Surface Mount International 1996 Proceedings

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TITLE AUTHOR
INTEGRATION OF FLIP CHIP ASSEMBLY WITH SURFACE MOUNT TECHNOLOGY A. James McLenaghan  Abstract
IMPACT OF ADVANCED SURFACE MOUNT PACKAGES ON SMT MANUFACTURING PROCESS A. James McLenaghan  Abstract
ASSEMBLY DEVELOPMENT OF DIRECT CHIP ATTACH WITH EUTECTIC Pb-Sn SOLDER BUMPS ON ORGANIC SUBSTRATES Abhay Maheshwari  Abstract
LOW COST TECHNIQUES FOR FLIP CHIP SOLDERING Andreas Ostmann  Abstract
SOLID SOLDER DEPOSITS (SSD): A BARE BOARD SOLUTION FOR HIGH DENSITY PACKAGING Andrew Holzmann  Abstract
THE EFFECT OF PBGA SOLDER PAD GEOMETRY ON SOLDER JOINT RELIABILITY Andrew Mawer  Abstract
OPTIMIZING CYCLE TIME IN HIGH SPEED SMT LINES Arjun Raman  Abstract
MOISTURE INDUCED STRESS SENSITIVITY REDUCTION OF FSRAM 52 LEAD PLCC’S Armando H. Carrasco  Abstract
PILOT ASSEMBLY RESULTS WITH A BGA CHIP SCALE PACKAGE Bill Rugg  Abstract
EFFECT OF SUBSTRATE CTE ON SOLDER BALL RELIABILITY OF FLIP CHIP PBGA PACKAGE ASSEMBLY Bongtae Han  Abstract
LOW-COST FLIP CHIP ASSEMBLY Caroline Beelen  Abstract
PROCESS CONTROL OF SOLDER PASTE WITH 1S4000 TOOL Christina L. Sharp  Abstract
A MODEL FOR SOLDERABILITY DEGRADATION Christopher Hunt  Abstract
LEAD-FREE SOLDER FINE PITCH STENCIL PRINTING Cindy Melton  Abstract
SOLDERING ATMOSPHERE OPTIMIZATION: COST ANALYSIS MODEL D. Verbockhaven  Abstract
DO SQC TECHNIQUES REALLY WORK? A PRINTED CIRCUIT BOARD MANUFACTURING CASE STUDY Dale W. Wilhite  Abstract
CONTRACT MANUFACTURING AND CELLULAR MANUFACTURING Daniel H. Arnold  Abstract
PROCESS FEEDBACK SYSTEM Daniel H. Arnold  Abstract
WIREBONDABILITY AND SOLDERABILITY OF VARIOUS METALLIC David Hillman  Abstract
THE CHANGING LANDSCAPE OF CONTRACT ELECTRONICS MANUFACTURING Denis P. Stradford  Abstract
THE EFFECTS OF SOLDER JOINT VOIDING ON PLASTIC BALL GRID ARRAY RELIABILITY Donald R. Banks,  Abstract
RESIDUES IN PRINTED WIRING BOARDS AND ASSEMBLIES Douglas Pauls  Abstract
OPTIMIZATION OF HEAT TRANSFER IN FULL FORCED CONVECTION REFLOW SOLDERING E.U. Beske  Abstract
HIGH FREQUENCY SURFACE MOUNT INDUCTORS Eduardo L. Acuna  Abstract
EFFECT OF THERMAL AGING ON THE MICROSTRUCTURE AND RELIABILITY OF BALL GRID ARRAY (BGA) SOLDER JOINTS Edwin Bradley  Abstract
TESTING AND QUALIFICATION OF HFE/CO-SOLVENT CLEANING AGENTS IN VAPOR DECREASING APPLICATIONS Elizabeth A. Bivins  Abstract
PARAMETRIC STUDY ON THE SOLDERABILITY OF ETCHED PWB COPPER F. M. Hosking  Abstract
MODELING THE UNDERFILL FLOW PROCESS G. Lehmann  Abstract
ADVANCED SOLDER FLIP CHIP PROCESSES G. Rinne  Abstract
SURFACE FINISHES: METALLIC COATINGS OVER NICKEL OVER COPPER George Milad  Abstract
CLEANING OF CIRCUIT CARD ASSEMBLIES OF RESIDUAL RMA FLUX Govind Vazirani  Abstract
FATIGUE PROPERTIES OF BGA SOLDER JOINTS: A COMPARISON OF THERMAL AND POWER CYCLE TESTS Hans-Jurgen Albrecht  Abstract
EXPERIENCES WITH TECHNOLOGIES FOR THE REPAIR OF BGA-BOARDS Helmut Kergel  Abstract
TWO METAL LAYER TAPE FOR TAB BALL GRID ARRAY Hiroki Tanaka,  Abstract
THE PERFORMANCE AND CHARACTERISTICS OF THE IMIDAZOLE COATING J. L. Parker, Jr.  Abstract
USING STATISTICAL PROCESS CONTROL (SPC) TO MONITOR A REFLOW OVEN J. Pierre Menard  Abstract
PBGA SOLDER JOINT RELIABILITW MANUFACTURABILITY AS A FUNCTION OF PCB PAD SIZE Jason D. Brown  Abstract
SOLDER RELIABILITY SOLUTIONS: A PC-BASED DESIGN-FOR-RELIABILITY TOOL Jean-Paul Clech  Abstract
NCMS SURFACE FINISH TESTING Jim Reed  Abstract
CIRCUIT BOARD REPAIR AND ENGINEERING CHANGE FOR BGA John G. Davis  Abstract
CRACKED CAPACITORS: CAUSES AND SOLUTIONS John Maxwell  Abstract
HIGHLY INTEGRATED TERMINATION SOLUTIONS John Nemec  Abstract
ORGANIC SOLDERABILITY PRESERVATIVES: BENZOTRIAZOLES AND SUBSTITUTED BENZIMIDAZOLES Joseph D. DeBiase  Abstract
COMPLIANCY MODELING OF AN AREA ARRAY CHIP SCALE PACKAGE Joseph Fjelstad  Abstract
CERAMIC BGA SOLDER BALL TO SUBSTRATE AND CARD PAD ALIGNMENT K. Berger  Abstract
OPTIMIZATION OF SOLDER VOLUME FOR AREA ARRAY PACKAGING APPLICATIONS K.J. Wolter  Abstract
FUNDAMENTALS OF PSA AND HEAT ACTIVATED COVER TAPE SEALING FOR COMPONENTS PACKAGED IN TAPE AND REEL Kenneth C. Thompson  Abstract
FLIP CHIP AITACH SOLDER DEPOSITION ALTERNATIVES Kenneth M. Fallen  Abstract
HIGH FREQUENCY CHARACTERISTICS OF ANNULAR BURIED RESISTORS IN PRINTED CIRCUIT BOARDS Kenneth P.S. Tan  Abstract
REEL TO REEL ASSEMBLY MADE POSSIBLE WITH FLEX CIRCUITRY Kevin Corrigan  Abstract
FUTURE EXPECTATIONS OF ELECTRONIC MANUFACTURING SERVICES Kevin Terrill  Abstract
MOISTURE SENSING AND STRESS TEST CHIPS FOR PLASTIC PACKAGING QUALIFICATION L.T. Nguyen  Abstract
KNOWN GOOD DIE VERSUS CHIP SIZE PACKAGE: OPTIONS, AVAILABILITY, MANUFACTURABILITY AND RELIABILITY Lany Gilg  Abstract
PLASTIC BALL GRID ARRAY ATTACHMENT: ASSEMBLY AND RELIABILITY PERFORMANCE Leo Anderson  Abstract
COMPUTATIONAL MODELING OF DIRECT MOLTEN SOLDER DELIVERY FOR BALL GRID ARRAY APPLICATIONS M. Essien  Abstract
SHOCK AND VIBRATION LIMITSFOR CBGA AND CCGA Marie S. Cole  Abstract
COST- PERFORMANCE ANALYSIS OF HIGH PIN COUNT SURFACE MOUNT PLASTIC IC PACKAGES Martin P. Goetz  Abstract
EFFECTS OF COMPONENT SOLDERABILITY ON SOLDER FILLET SHAPE AND PROCESS YIELD Martin Wickham  Abstract
A SILICON MICROBENCH CONCEPT FOR OPTOELECTRONIC PACKAGING Michael Pocha  Abstract
ELECTRICALLY CONDUCTIVE ADHESIVES FOR SURFACE MOUNT SOLDER REPLACEMENT Michael Zwolinski  Abstract
IMPLEMENTATION AND PRODUCTION TEST RESULTS OF A CLOSED LOOP CONTROL OF ATMOSPHERES FOR SOLDERING N. Saxena  Abstract
ALUMINUM NITRIDE LAND GRID ARRAY FOR HIGH PERFORMANCE PACKAGING APPLICATIONS Nobuo Iwase  Abstract
DETERMINATION OF THE SERVICE LIFE OF ELECTRONIC COMPONENTS BY FINITE ELEMENT ANALYSIS P.R. Winter  Abstract
RELIABILITY EVALUATION OF A NOVEL SURFACE LAMINAR CIRCUIT PROCESS: AN APPROACH TO COST-EFFECTIVE MCM-L Per Carlsson  Abstract
ASSEMBLY LINE DEFINITION FOR FLEXIBLE BGA PACKAGE MANUFACTURING Philip Momin  Abstract
TIN-PLATING, TIN-NICKEL ELECTROPLATE AND TIN-PLATING OVER NICKEL AS FINAL FINISHES ON COPPER Phillip E. Hinton  Abstract
ADHESION ISSUES AT EPOXY UNDERFILL / SOLDER MASK INTERFACES R. A. Pearson  Abstract
IMPLEMENTATION OF FLIP CHIP TECHNOLOGY FOR BGA PACKAGES R. Aschenbrenner  Abstract
RELIABILITY RESULTS FOR A WIRE BONDABLE TAPE BALL GRID ARRAY PACKAGE R. D. Schueller  Abstract
DEVELOPMENT AND QUALIFICATION OF A PLASTIC BALL GRID ARRAY REPLACEMENT PROCESS R. Glenn Robertson  Abstract
A NEW PLASTIC CHIP CARRIER (PCC] PACKAGE R. Joshi  Abstract
BUMPING PROCESS FOR 40-MIL PBGA R.T. Chen  Abstract
APPLICATION OF EUTECTIC SOLDER USING SOLDER JETTING TECHNOLOGY Rick Godin  Abstract
A NEW BGA PACKAGE FOR HIGH DENSITY APPLICATIONS Robert Darveaux  Abstract
THE IMPACT OF CHIP SCALE PACKAGES ON THE SMT ASSEMBLY PROCESS Robert J. Black, Jr.  Abstract
HIGH DENSITY SURFACE MOUNT ASSEMBLIES BASED ON FLEX SUBSTRATES Robert Larmouth  Abstract
EMERGING TECHNOLOGY DEMANDS FOR THE CONTRACT MANUFACTURER: “Time to Technology” Roger Liptak  Abstract
APPLICATION REALITIES OF CHIP SCALE PACKAGING Ronald Malfatt  Abstract
STATISTICAL NEURAL NETWORK MODELING FOR STENCIL PRINTING Roop L. Mahajan  Abstract
FLIP CHIP FOR FLEX APPLICATIONS S. Arndt  Abstract
ELECTRONICS MANUFACTURING SERVICES: CONTRACTORS AND CUSTOMERS KEEP IT HOT Sandra Fox  Abstract
TIN/LEAD COATING DIRECTLYON COPPER Shelgon Yee  Abstract
EFFECT OF CHIP DIMENSION AND SUBSTRATE THICKNESS ON SOLDER JOINT RELIABILITY OF PLASTIC BGA PACKAGE Shi-Wei Ricky Lee  Abstract
REWORK PROCESS FOR CHIP SCALE COMPONENTS Stanley F. Kench  Abstract
A MACHINE-VISION BASED APPROACH TO LOW-COST OPTOELECTRONIC PACKAGING Stanley K. Ault  Abstract
NON-PRECIOUS METAL COATINGS FOR FINE PITCH ASSEMBLY AND DIRECT CHIP ATTACHMENT Steve Beigle  Abstract
THE ASSEMBLY LINE IN THE NEW MILLENNIUM Steve Dickerson  Abstract
CRITICAL ISSUES WITH CHIP SCALE PACKAGES (CSPS) Steve Greathouse  Abstract
FLEXIBLE CIRCUIT COVER COATING TECHNIQUES FOR SMT Steven E. Dean  Abstract
OFFSHORE MANUFACTURING TRENDS: OVERVIEW FROM A GLOBAL CONTRACT MANUFACTURER Sundra Raj  Abstract
AN APPROACH TO THE ANISOTROPIC CONDUCTIVE ADHESIVES FOR MICRO-INTERCONNECTION TECHNOLOGY Takao Komukai  Abstract
CONCEPTS TOWARD LIFETIME ANALYSIS OF BGA STRUCTURES Torsten Hauck  Abstract
MOISTURE ABSORPTION AND AUTOCLAVE PERFORMANCE OPTIMIZATION OF GLOB TOP BALL GRID ARRAY Trent Thompson  Abstract
A MICRO FLIP CHIP PROCESS FOR HIGH SPEED OPTOELECTRONIC COMPONENTS Tun S. Tan  Abstract
ASSESSMENT OF CIRCUIT BOARD SURFACE FINISHES FOR ELECTRONIC ASSEMBLY WITH LEAD-FREE SOLDERS U. Ray  Abstract
CHIP-SCALE BALL GRID ARRAY PACKAGING FOR SURFACE MOUNT TECHNOLOGY Vern Solberg  Abstract
THERMAL PROPERTIES OF FLIP CHIP ENCAPSULANT Wei Koh  Abstract
ENGINEERING SOLDER PASTE PERFORMANCE VIA CONTROLLED STRESS RHEOLOGY ANALYSIS Xiaohua Bao  Abstract
AN ALTERNATIVE SURFACE FINISH FOR TIN/LEAD SOLDERS: PURE TIN Y. Zhang  Abstract
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