Surface Mount International 1998 Proceedings

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TITLE AUTHOR
TECHNOLOGY VISION ANALYSIS 2010: SPONSORED BY THE SURFACE MOUNT COUNCIL Abstract
MAKING SENSE OF CSPS AND BGAS THROUGH TECHNICAL COST MODELING Adam T. Singer  Abstract
THE FUTURE OF VACUUM DISPENSING FOR CHIP SCALE PACKAGES Allen Duck  Abstract
ASSEMBLY AND INTERCONNECT RELIABILITY OF BGA ASSEMBLED ONTO BLIND MICRO AND THROUGH-HOLE DRILLED VIA IN PAD Andrew Mawer  Abstract
LEAD FREE SOLDERS IN ELECTRONICS Angela Grusd  Abstract
ZAP YOUR SMD? - USING IONIZATION FOR ESD CONTROL IN AUTOMATED EQUIPMENT FOR SMT PRODUCTION Arnold Steinrnan  Abstract
EFFECT OF LARGE CONNECTOR INSERTION ON THE SOLDER JOINT RELIABILITY OF PBGA ON PCB Arthur May  Abstract
FINE PITCH BGA PACKAGE ASSEMBLY Barry Miles  Abstract
CHANGING ASSEMBLY EQUIPMENT REQUIREMENTS FOR EVOLVING PACKAGING TECHNIQUES Brian Blades  Abstract
THE SEARCH FOR YIELD IMPROVEMENT: QUALITY METRICS IN THE EMS INDUSTRY Brian Coll  Abstract
EFFECT OF SOLDER PASTE RESIDUES ON RF SIGNAL DEGRADATION Brian Smith  Abstract
SMALL LOT PROCESSING AND OTHER NECESSARY CONDITIONS FOR BUILD-TO-ORDER MANUFACTURING Brian Tracey  Abstract
EVALUATION OF EUTECTIC SOLDER BUMP INTERCONNECT TECHNOLOGY FOR DIRECT CHIP ATTACH APPLICATIONS CraigBeddingfield  Abstract
TECHNOLOGY VISION ANALYSIS 2010: SPONSORED BY THE SURFACE MOUNT COUNCIL David Bergman  Abstract
IDENTIFYING SOURCES OF SOLDER DEFECTS IN PRINTED CIRCUIT ASSEMBLIES INCORPORATING BALL GRID ARRAY PACKAGES David Moore  Abstract
LIMITS OF COPPER PLATING IN HIGH ASPECT RATIO MICROVIAS Dennis Fritz  Abstract
THE DUAL LANE FACTORY: CONSIDERATIONS FOR IMPLEMENTING DUAL LANE MANUFACTURING Dennis O’Neal  Abstract
PRINTING GUIDELINES FOR BGA AND CSP ASSEMBLIES DONALD C. BURR  Abstract
REWORK PLACEMENT CAPABILITY FOR ADVANCED PACKAGE TYPES- ìBGA, CSP Donald J. Spigarelli  Abstract
CSP DESIGN AND MICROVIA PWB FABRICATION (PART A OF CSP CONSORTIA ACTMTIES: PROGRAM OBJECTIVES AND STATUS) E.J. Simeus  Abstract
CSP CONSORTIA ACTIVITIES: PROGRAM OBJECTIVES AND STATUS E.J. Simeus,  Abstract
FOUR HARD LESSONS IN CONTRACT MANUFACTURING Edwin B. Smith III  Abstract
SOLDERABILITY AND BOARD LEVEL RELIABILITY OF PALLADIUM PLATED, FINE PITCH COMPONENTS Elizabeth Elias Benedetto  Abstract
ECONOMIC IMPACT OF PRODUCT YIELD IMPROVEMENT EmanuelJ. Tucker  Abstract
A MOISURE INDUCED FAILURE IN FCBGA PACKAGES DURING MULTIPLE REFLOW Fay Hua  Abstract
DECISION AID FOR FUNCTIONAL MATERIALS IN INTERCONNECTION TECHNOLOGIES H.-J. Albrecht  Abstract
ASSEMBLY MULTI-CHIP COB MODULE WITH METAL HEAT SINK Hahn Jong Hsiung  Abstract
FLOATING METAL PLANE ON THERMAL AND ELECTRICAL PERFORMANCE OF AN ENHANCED PLASTIC BALL GRID ARRAY PACKAGE Humayun Kabir  Abstract
COMPATIBILITY OF CSPs IN SMT ASSEMBLY (PART C OF CSP CONSORTIA ACTIVITIES: PROGRAM OBJECTIVES AND STATUS) I. Sterian  Abstract
PALLADIUM SURFACE FINISH FOR SOFT TOUCH SWITCHES AND HIGH DENSITY SMT ASSEMBLIES J. Evans  Abstract
FLIP CHIP UNDERFILL CHARACTERIZATION METHODS: DEVELOPING A TEST METHODOLOGY FOR SUCCESS IN THE HARSH AUTOMOTIVE ENVIRONMENT James M. Rosson  Abstract
FLIP-CHIP / CSP ASSEMBLY RELIABILITY AND SOLDER VOLUME EFFECTS Jean-Paul Clech  Abstract
ESD CONSIDERATIONS FOR AUTOMATED HANDLING OF SMT DEVICES Joe Bernier  Abstract
THE IMPACTS OF EUTECTIC SOLDER BALL COPLANARITY OF PBGA PACKAGE ON THE RELIABILITY OF SOLDER BALL JOINTS Joe Chu  Abstract
THE TOOLS YOU NEED FOR DEVELOPMENT AND PRODUCTION WHEN USING UNDERFILL MATERIALS* John A. Emerson  Abstract
TECHNOLOGY MANAGEMENT IN A COST SENSITIVE, QUICK TO MARKET ENVIRONMENT John YeaUanci  Abstract
FLEXIBLE INTERCONNECT TECHNOLOGIES FOR ENHANCED SMT ASSEMBLY Joseph A. DiPalermo  Abstract
PASTE PRINTING AND CHARACTERIZATION FOR CHIP SCALE PACKAGE ASSEMBLIES Julian Partridge  Abstract
GENERATING OF SOLID SOLDER BUMPS ON PRINTED CIRCUIT BOARDS K.-J Wolter  Abstract
HIGH VOLUME, LOW COST FLIP CHIP ASSEMBLY ON POLYESTER FLEX Ken Gilleo  Abstract
ASSEMBLY PROCESS DEVELOPMENT OF LAMINATE FLIP CHIP BGA PACKAGE Kumar Nagarajan  Abstract
OPTIMIZING BGA TO PCB INTERCONNECTIONS USING MULTI-DEPTH LASER DRILLED BLIND VIAS-IN-PAD Larry W. Burgess  Abstract
NO-UNDERFILL FLIP-CHIP ENCAPSULATION M. Albert Capote  Abstract
CSP IMPLEMENTING: AN OEM PERSPECTIVE (PART B OF CSP CONSORTIA ACTIVITIES: PROGRAM OBJECTIVES AND STATUS) M. Chan  Abstract
ENHANCEMENT OF UNDERFILL ENCAPSULANTS FOR FLIP-CHIP TECHNOLOGY M.B. Vincent  Abstract
SELECTION OF BGA / CSP REWORK EQUIPMENT Marc DeRuiter  Abstract
DESIGN AND PROCESS OPTIMIZATION FOR 1.0 MM PITCH CCGA Marie Cole  Abstract
THE RELIABILITY STUDY OF LEAD-FREE SOLDER BALL FOR THE CHIP SCALE PACKAGE (CSP) Masako Watanabe  Abstract
EFFECTS OF MICROSTRUCTURAL HETEROGENEITY ON BGA RELIABILITY* Michael K. Neilsen  Abstract
PowerPADTM - A METHOD TO CREATE THERMALLY ENHANCED PLASTIC PACKAGE SOLUTIONS FOR SEMICONDUCTORS Milton L. Buschbom  Abstract
EMS PROVIDERS MUST TAKE THE TECHNOLOGY LEAD Nicholas E. Brathwaite  Abstract
OPTIMIZING REFLOW PROFILE VIA DEFECT MECHANISMS ANALYSIS Ning-Cheng Lee  Abstract
DEVELOPMENT OF MF-BGA (MOUNTING FRAME BGA) Noriaki Taketani  Abstract
FLIP CHIP ON LARGE AREA PANEL LAMINATES WITH RELIABILITY ASSESSMENT RESULTS P. Nerio  Abstract
PALLADIUM SURFACE FINISH FOR SOFT TOUCH SWITCHES AND HIGH DENSITY SMT ASSEMBLIES P. Seto  Abstract
APPLICATION SPECIFIC RELIABILITY OF IC PACKAGES Patrick Counihan  Abstract
APPLICATION SPECIFIC RELIABILITY OF IC PACKAGES Patrick Counihan  Abstract
PROCESS LIMIT TESTING ON FLUXES USED FOR FLIP CHIP SOLDERING Paul Novak  Abstract
SUCCESSFUL REWORK PROCESS FOR CHIP-SCALE PACKAGES Paul Wood  Abstract
RELIABILITY VERIFICATION OF PRINTED BOARD ASSEMBLIES: CRITICAL REVIEW OF TEST METHODS AND FUTURE TEST STRATEGY Per-Erik Tegehall  Abstract
GLOBAL UPDATE ON LEAD-FREE SOLDERS Peter Biocca  Abstract
ASSEMBLY-LEVEL RELIABILITY OF FLEX-SUBSTRATE BGA, LASTOMER-ON-FLEX PACKAGES AND 0.5mm PITCH PARTIAL ARRAY PACKAGES Pradeep Lall  Abstract
IN-PROCESS STRESS ANALYSIS OF FLIP CHIP ASSEMBLIES DURING UNDERFILL CURE Prema Palaniappan  Abstract
RELIABILITY STUDY OF THROUGH-HOLE SOLDER JOINTS PROCESSED VIA ALTERNATIVE ASSEMBLY REFLOW TECHNOLOGY (AART) R. Seeniraj  Abstract
THERMAL CYCLE RELIABILITY OF SOLDER JOINTS TO ALTERNATE PLATING FINISHES R. WayneJohnson  Abstract
EFFECTS OF BOARD SURFACE FINISH ON FAILURE MECHANISMS AND RELIABILITY OF BGAs Reza Ghaffarian  Abstract
PRECISION PLACEMENI’ CHALLENGES FOR FINE PITCH COMPONENTS Richard Boulanger  Abstract
IMMERSION WHITE TIN THE IDEAL SOLDERABLE FINISH Richard Edgar  Abstract
QUANTIFYING THE PRINTABILITY OF SMT ADHESIVES Richard R. Lathrop Jr.  Abstract
No CLEAN SOLDER PASTE BENCH MARKING FROM A MATERIALS SUPPLIERS VIEWPOINT RichardR Lathrop Jr.  Abstract
EFFECT OF TEST BOARD DESIGN ON THE 2ND LEVEL RELIABILITY OF A FINE PITCH BGA PACKAGE Robert Darveaux  Abstract
European Trends in Reflow Soldering Technology Robert V. Burress  Abstract
CLEANING FOR HIGH RELIABILITY FLIP-CHIP-ON-LAMINATE ASSEMBLY Robin L. Sellers  Abstract
ADVANCES IN CHIP SCALE PACKAGING Ron Bauer  Abstract
PROCESS AND MATERIAL CHARACTERIZATION FOR LEAD-FREE TIN-COPPER SOLDER ALLOY RonaldE. Pratt  Abstract
BALL DETACHMENT EVALUATION FOR TAPE BALL GRID ARRAY PACKAGES S. H. K. Lee  Abstract
MANUFACTURE AND RELIABILITY OF ALTERNATE SOLDER ALLOYS S. Wege  Abstract
APPLICATION ADVANTAGES OF INTEGRATED PASSIVE DEVICES (IPDs) IN CHIP SCALE PACKAGES Satish Kumar  Abstract
ELECTROMIGRATION STUDIES OF FLIP CHIP BUMP SOLDER JOINTS Scott Brandenburg  Abstract
PROCESS CONTROL STRATEGIES IN MINIATURE, HIGHLY COMPLEX PCB ASSEMBLY Sean Griffin  Abstract
CERAMIC CSP - CURRENT STATUS OF TECHNOLOGY Shoji Uegaki  Abstract
LIMITS OF COPPER PLATING IN HIGH A.SPECT RATIO MICROVIAS Steve Castaldi  Abstract
NEW HIGH THERMAL CONDUCTIVITY MATERIALS FOR THERMAL MANAGEMENT OF SURFACE MOUNT ELECTRONIC ASSEMBLIES Steve Dunford  Abstract
REWORKING AND REBALLING BGAS Steve Stach  Abstract
SMT POWER THERMISTORS Theodore J. Krellner  Abstract
POLYIMIDE SUBSTRATES AS AN ENABLER FOR LEADING EDGE DCA APPLICATIONS Timothy Patterson  Abstract
THE IMPACTS OF EUTECTIC SOLDER BALL COPLANARITY OF PBGA PACKAGE ON THE RELIABILITY OF SOLDER BALL JOINTS Tony Huang  Abstract
STRUCTURE AND MATERIAL ANALYSIS OF PBGA PACKAGES Torsten Kirrnse  Abstract
SOLDERABILITY OF PRINTED WIRING BOARDS WITH ORGANIC SOLDER PRESERVATION UNDER NITROGEN ATMOSPHERE Torsten Zachert  Abstract
RELIABILITY PERFORMANCE ASSESSMENT AND CHAFtACTERIZATION OF FINE PITCH MOLD ARRAY BGA Trent Thompson  Abstract
PROCESS IMPROVEMENT STRATEGIES: IMPLEMENTATION OF A NO-CLEAN PROCESS Vicente Martinez Mir  Abstract
MINIMIZING ESD EFFECTS OF LABELING IN THE ELECTRONICS ASSEMBLY ENVIRONMENT Viclci Heideman  Abstract
PROCESS CAPABILITY COEFFICIENT AND PLACING ACCURACY AS BENCHMARKING VALUES OF SMT PLACEMENT SYSTEMS W. Sauer  Abstract
REDUCTION OF BGA EUTECTIC BALL SOLDER JOINT VOIDING William Casey  Abstract
THERMOMECHANICAL DEFORMATION AND INTERFACIAL ADHESION IN UNDERFILLED FLIP-CHIP PACKAGES Xiang Dai  Abstract
LOW COST WAFER BUMPING WITH MASKLESS PROCESS Yasuhisa Kaga  Abstract
EVALUATION OF NI/PD/AU AS AN ALTERNATIVE METAL FINISH ON PCB Zequn Mei  Abstract
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