Pan Pacific Symposium 2004 Proceedings

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TITLE AUTHOR
IMPROVED EMC DESIGN FOR 3D MICROELECTRONICS PACKAGING A. Brandolini, A. Gandelli and R.E. Zich  Abstract
NO-FLOW UNDERFILL TECHNOLOGY FOR FLIP-CHIP BONDING Akira Ohuchi, Tomoo Murakami, and Tsutomu Kawata  Abstract
A STUDY OF THE SELF-CENTERING PHENOMENON IN PB-FREE SURFACE MOUNT ASSEMBLY Amey Teredesai et al.  Abstract
ADHESION OF GREEN FLEXIBLE MOLDING COMPOUNDS TO PREPLATED LEADFRAMES Anthony A. Gallo et al.  Abstract
STRUCTURAL FINITE ELEMENTAL MODELING OF A MULTILAYERED PLATED THROUGH-HOLE - EFFECT OF MATERIAL PROPERTIES Arun Gowda et al.  Abstract
MULTI CHIP PACKAGE IMPROVES HARD DISK DRIVE EMI PERFORMANCE Bill Rugg  Abstract
IMBEDDED COMPONENT / DIE TECHNOLOGY: AN INNOVATIVE PACKAGING SOLUTION FOR HIGH RELIABILITY Casey Hatcher  Abstract
CONTRACT MANUFACTURING STRATEGIES ADDRESSING THE CHANGING GLOBAL LANDSCAPE Charlie Barnhart  Abstract
BEHAVIOR OF PACKAGE WITH INTEGRATED HEAT SPREADER Cheng Siew Tay et al.  Abstract
M3D(TM) TECHNOLOGY MAKES BOND PAD ECOS A SNAP Dr. Bruce King and Dr. Marcelino Essien  Abstract
MECHANICAL STRESS CONTROL AND MANAGEMENT IN THE ASSEMBLY PROCESSES FOR Sn-Pb AND Pb-FREE SYSTEM *PHASE II - LEAD-FREE PROCESS AND PRODUCT TRANSITION Dr. Paul P.E. Wang et al.  Abstract
CORRELATION OF SOLDER JOINT RELIABILITY OF µPGA SOCKET TO PACKAGE FLATNESS AND PCB WARPAGE *PHASE I - PCB WARPAGE UNDER THERMAL REFLOW BY MOIRE... Dr. Paul P.E. Wang et al.  Abstract
LASER ASSISTED ASSEMBLY FOR NCP, ACF AND SOLDER INTERCONNECTION E. Zakel, T. Teutsch, G. Azdasht, and P. Penke  Abstract
ELECTROCHEMICAL MIGRATION ON HASL PLATED FR-4 PRINTED CIRCUIT BOARDS Elissa Bumiller et al.  Abstract
MATERIALS AND MANUFACTURING ISSUES IN MEMORY MODULES - WAFER THINNING Evelyn Baldwin / Wei Koh  Abstract
X-RAY INSPECTION FOR MICROELECTRONICS LATEST DEVELOPMENTS Friedhelm Maur  Abstract
JETTING: DISCRETE DISPENSING OF HIGH VISCOSITY FLUID H. Quinones, A. Babiarz, E. Fiske, L. Fang  Abstract
MECHANICAL STRESS CONTROL AND MANAGEMENT IN THE ASSEMBLY PROCESSES FOR Sn-Pb AND Pb-FREE SYSTEM *PHASE I - A METHODOLOGY FOR... Hana Hsu et al.  Abstract
EVALUATING TECHNOLOGIES FOR TESTING HIGH SPEED HIGH DENSITY BALL GRID ARRAY PACKAGES Ila Pal  Abstract
APPLICATION OF MAINSTREAM CAD/CAE TOOLS FOR MEMS Ilya Mirman  Abstract
THE EFFECT OF MATERIAL PROPERTIES AND LENS CHARACTERISTICS ON UHF SAM INSPECTIONS James C. P. McKeon  Abstract
DEPARTMENT OF DEFENSE OVERVIEW IN NANOTECHNOLOGY James Short and Clifford Lau  Abstract
DEVELOPMENT OF A RESOLUTION TEST WAFER FOR USE IN ACOUSTIC MICROSCOPY OF MICROELECTRONIC DEVICES Janet E. Semmens et al.  Abstract
SURFACE-MOUNTING OF POWER DEVICES TO ALUMINUM HEAT SINKS Jim Fraivillig  Abstract
APPLICATIONS OF IN-SITU HEALTH-MONITORING AND PROGNOSTIC SENSORS Jingsong Xie and Michael Pecht  Abstract
NOVEL METHODS FOR CREATING STACKED DEVICE STRUCTURES USING MODIFIED STANDARD PACKAGES Joseph Fjelstad  Abstract
TACTICAL PRODUCTION PLANNING FOR PRINTED CIRCUIT BOARD ASSEMBLY K. Sivakumar, K. Srihari, D. Warheit, and A. Gowda  Abstract
STUDY OF ENCAPSULATION PROCESS AND MATERIALS FOR MATRIX ARRAY OVER-MOLDED FLIP CHIP CSP Kai-Chi Chen et al.  Abstract
IMPACTS OF BULK PHOSPHOROUS CONTENT OF ELECTROLESS NICKEL LAYERS TO SOLDER JOINT INTEGRITY AND THEIR USE AS GOLD- AND ALUMINUM-WIRE BOND SURFACES Kuldip Johal et al.  Abstract
ELECTROLESS NICKEL / ELECTROLESS PALLADIUM / IMMERSION GOLD PLATING PROCESS FOR GOLD- AND ALUMINUM-WIRE BONDING DESIGNED FOR HIGH-TEMP APPS Kuldip Johal, Sven Lamprecht, and Hugh Roberts  Abstract
CONSIDERATIONS IN HIGH VOLUME FLIP CHIP MANUFACTURING Lou Nicholls, Paul Mescher and Dave McCann  Abstract
FLIP CHIP PACKAGING - CURRENT TRENDS AND ROADMAP Maniam Alagaratnam  Abstract
INDIUM SOLDERING FOR A MOEMS BASED SAFETY AND ARMING DEVICE Michael Deeds et al.  Abstract
ADVANCED LTCC PROCESSES USING PRESSURE ASSISTED SINTERING Michael Hintz et al.  Abstract
NEW UNDERFILL ADHESIVE FOR FLIP CHIP BGA N. Imaizumi, T. Yagi, H. Date, and E. Horikoshi  Abstract
THE WORLDWIDE ELECTRONICS MANUFACTURING MARKETCHANGES IN GEOGRAPHY AND PRODUCTS Randall Sherman  Abstract
THE NAVY’S PROGRAM IN NANOSCIENCE AND NANOTECHNOLOGY - A LOOK AHEAD Robert Kavetsky  Abstract
PACKAGE DEVELOPMENT FOR HIGH MOISTURE AND REFLOW SENSITIVITY LEVELS Robert Warren  Abstract
EVALUATION OF THE EFFECTS OF PROCESSING CONDITIONS ON SHEAR STRENGTH AND MICROSTRUCTURE IN PB-FREE SURFACE MOUNT ASSEMBLY S. Bukhari, D. Santos, L. Lehman, and E. Cotts  Abstract
COPPER ELECTROPLATING FOR HIGH DENSITY 3D THROUGH SILICON VIA INTERCONNECTS S. Spiesshoefer and L. Schaper  Abstract
EPOXY/BaTiO3 COMPOSITE FILMS AND PASTES FOR HIGH DIELECTRIC CONSTANT AND LOW TOLERANCE EMBEDDED CAPACITORS FABRICATION IN ORGANIC SUBASTRATES S.-D. Cho, K.-W. Jang, J.-G. Hyun, and K.-W. Paik  Abstract
TECHNICAL CHALLENGES IN MEMORY PACKAGING Se Yong Oh and Dong Ho Lee  Abstract
TERNARY INTERMETALLIC COMPOUND - A REAL THREAT TO BGA SOLDER JOINT RELIABILITY Shelgon Yee, Ph. D., et al.  Abstract
EFFICIENCY IMPROVEMENT OF BLUE ORGANIC LIGHT EMITTING DIODES WITH NANOSCALE DISPERSING EMISSION ZONE LAYERS Shih-Ching Lin et al.  Abstract
LOW TEMPERATURE BONDING OF AU-AU IN NON-VACUUM ENVIRONMENT USING SURFACE ACTIVATED METHOD Su-Tsai Lu, Yao-Sheng Lin, and Yuan-Chang Huang  Abstract
COST CONSIDERATIONS, MARKET TRENDS AND TECHNOLOGY FOR IMPROVING MICROELECTRONICS Terence Q. Collier  Abstract
ASSEMBLY IMPROVEMENTS BY CONTROLLING PLACEMENT Terence Q. Collier  Abstract
POST-PASSIVATION LAYERS: DEVICE ENHANCEMENT AT THE WAFER LEVEL Thomas Goodman and Peter Elenius et al.  Abstract
JOINT TECHNOLOGY OF FPC AND FPC WHICH USES ACF Tomiyo Ema  Abstract
BOARD-LEVEL ASSEMBLY AND RELIABILITY TESTING FOR STACKED CHIP SCALE IC PACKAGING Vern Solberg  Abstract
SIMULATION TECHNOLOGY FOR PREDICTION LIFETIME OF FLIP CHIP Yasuo Michinaka, Yoshihiro Ono, Kosuke Azuma  Abstract
A KEY ROLE OF PRINTED CIRCUIT BOARD IN RECENT PACKAGING TECHNOLOGY Yutaka Tsukada  Abstract
MEMS APPLICATIONS IN ORDNANCE AND DEFENSE RELATED SYSTEMS Zafer Tuncali et al.  Abstract
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