLTEN SOLDER JOINT OPENS AND SHORTS DURING REFLOW Mudasir Ahmad, Ken Hubbard, and Sue Teng  Abstract
EFFECT OF UNDERFILL MATERIAL PROPERTIES ON LOW-K DIELECTRIC, FIRST AND SECOND LEVEL INTERCONNECT RELIABILITY Mudasir Ahmad, Sue Teng, and Jie Xue  Abstract
PLANAR MICROVOIDING IN LEAD-FREE SECOND-LEVEL INTERCONNECT SOLDER JOINTS Muffadal Mukadam, Norman Armendariz, Raiyo Aspandi  Abstract
ON AGING EFFECT OF FLIP CHIP SOLDER BUMPS Mukul Joshi and Raghunandan Chaware  Abstract
EFFECT OF INERT ATMOSPHERE REFLOW AND SOLDER PASTE VOLUME ON THE MICROSTRUCTURE AND MECHANICAL STRENGTH OF MIXED Sn-Ag-Cu AND Sn-Pb SOLDER JOINTS Mulugeta Abtew, Robert Kinyanjui, Ph.D., Narong Nu  Abstract
FIRST ORDER FAILURE MODEL FOR LEADLESS CERAMIC CHIP DEVICES WITH PB-FREE SOLDER Nathan Blattau and Craig Hillman  Abstract
RAPID POWER CYCLING OF Pb-FREE SOLDERED COMPONENTS Nathan Blattau, Danko Priimak, Joelle Arnold, and  Abstract
LEVEL 2 RELIABILITY ASSESSMENT OF THE SLC™ PACKAGE USING 90nm SILICON TECHNOLOGY Nicole Butel  Abstract
LEVEL 2 RELIABILITY ASSESSMENT OF THE SLC™ PACKAGE USING 90nm SILICON TECHNOLOGY Nicole Butel  Abstract
ACCELERATION FACTORS FOR LEAD-FREE SOLDER MATERIALS Olli Salmela  Abstract
CRACK GROWTH ANALYSIS OF LEAD FREE PASSIVE COMPONENT ASSEMBLIES Paresh Limaye, Konstantina Lambrinou, Bart Vandeve  Abstract
EFFECTS OF ACCELERATED STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, Edwin Lopez, R. Wayne Buttry, Alice K  Abstract
THE EFFECTS OF PLATING PARAMETERS ON THE MICROSTRUCTURE AND WHISKER GROWTH PROPENSITY OF PURE Sn FINISH Peng Su, Song Bai, Min Ding, and Sheila Chopin  Abstract
FAILURE MECHANISM OF SAC 305 AND SAC 405 IN HARSH ENVIRONMENTS AND INFLUENCE OF BOARD DEFECTS INCLUDING BLACK PAD Polina Snugovsky, Zohreh Bagheri, Heather McCormic  Abstract
LIFE PREDICTION AND DAMAGE EQUIVALENCY FOR SHOCK SURVIVABILITY OF ELECTRONIC COMPONENTS Pradeep Lall, Dhananjay Panchagade, Deepti Iyengar  Abstract
COOLING RATE OPTIMIZATION AND RELIABILITY OF Pb-FREE Sn-Ag-Cu STACKED BGA MODULES R. Kinyanjui, M. Abtew1 and K. Sprinkle  Abstract
VOIDS IN SOLDER JOINTS Raiyo F. Aspandiar  Abstract
BOARD-LEVEL THERMAL CYCLING AND MECHANICAL BEND RELIABILITY OF HiCTE FLIP-CHIP BGAS WITH MULTIPLE BGA PAD SURFACE FINISHES Rajiv Dunne, Kejun Zeng, Sergio Martinez, Venu Cha  Abstract
M3: MULTISCALE ASSEMBLY AND PACKAGING SYSTEM FOR MOEMS Rakesh Murthy, Aditya Das, Dan Popa, and Manoj Mit  Abstract
ASSEMBLY CHALLENGES OF PACKAGE-ON-PACKAGE (PoP) Richard Boulanger  Abstract
LEAD FREE WAVE SOLDERING AT ITS BEST Rita Mohanty, Ph.D. and Ken Kirby  Abstract
LEAD FREE WAVE SOLDERING AT ITS BEST Rita Mohanty, Ph.D. and Ken Kirby  Abstract
MECHANICAL TESTING OF SOLDER JOINT ARRAYS VERSUS BULK SOLDER SPECIMENS Robert Darveaux  Abstract
APPLICABILITY OF VARIOUS Pb-FREE SOLDER JOINT ACCELERATION FACTOR MODELS Ron Zhang and Jean-Paul Clech  Abstract
EMERGING OPPORTUNITIES AND CHALLENGES FOR HIGH FREQUENCY BROADBAND COMMUNICATIONS Rudy Emrick, Steve Franson, John Holmes, Bruce Bosco, Steve Rockwell  Abstract
PROCESS DESIGN AND DEVELOPMENT FOR STENCIL PRINTING REPRESENTATIVE FEATURES OF A MICRO BATTERY CURRENT COLLECTOR LAYER Sameer Paranjape, Saurabh Nanavati and Dr. David L  Abstract
THERMO-MECHANICAL RELIABILITY OF FLIP-CHIP DEVICES-ONMETAL BACKED FLEX CIRCUITS Sandesh Rudrapati and Pradeep Lall  Abstract
DESIGN FOR BGA LEAD-FREE SOLDER JOINT RELIABILITY Scott K. Buttars  Abstract
PACKAGING OF POWER LEDS USING THERMOSONIC BONDING OF Au-Au INTERCONNECTS Seck-Hoe Wong, Mooi Guan Ng, Mee-Lee Yong, Noorals  Abstract
EFFECT OF OXYGEN CONCENTRATION DURING REFLOW ON TOMBSTONING FOR PASSIVE RESISTORS FOR LEAD-FREE ASSEMBLIES Srinivasa Aravamudhan, Marc Apell, Joe Belmonte, G  Abstract
PRECISION COATING DEPOSITION TECHNIQUES FOR CONFORMAL COATING APPLICATIONS Stuart Erickson  Abstract
BASED ON EXAMINATION OF SOLDER WETTING CHARACTERISTICS AND PERFORMANCE Sven Lamprecht and Kuldip Johal  Abstract
ASSEMBLY PROCESS RESEARCH ON 01005 CHIP COMPONENTS IN LEAD-FREE SYSTEM Syber Chen, Xi Cao, Junwen Jin and Fujiang Sun  Abstract
ELECTRICAL LEAKAGE FAILURES DUE TO ENTRAPPED FLUX BELOW A QFN PACKAGE Terry Munson  Abstract
JCAA/JG-PP LEAD-FREE SOLDER PROJECT: -20°C to +80°C THERMAL CYCLE TEST Thomas A. Woodrow, Ph.D.  Abstract
TRACER DIFFUSION IN WHISKER-PRONE TIN PLATINGS Thomas A. Woodrow, Ph.D.  Abstract
EVALUATION OF CONFORMAL COATINGS AS A TIN WHISKER MITIGATION STRATEGY, PART II Thomas A. Woodrow, Ph.D. and Eugene A. Ledbury  Abstract
H.A.L.T. TEST VEHICLE FOR LEAD FREE SURFACE FINISH AND SOLDER PASTE SELECTION Tim Murphy  Abstract
MATHEMATICAL MODELING OF SOLDER PASTE STENCILING FOR PROCESS CONTROL Tim Wright  Abstract
CONFORMAL COATING PROCESS CONTROL AS IT RELATES TO TEMPERATURE AND HUMIDITY Timothy Harmon  Abstract
RELIABILITY OF SPACE FLIGHT CRYSTAL CONTROLLED OSCILLATOR USING LEAD-FREE SURFACE MOUNT TECHNOLOGY Todd H. Treichel  Abstract
EMS ACQUISITION INTEGRATION – CREATING OPERATIONAL SYNERGY WHILE STAYING ALIGNED WITH ACQUIRED CUSTOMER EXPECTATIONS Todd M. Baggett  Abstract
PROCESS CHARACTERIZATION OF THE 01005 (ENGLISH) COMPONENT PACKAGE Tom Borkes and Lawrence Groves  Abstract
DEFLUXING OF EUTECTIC AND LEAD-FREE ASSEMBLIES IN A SINGLE CLEANING PROCESS Umut Tosun, M.S., Harald Wack, Ph.D, Joachim Becht  Abstract
HIGH TEMPERATURE LEAD-FREE SOLDERING IMPACT ON END PRODUCT RELIABILITY Vern Solberg  Abstract
RHEOLOGICAL EFFECTS IN UNDERFILL JET-DISPENSING Vinod Mohan, Paul Morganelli, Ph.D., Bryon Stevens  Abstract
CONTROL OF THE WARPAGE FOR PACKAGE-ON-PACKAGE (PoP) DESIGN Wei Lin, Akito Yoshida, Moody Dreiza, Takahiro Yam  Abstract
NOVEL SACX SOLDERS WITH SUPERIOR DROP TEST PERFORMANCE Weiping Liu, Ph.D and Ning-Cheng Lee, Ph.D  Abstract
STENCIL PERFORMANCE COMPARISON / AMTX ELECTROFORM VS. LASER-CUT ELECTROFORM NICKEL FOIL William E. Coleman Ph.D. and Michael R. Burgess  Abstract
IMPORTANCE OF ROBUST TEST METHODS FOR ACHIEVING RoHS COMPLIANCE William Olson, Ph.D.  Abstract
CONNECTING THE UNCONNECTED - BROADBAND WIRELESS ACCESS TECHNOLOGIES AND NETWORK Xin Meng  Abstract
SOLDER PASTE INSPECTION STUDY WITH SPI AND AXI Zhen (Jane) Feng, Ph.D., Alex Garcia, Thomas Munne  Abstract
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