2002 Telecom Hardware Solutions Proceedings

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TITLE AUTHOR
ASSEMBLY OF TELECOM HARDWARE MODULES BASED ON INNOVATIVE CAPILLARY CONNECTION TECHNOLOGYTM (C2-TECHNOLOGYTM) A. Taran, A. Belov, Ph.D. V. Krivoshapko  Abstract
MSA EFFECTS ON OPTOELECTRONIC DEVICE PACKAGING Amy Dugan  Abstract
PARTITIONING EFFICIENCY FOR MOBILE APPLIANCES Charles E. Bauer, Ph.D.  Abstract
OPTIMIZING TEST STRATEGIES DURING PCB DESIGN FOR BOARDS WITH LIMITED ICT ACCESS Charles Robinson & Amit Verma  Abstract
DATA TRANSPORT OVER SONET/SDH (DOS) Charlie Roach  Abstract
THE FOUNDATION BLOCKS FOR THE NEXT GENERATION NETWORK ELEMENTS Charlie Roach  Abstract
LIFE PREDICTION OF LEAD FREE SOLDER JOINTS FOR HANDHELD PRODUCTS D. Xie, et al.  Abstract
EMI SHIELDING TEST METHOD FOR SMALL WIRELESS DEVICES David Rich, et al.  Abstract
DIRECT PART MARKING IN CIRCUIT BOARD ASSEMBLY AND TEST David S. Thorpe  Abstract
LOW COST OPTOELECTRONIC COMPONENT FABRICATION AND PACKAGING Donald J. Hayes, Ting Chen and W. Royall Cox  Abstract
CFD-BASED DESIGN AND OPTIMIZATION OF A 1U MOTORIZED IMPELLER FOR TELECOM APPLICATIONS Dr. I.F. Obinelo  Abstract
SPLICING LOSS CONTROL AND ASSEMBLY YIELD MANAGEMENT Dr. Katsuji Takasu  Abstract
ACCELERATED LIFE TESTING AND ITS INTERACTION WITH QUALIFICATION TESTS Ephraim Suhir  Abstract
SOLUTIONS TO MEET HAND-HELD MARKET’S REQUIREMENT FOR LOW COST ADVANCED REFLOW AND ENVIRONMENTALLY SENSITIVE PACKAGING Fonzell Martin and Trent Thompson  Abstract
OPTOELECTRONIC FINGERPRINT SENSOR FOR MOBILE PHONES Guy Immega, Niall Parker  Abstract
A VIEW OF TOMORROW’S OPTICAL PACKAGING TECHNOLOGY Harry Bonham  Abstract
DESIGN, MANUFACTURABILITY AND COST CONSIDERATIONS FOR BASEBAND AND MEMORY STACKED DIE SYSTEM IN PACKAGE SOLUTIONS Jeannie Miller, Trent Thompson & Mark Gerber  Abstract
RF MEMS DEVICES FOR WIRELESS COMMUNICATION Jeong-Bong Lee, et al.  Abstract
LOW PROFILE TRANSFORMERS USING LOW TEMPERATURE CO-FIRE MAGNETIC TAPE John Bielawski, et al.  Abstract
A NOVEL APPROACH TO THERMAL MANAGEMENT AND EMI SHIELDING VIA A METALLIC CONFORMAL COATING ON A PLASTIC HOUSING John Hannafin  Abstract
THERMAL PERFORMANCE OF PACKAGES USED FOR A "XAUI" HIGH SPEED INTERFACE Keith Bailey and Roger Emigh  Abstract
HERMETIC VS. NON-HERMETIC OPTOELECTRONIC PACKAGING: MEETING, NOT EXCEEDING APPLICATION REQUIREMENTS Leo M. Higgins III, Ph.D.  Abstract
PCB DESIGN OPTIMIZATION OF 0201 PACKAGES FOR ASSEMBLY PROCESSES M. Wang, et al.  Abstract
PROGRESSION TOWARDS A FULLY INTEGRATED RF TRANSCEIVER MODULE Mark V. Christensen  Abstract
ASSESSING THE EFFECT OF FINE PITCH BGA PACKAGES ON MOTHERBOARD DESIGN AND BOARD LEVEL RELIABILITY Michael Leoni & David Patten  Abstract
PLANAR MAGNETIC DEVICES SOLUTIONS FOR TODAYS HIGH DENSITY DISTRIBUTED POWER APPLICATIONS P. Harding, C. Tapscott, R. Visan and G. Corfar  Abstract
THERMAL INTERFACE MATERIAL SOLUTIONS FOR TELECOM COMPONENTS Paul A. Berry, PE, and Jesus Marin  Abstract
SYNTHESIZER-BASED HIGH FREQUENCY, LOW PHASE JITTER OSCILLATOR DESIGN Thomas Knecht  Abstract
HISTORY, TRENDS AND ISSUES RELATED TO MICROPROCESSOR PACKAGES USED IN HANDHELD WIRELESS PRODUCTS Tom Gregorich and Edward Reyes  Abstract
X-RAY INSPECTION FOR OPTOELECTRONIC COMPONENTS - THE ROLE OF ADVANCED DETECTOR TECHNOLOGY Vikram Butani  Abstract
SWITCHED BLAZED GRATING FOR OPTICAL NETWORKING W. Duncan, et al.  Abstract
NOVEL PACKAGING APPROACHES FOR MINIATURE ANTENNAS Will McKinzie, et al.  Abstract
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