Surface Mount International 1997 Proceedings

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TITLE AUTHOR
E-3 SOLDER BUMP INTEGRITY AND JOINABILITY Addi Mistry  Abstract
CONTAMINATION OF LEAD-FREE SOLDERS WITH COPPER AND LEAD Alan Gickler  Abstract
HIGH VOLUME ASSEMBLY OF CERAMIC COLUMN GRID ARRAY (CCGA) Andrea Lawrence  Abstract
Reliability Evaluation of a PBGA MCM for Automotive Applications Andrew Mawer  Abstract
NON-CONTACT SURFACE PROFILE MEASUREMENT SYSTEM FOR PACKAGING APPLICATIONS Anthony Wong,  Abstract
MECHANICAL RELIABILITY ANALYSIS OF CCGA SOLDER JOINTS Arvhd Sinha  Abstract
TECHNICAL ADVANCE IMPROVES REFLOW PROCESS RELIABILITY AND CONSISTENCY Brad Bailey  Abstract
CORROSION TESTING OF LOW SOLIDS AND FLIP CHIP FLUXES Brian A Smith  Abstract
THE PRACTICAL APPLICATION OF PHOTO-DEFINED MICRO-VIA TECHNOLOGY Brian J. McDermott  Abstract
HIGH FREQUENCY BGAs FOR CELLULAR PHONE AND WIRELESS APPLICATIONS Carmen Mattei  Abstract
TRANSIENT LIQUID PHASE SINTERING CONDUCTIVE ADHESIVES FOR USE IN SURFACE MOUNT AND AREA ARRAY APPLICATIONS Catherine Gallagher  Abstract
NPI-EXPRESSWAY TO RAPID AND EFFICIENT PRODUCTION Charles Lang  Abstract
OPTIONS AND CONCERNS OF BGA SOLDER BUMPING Chingchen S. Chiu  Abstract
EFFECTS OF UNDERFILL MATERIALS AND ASSEMBLY PROCESSES ON MOISTURE SENSITIVITY OF FLIP CHIP ASSEMBLIES Craig Beddingfield  Abstract
AREAL ARRAY JETTING DEVICE FOR BALL GRID ARRAYS D. R. Frear  Abstract
IMPACT OF FINE PITCH LEAD COPLANARITY ON SURFACE MOUNT YIELD David M. Mendez  Abstract
STATISTICAL MODEL OF PRINTED WIRING BOARD AND STENCIL ALIGNMENT ISSUES David Mendez  Abstract
VALIDATING THEORETICAL CALCULATIONS OF THERMOMECHANICAL STRESS AND DEFORMATION USING THE ATC4.I FLIP-CHIP TEST VEHICLE David W. Peterson  Abstract
A PBGA PACKAGE FOR A HIGH PERFORMANCE MICROPROCESSOR Dev Malladi  Abstract
ACHIEVING SINGLE DIGIT DPMO IN SMT PROCESSES Don Revelino  Abstract
SOLDER JET PRINTING FOR WAFER BUMPING AND CSP Donald J. Hayes  Abstract
BALL GRID ARRAY(BGA) SOLDER JOINT INTEGRITY ENHANCEMENT G. Bartlett  Abstract
BUMP,DIP,FLIP: SINGLECHIP George A. Riley  Abstract
PCB FABRICATION FOR SUCCESSFUL SOLDER PASTE George Trinite  Abstract
THE EFFECT OF SUBSTRATE THICKNESS ON CBGA FATIGUE LIFE Gregory B. Martin  Abstract
CRITERIA FOR HIGH-SPEED MOUNTING OF AREA ARRAY PACKAGES (BGAs, pBGAs/CSPs AND FLIP CHIPS) Gunter Schiebel  Abstract
REDUCING SOLDER DEFECTS UNDER NITROGEN WITH VARYING OXYGEN CONCENTRATIONS H. Hsiao  Abstract
MAGNETO-HYDRODYNAMICALLY DRIVEN SOLDER JETTING DEVICE H.C. Peebles  Abstract
BGA PACKAGE ANALYSIS FROM MATERIALS POINT OF VIEW Hans-Jurgen Albrecht  Abstract
CONCURRENT ENGINEERING IN HIGH 1/0 BGA IMPLEMENTATION I.A. Sterian  Abstract
STRENGTH AND LIFETIME ANALYSIS OF SMT SOLDER JOINTS: AN EXEMPLARY STUDY OF THE MINIMELF COMPONENT J. Jendrny  Abstract
LOW FREQUENCY IMPEDANCE INVESTIGATION ON AN EPOXIDE RESIN Jane M. Terry  Abstract
NEW LEAD-FREE SOLDERS FOR ELECTRONICS PACKAGING AND ASSEMBLY Jennie S. Hwang  Abstract
A NEW PRODUCTION LINE FOR LOW COST FLIP CHIP ASSEMBLY Joachim Kloeser  Abstract
KEY ELEMENTS IN SUCCESSFUL INTEGRATION OF FLEXIBLE CIRCUITS AND SURFACE MOUNT TECHNOLOGY Joseph Fjelstad  Abstract
MOVEMENT OF SOLDER BALLS ON NO-CLEAN ASSEMBLIES Joseph Poole  Abstract
HIGH SPEED PC (MEMORY) CARD ASSEMBLY WITH CHIP SCALE BGA Julian P. Partridge  Abstract
REVIEW OF CURRENT ISSUES IN LEAD-FREE SOLDERING Kay Nitnmo  Abstract
PLACEMENT EQUIPMENT STRATEGIES FOR LOW VOLUME HIGH MIX MANUFACTURING Kevin A. Towle  Abstract
FAILURE OF THICK BOARD PLATED THROUGH VIAS WITH MULTIPLE ASSEMBLY CYCLES-- THE HIDDEN BGA RELIABILITY THREAT Kevin T. Knadle  Abstract
FLEX CIRCUITRIES OF SILICONES - A MATERIAL WITH HIGH POTENTIALITIES Klaus Feldmann  Abstract
ASSESSMENT OF ELECTRICALLY CONDUCTIVE ADHESIVES FOR SMT Klaus Feldmann  Abstract
EFFECTS OF PAD SIZE VARIATIONS, SOLDER MASK REGISTRATION, AND SUBSTRATE WARPAGE ON DIRECT CHIP ATTACH ASSEMBLY YIELDS Krishna Kalyan  Abstract
REDUCTION OF PIN TEST FALSE FAILURES IN A NO-CLEAN PRODUCTION ENVIRONMENT Kuan-Shaur Lei  Abstract
REDUCTION OF PIN TEST FALSE FAILURES IN A NO-CLEAN PRODUCTION ENVIRONMENT Kuan-Shaur Lei  Abstract
FLIP CHIP BONDING ON PRINTED CIRCUIT BOARD USING ANISOTROPICALLY CONDUCTIVE ADHESIVE FILM Kyoung H. Kim  Abstract
PUTTING BLIND VIAS IN SMD PADS: “WHERE THEY BELONG” Larry W. Burgess  Abstract
THE ATTRACTION TO EMERGING REGIONS FOR CONTRACT MANUFACTURERS Leora Lawton  Abstract
OPTIMIZATION OF ADHESIVE DEPOSITION FOR MIXED TECHNOLOGY PCB ASSEMBLY Lisa Rielly  Abstract
EVALUATION OF ELECTRICAL AND MECHANICAL PERFORMANCE OF DIFFERENT SBU TECHNOLOGIES Mats Lindgren  Abstract
CHARACTERIZING AND CONTROLLING THE SMT SCREEN PRINTING PROCESS Michael R. Beck  Abstract
SURFACE LAMINAR CIRCUIT1 PRINTED WIRING BOARD AND DIRECT CHIP ATTACH - FLIP CHIP Miguel Jimarez  Abstract
CHALLENGES WITH THE BGA PROCESS: THE THICK AND THE THIN Mike Buseman  Abstract
BGA ASSEMBLY PROCESS QUALIFICATION AND TRANSFER TO PRODUCTION Nicholas Brathwaite  Abstract
FLIP CHIP / BGA HIGH DENSITY “DECAL” PACKAGE P. Nerio  Abstract
PARADIGM SHIFT IN INTERCONNECTION TECHNOLOGIES Paul A. Totta  Abstract
THE EXPANDING BGA MENU Comparison and Direction of the Exploding Technology Paul Mescher  Abstract
SOLDER JOINT DESIGN FOR OPTIMAL MANUFACTURING PROCESS AND FIELD RELIABILITY Pradeep Lall  Abstract
REFLOW-CURABLE POLYMER FLUXES FOR FLIP CHIP ASSEMBLY R. Wayne Johnson  Abstract
ELECTRICAL PERFORMANCE AND RELIABILITY OF A TBGA WITH A GROUNDED STIFFENER R.D. Schueller  Abstract
PROCESS AND DESIGN PARAMETERS TO MINIMIZE TOMBSTONING DURING SURFACE MOUNT REFLOW R.K. Sharma  Abstract
MINIMIZING TOTAL COST IN THE CONTRACT MANUFACTURING PROCESS Ralph H. Kenton  Abstract
A NEW METHOD OF PRODUCING SOLDER SPHERES FOR CHIP SCALE PACKAGES AND WAFER BUMPING UTILIZING METAL JET TECHNOLOGY Richard Godin  Abstract
A NEW METHOD OF PRODUCING SOLDER SPHERES FOR CHIP SCALE PACKAGES AND WAFER BUMPING UTILIZING METAL JET TECHNOLOGY Richard Godin  Abstract
SMT COMPONENT SELF-CENTERINGPROPERTIES DURING SOLDER REFLOW Richard Noreika  Abstract
SOLDER PASTE DESIGN AND PERFORMANCE FOR FINE PITCH PRINTING Richard R. Lathrop Jr.  Abstract
SMT PRINTING PROCESS FOR FINE AND ULTRA FINE PITCH Richard S. Clouthier  Abstract
INTEGRATED ASSEMBLY AND TEST CONTRACT MANUFACTURING Rita Pillman  Abstract
DESIGN ISSUES FOR FLIP CHIP MODULES Rob Lyn  Abstract
ACHIEVING DRAMATIC REDUCTIONS IN SMT DEFECTS Robert A. Williams  Abstract
LOCAL BGA QUICK TURNS: ENABLING THERE-MARRIAGE OF FAB, ASSEMBLY& TEST Robert C. Marrs  Abstract
RELIABILITY OF MICRO-BGA-ON-FLEX ASSEMBLIES Robert Larmouth  Abstract
RELIABILITY OF BALL GRID ARRAY PACKAGES IN AN AUTOMOTIVE ENVIRONMENT Roger Rorgren  Abstract
SUCCESSFUL IMPLEMENTATION OF PCMCIA PROCESS Salim Merchant  Abstract
IMPLEMENTING NEW TECHNOLOGIES IN THE ELECTRONICS MANUFACTURING SERVICES ENVIRONMENT A Case Study in Ball Grid Array Qualification Sammy Yi  Abstract
OPTIMIZATION OF VOIDS IN SOLDER JOINTS AT BOARD-LEVEL BGA ASSEMBLY Sarathy Rajagopalan  Abstract
517 WIREBONDED MCM BGA UTILIZING BUILD-UP LAMINATE TECHNOLOGY Satya Chillara  Abstract
OPTIMIZATION OF TEMPERATURE PROFILE OF THE THERMAL CYCLING TEST FOR PBGA SOLDER JOINT RELIABILITY Shi-Wei Ricky Lee  Abstract
TEKTRONIX PROCESS QUALITY MANAGEMENT CHALLENGE Sue Margolis  Abstract
MINIMAL-RESOURCE HYBRID SMT/PTH LINE Tim Strunk  Abstract
PHOTODIELECTRIC DRY FILMS FOR ULTRA HIGH DENSITY PACKAGING William E. Estes  Abstract
BGA LIFETIME PREDICTIONS: INTERFACE STUDIES, NUMERICAL ANALYSIS AND EXPERIMENTAL COMPARISON Wolfgang H. Muller  Abstract
THERMAL FATIGUE ANALYSIS OF BGA SOLDER JOINTS Y.-H. Pao  Abstract
NEW STUD BUMPING TECHNOLOGY USING COPPER WIRE Yasuhisa Kaga  Abstract
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