SMTA International 2003 Proceedings

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TITLE AUTHOR
BOARD LEVEL ASSEMBLY AND RELIABILITY CONSIDERATIONS FOR QFN TYPE PACKAGES Ahmer Syed and WonJoon Kang  Abstract
CONSIDERATIONS IN THE DEVELOPMENT OF AN 0201 COMPONENT ASSEMBLY PROCESS Alan Rae, Joe Renda, and Joe Belmonte  Abstract
THE EFFECT OF NITROGEN REFLOW SOLDERING IN A LEAD-FREE PROCESS Anders Åström  Abstract
THE NEXT-GENERATION INFORMATION EXCHANGE FRAMEWORK FOR ELECTRONICS MANUFACTURING: FRAMEWORK IMPLEMENTATION PROJECT FROM THE GEORGIA INSTITUTE OF TECH Andrew Dugenske et al.  Abstract
A COMPARISON BETWEEN POWER AND THERMAL CYCLING FOR A FC PBGA Andrew Mawer, D. Hodges Popps, and G. Presas  Abstract
ODM OR CDM? Bill Coker  Abstract
JOINT GROUP ON POLLUTION PREVENTION LEAD-FREE SOLDER PROJECT Brian E. Greene  Abstract
NEMI LEAD-FREE ASSEMBLY PROJECT: COMPARISON BETWEEN PbSn AND SnAgCu RELIABILITY AND MICROSTRUCTURES Carol Handwerker et al.  Abstract
LEAD-FREE WAVE SOLDERING - TIGHTER PROCESS WINDOWS NEED TIGHTER PROCESS CONTROLS Chrys Shea and *Keith Howell  Abstract
REDUCING VARIATION IN OUTSOURCED SMT MANUFACTURING THROUGH THE USE OF INTELLIGENT STENCIL SYSTEMS Chrys Shea, Valentijn Van Velthoven, and Ron Tripp  Abstract
EVALUATION OF WIRE BONDING PERFORMANCE, PROCESS CONDITIONS, AND METALLURGICAL INTEGRITY OF CHIP ON BOARD WIRE BONDS Daniel T. Rooney, Ph.D. et al.  Abstract
MANUFACTURING AND RELIABILITY OF PB-FREE AND MIXED SYSTEM ASSEMBLIES (SNPB/PB-FREE) IN AVIONICS ENVIRONMENTS Dave Nelson and Hector Pallavicini et al.  Abstract
IMPLICATIONS OF USING LEAD-FREE SOLDERS ON X-RAY INSPECTION OF FLIP CHIPS AND BGAS David Bernard  Abstract
CONSIDERATIONS FOR MINIMIZING RADIATION DOSES TO COMPONENTS DURING X-RAY INSPECTION David Bernard et al.  Abstract
EMERGING AOI TECHNOLOGY - 2004 AND BEYOND David Doyle  Abstract
INVESTIGATION OF SOLDER/FLUX RESIDUE EFFECT ON RF SIGNAL INTEGRITY USING REAL CIRCUITS David Geiger and Dr. Dongkai Shangguan  Abstract
RELIABILITY STUDY OF SOLDER JOINTS FOR 0201 COMPONENTS David Geiger et al.  Abstract
TECHNICAL ASSESSMENTS AND COST ANALYSIS OF THE EMBEDDED PASSIVE TECHNOLOGIES IN THE MULTI-LAYER CIRCUIT BOARDS (Part I - Resistance) Dominique Numakura  Abstract
TOTAL PROCESS CONTROL AND MANAGEMENT- FROM RELIABILITY, STABILITY, TRACEABILITY TO PREDICTABILITY (RSTP) Dr. Paul P.E. Wang et al.  Abstract
EPOXY FLUX BRIDGES THE GAP TO LOW COST NO-CLEAN FLIP CHIP ASSEMBLY Dr. Wusheng Yin et al.  Abstract
FILLED NO-FLOW UNDERFILLING - PROCESS AND MATERIALS Dr. Wusheng Yin, Dr. H-S Hwang, and Dr. N-C Lee  Abstract
EVALUATING THE EFFECT OF SOLDER PASTE RESIDUES ON RF SIGNALS BETWEEN 5 AND 10 GHZ Dwayne R. Shirley et al.  Abstract
NO WINNERS HERE: COVERT MONEY LOSSES IN OUTSOURCED ELECTRONICS MANUFACTURING PROGRAMS Edwin B. Smith, III  Abstract
SOLDER JOINT RELIABILITY ASSESMENT OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER Fay Hua et al.  Abstract
IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION Frank Grano et al.  Abstract
FLIP CHIP ON STANDARD LEAD FRAME: LOWERING THE COST OF FLIP CHIP OWNERSHIP Frank Juskey  Abstract
DFN, A LEAD FRAME SIP FOR WIRELESS Frank Juskey  Abstract
DIE ATTACH REWORK - PROCESS COMPARISON Fulvio Fontana  Abstract
USING "SIGNATURE IDENTIFICATION" FOR RAPID AND EFFECTIVE X-RAY INSPECTION OF BALL GRID ARRAYS Gil Zweig  Abstract
2D OR NOT 2D, THAT IS THE QUESTION! Glenn Wyllie and Mark Norris  Abstract
ALTERNATIVE LEAD FREE BALL MATERIALS WITH IMPROVED INTERFACE PROPERTIES H.-J. Albrecht et al.  Abstract
HOW TO SOLDER NON-STANDARD CBGAs OF 1.0mm PITCH Haoqiang Song and Zhe Liu  Abstract
ASSEMBLY ISSUES WITH MICROVIA TECHNOLOGIES Harjinder Ladhar and Sundar Sethuraman  Abstract
APPLYING SIX SIGMA TECHNIQUES TO CONTROL SCRAP COSTS AND IMPROVE QUALITY IN SMT MANUFACTURING Hersh Kohli and *SooBeng Khoh, Ph.D.  Abstract
CAPITAL EQUIPMENT PRODUCTION Ian McEvoy  Abstract
LEVERAGING MAINSTREAM DESIGN & ANALYSIS TOOLS FOR MEMS Ilya Mirman  Abstract
NEMI TIN WHISKER TEST METHOD STANDARDS Irina Boguslavsky  Abstract
SOLDER PASTE STENCIL PRINTING PERFORMANCE BASED ON STENCIL AND SOLDER PASTE TECHNOLOGY James Adriance et al.  Abstract
EVALUATION OF LEAD-FREE SOLDER BONDS AND EFFECTS OF THE LEAD-FREE PROCESS ON DEVICES USING ACOUSTIC MICRO IMAGING Janet E. Semmens  Abstract
THERMALLY INDUCED OUT OF PLANE DEFORMATION ANALYSIS FOR A FLIP CHIP ON FLEX 35MM TBGA Jennifer Muncy et al.  Abstract
USE OF SUBSTRATE ETCHBACK TECHNOLOGY AND ROTATED DIE PLACEMENT TO ACHIEVE HIGH DENSITY INTERCONNECT Jesse Phou  Abstract
IN SEARCH OF THE PERFECT BOM Jim Arnold  Abstract
SOLID-METAL THERMAL COLUMNS IN CONVENTIONAL PCBs Jim Fraivillig  Abstract
BLACK PAD DEFECT: INFLUENCE OF GEOMETRY AND OTHER FACTORS Jodi Roepsch, Robert Champaign, and Barbara Waller  Abstract
IMPROVING THE ACCEPTANCE OF FLIP CHIP John Davis et al.  Abstract
TOWARDS WAFER-SCALE MEMS PACKAGING: A REVIEW OF RECENT ADVANCES John Heck and Steve Greathouse  Abstract
CLEANING NEW SOLDER PASTE FORMULATIONS WITH A UNIQUE LOW-VOC AQUEOUS CLEANING AGENT John R. Sanders et al.  Abstract
THE DEVELOPMENT OF ADVANCED X-RAY INSPECTION Jon C. Dupree  Abstract
EMERGING TRENDS IN SELECTIVE SOLDERING TECHNOLOGY Jonathan Wol and Adrian De’ath  Abstract
AN EXAMINATION OF 'DRY BOX' DESICCANT STORAGE WITHIN THE PCB MANUFACTURING ENVIRONMENT Kevin McCarten  Abstract
EFFECT OF PRINTED WIRING BOARD WARPAGE ON BALL GRID ARRAYS OVER TEMPERATURE Kyra Ewer and Jeffrey Seekatz  Abstract
ELECTROLESS WAFER-LEVEL REDISTRIBUTION - FURTHER DEVELOPMENT AND NEW APPROACHES FOR SYSTEM INTEGRATION L. Boettcher et al.  Abstract
THIN ARRAY POLYMER PACKAGING FOR RF MODULES Leo M. Higgins III, Ph.D  Abstract
INTEGRATING COMMERCIAL OFF THE SHELF PACKAGES (COTS) INTO GUIDED MISSILE SYSTEMS: THE EMMA PROGRAM Leopold A. Whiteman, Jr.  Abstract
ORGANIC FLIP CHIP PACKAGING DESIGN AND MANUFACTURING CHALLENGES Louis Liu et al.  Abstract
EVALUATION OF SEMICONDUCTOR PACKAGE RELIABILITY WITH FOUR METAL LAYER PLASTIC BALL GRID ARRAY LAMINATE SUBSTRATES Lucy Grace Dearce et al.  Abstract
SELECTIVE SOLDERING WITH LEAD-FREE ALLOYS Marc Dalderup et al.  Abstract
LEAD-FREE CARD ASSEMBLY AND REWORK FOR COLUMN GRID ARRAYS Marie Cole et al.  Abstract
FEASIBILITY ANALYSIS METHODOLOGY FOR STACKED-DIE VS. SINGLE-DIE PACKAGE CONSIDERATIONS Mark Gerber and Shawn O’Connor  Abstract
LONG TERM RELIABILITY OF 0.8MM PITCH BGA PACKAGES DOUBLE-SIDE MOUNTED ON A THIN PRINTED CIRCUIT BOARD Mark Logterman et al.  Abstract
SOLDER JOINTS FOR HIGH TEMPERATURE ELECTRONICS Mathias Nowottnick et al.  Abstract
HAND PLACING LEADLESS AND FINE PITCH LEADED COMPONENTS WITH SIPAD SOLID SOLDER DEPOSITION Matthew J. Kehoe  Abstract
INTEGRATION OF AOI IN A TOTAL QUALITY MANAGEMENT PROGRAM Matthew T. Holzmann  Abstract
EVALUATION, OPTIMIZATION, AND RELIABILITY OF NO-FLOW UNDERFILL PROCESS Michael Colella  Abstract
CAPITAL EQUIPMENT JUSTIFICATION AND APPROVAL Michael R. Weekes  Abstract
INCREASE YIELD THROUGH MACHINE PERFORMANCE OPTIMIZATION Michael Sivigny  Abstract
DESIGNED FOR THE ENVIRONMENT CLEANING TECHNOLOGY MORE WITH LESS Mike Bixenman  Abstract
MEASUREMENT OF MATERIALS PROPERTIES OF LEAD-FREE SOLDERS FOR MODELLING REQUIREMENTS Milos Dusek and Christopher Hunt  Abstract
CHARACTERIZATION OF MECHANICAL PERFORMANCE OF SN/AG/CU SOLDER JOINTS WITH DIFFERENT COMPONENT LEAD COATINGS Minna Arra et al.  Abstract
PROCESS CHALLENGES AND SOLUTIONS FOR EMBEDDING CHIP-ON-BOARD INTO MAINSTREAM SMT ASSEMBLY Mukul Luthra  Abstract
DFX USING DPMO REDUCES THE COST OF PCB ASSEMBLY Neil Donga et al.  Abstract
QUAD FLAT PACK NO LEAD (QFN) BOARD LEVEL RELIABILITY STUDY FOR AUTOMOTIVE APPLICATIONS Pamela O’Brien1 and Thomas Koschmieder2  Abstract
HIGH PIN COUNT POWER PACKAGE FOR HIGH CURRENT, HIGH TEMPERATURE AUTOMOTIVE APPLICATIONS Paolo Casati et al.  Abstract
RELIABILITY OF 15MM, 0.65 MM PITCH MOLD ARRAY PROCESS (MAP) BALL GRID ARRAY (BGA) FOR AUTOMOTIVE APPLICATIONS Patrice Langford and Thomas Koschmieder  Abstract
OPTIMISING ASSEMBLY PROCESS TO ACCOMMODATE OSP FINISH ON PRINTED CIRCUIT BOARDS Paul Doyle, Dirk Eickenhorst and Werner Laub  Abstract
REWORK OF BGA/CSP COMPONENTS USING LEAD FREE SOLDERS Paul Wood  Abstract
DAMAGE RELATIONSHIPS FOR BGA AND CSP RELIABILITY IN AUTOMOTIVE UNDERHOOD APPLICATIONS Pradeep Lall et al.  Abstract
SIX SIGMA BUSINESS SCORECARD Praveen Gupta  Abstract
0201 TECHNOLOGY IMPLEMENTATION STRATEGY FOR CEMs Reggie Malli  Abstract
VISUAL AND X-RAY INSPECTION CHARACTERISTICS OF EUTECTIC AND LEAD FREE ASSEMBLIES Reza Ghaffarian, Ph.D.  Abstract
VIBRATION BEHAVIOR OF CSP ASSEMBLIES WITH AND WITHOUT UNDERFILL Reza Ghaffarian, Ph.D. and *Namsoo Kim  Abstract
EMBEDDING CERAMIC THICK-FILM RESISTORS AND CAPACITORS IN PRINTED CIRCUIT BOARDS Richard Snogren  Abstract
TAKING DFX TO THE NEXT LEVEL Richard Tormet  Abstract
USE OF SIX SIGMA METHODOLOGIES IN ELECTRONICS PROCESSING INDUSTRIES Rita Mohanty, Ph.D.  Abstract
LOW COST COMPUTING FOR THE SMALL BUSINESS ELECTRONICS CONTRACT MANUFACTURER Romeo Asuncion  Abstract
LEADED AND LEAD-FREE SOLDER PASTE EVALUATION SCREENING PROCEDURE Ronald C. Lasky, Ph.D., PE et al.  Abstract
EFFECTS OF THERMAL INTERFACE MATERIAL ON SOLDER JOINT RELIABILITY Ross Wilcoxon and Dave Hillman  Abstract
GETTING SMALL WITH DIP PEN NANOLITHOGRAPHY S. Cruchon-Dupeyrat  Abstract
ULTRA HIGH-TEMPERATURE PRESSURE SENSITIVE ADHESIVE FOR ELECTRONICS ASSEMBLY S. Jimmy Hwang, Ph.D.  Abstract
CASE STUDIES IN THE EVALUATION OF MOISTURE SENSITIVE LEVEL (MSL) AND RELIABILITY OF DEVICES FOR HIGH RELIABILITY (HIGH-REL) APPLICATIONS S. R. Martell  Abstract
CURE PROCESSING EFFECT ON CONDUCTIVE EPOXY ADHESIVES AS SOLDER ALTERNATIVES: CERAMIC APPLICATIONS S. Smith, C-M Cheng, W. O’Hara, and V. Buffa  Abstract
A COMPARATIVE ANALYSIS OF LEAD FREE MATERIALS AND PROCESSES USING DESIGN OF EXPERIMENTS TECHNIQUES Sammy Shina et al.  Abstract
EFFECTS OF VIA PLUGGING IN MULTILAYER PRINTED CIRCUIT BOARDS Santhana Satagopan and Manthos Economou  Abstract
MINIATURIZATION USING 3-D STACK STRUCTURE FOR SIP APPLICATIONS Serguei Stoukatch et al.  Abstract
CLEANING OUT HIGH COST OF OWNERSHIP WITH PERFORMANCE ADVANCEMENTS Shean R. Dalton  Abstract
A SIMULATION-BASED CONTROL AND ANALYSIS ARCHITECTURE FOR ELECTRONICS MANUFACTURING PROCESSES Sreeram Ramakrishnan et al.  Abstract
PROCESS OPTIMIZATION FOR MINIMIZING VOIDS IN CERAMIC DIMPLED BALL GRID ARRAYS Steven H. Mills et al.  Abstract
CALCULATING THE REAL COST OF OFFSHORE OUTSOURCING Susan E. Mucha  Abstract
AUTOMATED SELECTIVE SOLDERING OF LEAD-TIN AND LEAD-FREE SOLDERS - A COMPARATIVE STUDY USING DIODE LASER AND XENON LAMP Syed Naveed et al.  Abstract
RELIABILITY AND ENVIRONMENTAL TESTING OF BLUETOOTH MODULES Teijo Kuosmanen et al.  Abstract
EFFECTS OF SURFACE CONTAMINATION ON PRODUCT YIELD Terence Q. Collier  Abstract
IMPLEMENTATION OF SQC TECHNIQUES FOR CLOSED LOOP PROCESS CONTROL IN ELECTRONICS MANUFACTURING Thanigai Kumar S. Vellore et al.  Abstract
PB FREE / HIGH TEMPERATURE REFLOW MSL PACKAGE ASSESSMENT OF A LGA PACKAGE ALTERNATIVE FOR PORTABLE PRODUCTS Thomas Koschmieder and Fonzell Martin  Abstract
DESIGN, PERFORMANCE AND RELIABILITY OF FIVE NEW LOW COST THERMALLY ENHANCED BGA Tiao Zhou, Ph.D. et al.  Abstract
DESIGN ANALYSIS OF BOARD LEVEL SOLDER JOINT RELIABILITY FOR THERMALLY ENHANCED BGAs Tong Yan Tee et al.  Abstract
RELIABILITY COMPARISON OF LEADED, ARRAY, & LEADLESS PACKAGES ON ALTERNATIVE PWB FINISHES Trevor S. Bowers et al.  Abstract
RELIABILITY COMPARISON OF LEADED, ARRAY, & LEADLESS PACKAGES ON ALTERNATIVE PWB FINISHES Trevor S. Bowers et al.  Abstract
A STUDY OF THE ACCURACY OF COMPONENT PLACEMENT SIMULATION IN ELECTRONICS MANUFACTURING V. Kawli, D. Warheit and K. Srihari  Abstract
INNOVATIVE 3-D SOLUTIONS FOR MULTIPLE DIE PACKAGING Vern Solberg  Abstract
BALL STACK PACKAGING FOR HIGH PERFORMANCE MEMORY Vern Solberg, Ignacio Osorio, and Jeffrey Demmin  Abstract
ROLE OF HDPUG IN LEAD-FREE TRANSITION Vivek Gupta  Abstract
NON-DESTRUCTIVE ANALYSIS METHOD FOR DETECTION OF THE "BLACK PAD DEFECT" ON PCB SURFACES Wade E. McFaddin  Abstract
MANAGING WASH LINES AND CONTROLLING WHITE RESIDUE BY STATISTICAL PROCESS CONTROL William T. (Tim) Wright  Abstract
EVALUATION OF THERMALLY RELIABLE PWB SUBSTRATES William Varnell and Ron Hornsby  Abstract
NEW ELECTROMIGRATION FAILURE MODE IN FLIP CHIP SOLDER JOINTS Y. H. Lin et al.  Abstract
ACCELERATED THERMAL CYCLING OF TIN-LEAD AND LEAD-FREE SOLDER JOINTS Yan Qi et al.  Abstract
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