1998 Emerging Technologies Proceedings

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TITLE AUTHOR
DEVELOPMENT OF RELIABLE ASSEMBLY METHODOLOGY AND MATERIALS FOR A ROBUST FLIP CHIP ON ORGANIC LAMINATES Abhay Maheshwari  Abstract
MULTILAYER HIGH DENSITY FLEX INTERCONNECT BILL CHOU  Abstract
AN SMT PROCESS MONITOR FOR HIGH-DENSITY PACKAGING FRANK SILVA  Abstract
PREDICTING ASSEMBLY COSTS BEFORE DESIGN WITH THE DESIGN REPORT CARD Happy T. Holden  Abstract
NEW BUILD-UP PRINTED WIRING BOARD FOR FLIP CHIP ATTACH BASED ON UNIQUE HIGH Tg EPOXY RESIN HIROAKI FUJIWARA  Abstract
RELIABILITY EVALUATION OF ULTRA CSPTM PACKAGES Hong Yang  Abstract
MEASUREMENT OF STEADY AND TRANSIENT RHEOLOGICAL PROPERTIES OF A FLIP-CHIP FILLET MATERIAL J. Wang  Abstract
ADVANCED INTERCONNECT ROADMAP FOR SPACE APPLICATIONS LISSA GALBRAITH  Abstract
STUDIES ON THE ENHANCED THERMAL PERFORMANCE OF INTEGRATED PACKAGES USING HIGH CONDUCTIVITY MOLDING COMPOUNDS Maurice J. Marongiu  Abstract
APPLICATIONS AND TECHNOLOGY TRENDS FOR CHIP SCALE AND NEAR CHIP SCALE PACKAGES Paul Hoffman  Abstract
FLUX-FREE PROCESS FOR PLACEMENT AND ATTACH OF SOLDER BALLS TO WAFERS, FLIP CHIPS AND ALL BGA PACKAGES RICHARD RAMOS  Abstract
CHIP SCALE PACKAGE DESIGN CHALLENGES ROBERT L. HUBBARD  Abstract
MANUFACTURING TIPS AND TOOLS FOR CHIP SCALE PACKAGING RON BAUER  Abstract
BGA RELIABILITY OF LARGE ORGANIC FLIP-CHIP CARRIERS RONALD POFAHL  Abstract
A LOW COST WAFER BUMPING PROCESS FOR FLIP CHIP APPLICATIONS Scott F. Popelar  Abstract
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