Pan Pacific Symposium 2006 Proceedings

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TITLE AUTHOR
DESIGN OF EMC-INTEGRATED DEVICES FOR WIRELESS SENSOR NETWORKS A. Gandelli, D. Monopoli, M. Mussetta, R. E. Zich,  Abstract
SENSOR PACKAGING IN HARSH ENVIRONMENT A. Gandelli, F. Grimaccia and R.E. Zich  Abstract
CONDUCTIVE INK JETTABLE METAL AND NONMETAL NANOSYSTEMS Alan Rae & Dana Hammer-Fritzinger  Abstract
ADVANCES IN JETTING SMALL DOTS OF HIGH VISCOSITY FLUIDS FOR ELECTRONIC AND SEMICONDUCTOR PACKAGING Alec J. Babiarz  Abstract
Pb-FREE BGA SOLDER BALL ATTACH ASSEMBLY RESEARCH: A RETROSPECTIVE OF 5 YEARS OF STUDY Amol Kane, D.L. Santos, and Vatsal Shah  Abstract
IMPROVED RELIABILITY OF HI-Q RF FILTERS (SAW AND BAW) FOR RF SIP (SYSTEM-IN-PACKAGE) MODULES Andrew Kay, Tim Walters, Vijay Vijayakumar, and Atsushi Takano  Abstract
FLEXIBLE CIRCUIT ATTACH PROCESS FOR CAMERA MODULE Asif R. Chowdhury, Jin Seong Kim, Young Duck Yoon  Abstract
COMPARISON OF NEAR-EUTECTIC SnPb AND SnAg SOLDER PLATING FOR WLP APPLICATIONS Bioh Kim, Charles Sharbono, Tom Ritzdorf, and Dan  Abstract
SOLDERBALL™ PIN TECHNOLOGY PROVIDES SMT REFLOW SOLUTION TO CO-PLANARITY INTERCONNECTION ISSUES FOR PCB –BASED SUB-ASSEMBLIES Carlos Juvera  Abstract
THERMO-ELECTROMIGRATION STUDY OF LEAD-FREE SOLDER BUMPS Chien Chen Lee, Kou Ning Chiang, Kuo Ming Chen, an  Abstract
BGA SOLDER VOID CORRELATION TO VIA-IN-PAD, VIA FILL, SURFACE FINISH, AND LEAD-FREE SOLDER – A PRELIMINARY REVIEW Chrys Shea, Rahul Raut, Quyen Chu, Nicholas Tokotc  Abstract
NEW TRENDS FOR PWB SURFACE FINISHES IN MOBILE PHONE APPLICATIONS Claus Würtz Nielsen, Dr. Anette Alsted Rasmussen,  Abstract
3D PACKAGING ENABLED WITH ELECTROCHEMICAL DEPOSITION TECHNIQUES FROM VARIED ELECTRONIC INDUSTRY SEGMENTS Dan Schmauch, Bioh Kim, and Tom Ritzdorf  Abstract
PROCESSING AND RELIABILITY OF HIGH PERFORMANCE FLIP CHIP ON FLEX MODULES Daniel F. Baldwin, Ph.D., Jennifer Muncy, Paul Houston and Brian Lewis  Abstract
THREE DIMENSIONAL HETEROGENEOUS CHIP INTEGRATION PROCESS David R. Scheid  Abstract
INK-JET AS A MEMS MANUFACTURING TOOL David Wallace, Donald Hayes, Ting Chen, Virang Sha  Abstract
THE THERMAL PROPERTIES OF WLCSP SOLDER ATTACH Dennis Lang  Abstract
FROM HALT AND HASA TO INTERCONNECT RELIABILITY Dr. Paul P.E. Wang, Ferdie Lizardo, Setareh Siavas  Abstract
INTERCONNECT AND THERMAL SYSTEM RELIABILITY FOR PROCESSOR UNITS Dr. Paul P.E. Wang, Julia Purtell, and Michael Mil  Abstract
DESIGN OF EMC-INTEGRATED DEVICES FOR WIRELESS SENSOR NETWORKS E. Alfassio Grimaldi, A. Gandelli, and R. E. Zich  Abstract
IMPROVE YIELDS WITH AN ENHANCED X-RAY INSPECTION IMAGING CHAIN Friedhelm W. Maur  Abstract
MAXIMIZING THE “VALUE-ADD” OF THE ELECTRONICS MATERIALS PARTNER George A. Toskey  Abstract
LEAD-FREE PRODUCT AND PROCESS CONVERSION PHASE III. WAVE SOLDERING PROCESS OPTIMIZATION AND PCB THERMAL MANAGEMENT Hana Hsu, Jerry Peng, Anching Chien, Leimo Chen, B  Abstract
A STUDY OF RELIABILITY DROP TEST EFFECTS FOR SnAgCu SOLDER BUMP IN SYSTEM-IN-PACKAGE AND BOARD LEVEL PACKAGE Hsiang-Chen Hsu, Yu-Chia Hsu, Hui-Yu Lee, Shen-Li  Abstract
EVALUATION OF EMBEDDED DEVICES USING ACOUSTIC MICRO IMAGING Janet E. Semmens  Abstract
RELIABILITY TESTING OF 9x9 QFN PACKAGES WITH INTERNAL POWER FOR HARSH ENVIRONMENT ELECTRONICS John Evans, Ph.D., Elliot McBride, Charles Mitchel  Abstract
A GIANT STEP IN ASSEMBLY COST REDUCTION USING BREAKTHROUGH LAP Junichi Kasai  Abstract
C4NP: LEAD-FREE AND LOW COST SOLDER BUMPING TECHNOLOGY FOR FLIP CHIP AND WLCSP Klaus Ruhmer, Daniel Fleming, Ph.D., and Peter Gru  Abstract
PERFORMANCE AND RELIABILITY EVALUATION OF ALTERNATIVE SURFACE FINISHES FOR WIRE BOND AND FLIP CHIP BGA APPLICATIONS Kuldip Johal, Hugh Roberts, Kishor Desai, Q.H. Low  Abstract
QUALITY AND RELIABILITY CHALLENGES FOR LARGE DIE FLIP CHIP BGA APPLICATIONS Kumar Nagarajan, Mukul Joshi, and Nael Zohni  Abstract
EPOXY/BaTiO3 (SrTiO3) COMPOSITE FILMS AND PASTES FOR HIGH DIELECTRIC CONSTANT AND LOW TOLERANCE EMBEDDED CAPACITORS IN ORGANIC SUBSTRATES Kyung-Wook Paik, Jin-Gul Hyun, Sangyong Lee, and Kyung-Woon Jang  Abstract
MIXED ASSEMBLY PROCESS DEVELOPMENT & RELIABILITY QUALIFICATION L. Pymento, W.T. Davis, and T. Godown  Abstract
PASTE PRINTING OPTIMIZATION WITH DUAL SQUEEGEES AND INTEGRAL WIPING SYSTEM Mark J. Curtin and Thomas B. Feeney  Abstract
STRAIN GAGE TESTING: THE REQUIRED TOOLS AND DATA SET FOR MANUFACTURING HIGH RELIABILITY HARDWARE Mark T. McMeen  Abstract
RELIABILITY OF CHIP ON CHIP PACKAGES USING THERMO-COMPRESSION BONDING TECHNOLOGY BETWEEN Au PLATING BUMPS Masamoto Tago, Kenji Nanba, Takashi Miyazaki, Seiy  Abstract
NON-INVASIVE SOLDERABILITY TESTS FOR LEAD–FREE PACKAGING Michael Pavlov, Peter Bratin, Eugene Shalyt, Karsten Andrae, Chenting Lin, and Tien Ai Wee  Abstract
INTEGRATING QUALITY CONTROL TOOLS WITH PLANNING MODULES IN ERP SYSTEMS P. Bhargava, J. Sturek, R. Murcko & K. Srihari, J.  Abstract
EFFECTS OF ACCELERATED STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, Edwin Lopez, R. Wayne Buttry, Alice K  Abstract
NANO SOP FOR ULTRA-MINIATURIZED ELECTRONIC AND BIO-ELECTRONIC SYSTEMS Rao Tummala, P. Markondeya Raj, D. Janagama Goud a  Abstract
LEAD-FREE BGA PAD DESIGN: A COMPARITIVE STUDY OF THE AFFECT OF PAD DIMENSIONS ON THE ATTACHMENT OF AREA ARRAY PACKAGES UTILIZING LEAD-FREE SOLDER PROCESSES AND VARIOUS PASTE PRINT METHODS Ray Cirimele  Abstract
ION MILLING AS AN ALTERNATIVE TO FOCUSED ION BEAM FOR CROSS-SECTION INTERMETALLIC ANALYSES Roger J. Stierman, Becky Holdford, and Maricel Fab  Abstract
PLASMA TREATMENT TECHNOLOGY FOR CAPILLARY UNDERFILL Ryota Furukawa  Abstract
BOTTLENECK ORIENTED CAPACITY PLANNING THROUGH ERP SYSTEMS AT AN EMS PROVIDER S. Ramakrishnan and K. Srihari  Abstract
DESIGN OF MICROSTRIP MICROWAVE FILTERS USING ENHANCED PSO ALGORITHMS S. Selleri, M. Mussetta, R. E. Zich, and P. Pirino  Abstract
SUMMARY OF NEW ENGLAND LEAD FREE CONSORTIUM IMPLEMENTATION PLAN OF HIGH VOLUME ASSEMBLY OF PRINTED WIRING BOARDS Sammy Shina, Greg Morose, Liz Harriman, Richard An  Abstract
REFLOW PROFILE OPTIMIZATION FOR MINIMIZING FATIGUE FAILURES ON LEAD-FREE ASSEMBLIES USING ALLOY 42 BASED LEAD-FREE TSOP PACKAGES Satyanarayan Iyer, Shaon Baqui, and Zaidy Ismail  Abstract
RELIABLE ELECTRONICS PACKAGE PROTOTYPING WITH NANO-PARTICLE METAL INTERCONNECTION Sungchul Joo and Daniel F. Baldwin  Abstract
CONTROLLING LOCALIZED CONTAMINATION ON MICROELECTRONIC ASSEMBLIES WITH THE CHANGE TO LEAD FREE ASSEMBLY Terry Munson  Abstract
CLEANING ISSUES ASSOCIATED WITH LEAD FREE SOLDERING MATERIALS PHASE II Thomas M. Forsythe  Abstract
GOOD LIFE-TEST DATA, HOW TO CREATE AND EVALUATE IT Tom Clifford  Abstract
TRANSITION TO Pb-FREE ALLOYS IN CAPACITOR FILTER ASSEMBLIES Vatsal A. Shah, Amol S. Kane, Daryl L. Santos, Mik  Abstract
ADVANCED PACKAGE STACKING TECHNOLOGIES - IC Package Qualification Testing for Lead-Free Soldering Vern Solberg, Craig Mitchell, and Gordon Gray  Abstract
THIN FILM MEASUREMENT AND OUTGASSING STUDY OF ADHESIVES USED IN OPTICAL MEMS DEVICES Vijay Sundermurthy, Frank Andros, Ph.D., and Nagen  Abstract
MATERIALS AND PROCESSES FOR MEMORY CARDS Wei Koh, PhD, Evelyn Baldwin, Steve Meischke, and  Abstract
EVALUATION OF SOCKET CONTACT FAILURE FOR BGA PACKAGE Yu-Jung Huang, Sun-Lon Jen, Shen-Li Fu, Ming-Kun C  Abstract
FAILURES IN SEMICONDUCTOR DEVICE ENCAPSULATED WITH RED PHOSPHORUS FLAME RETARDANT Yuliang Deng and Michael Pecht  Abstract
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