Pan Pacific Symposium 1999 Proceedings

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TITLE AUTHOR
A CSP OPTOELECTRONIC PACKAGE FOR IMAGING AND A. Badihi  Abstract
MODULAR ASSEMBLING TECHNIQUES FOR MICROELECTRONIC SENSORS: ADVANCED DESIGN A. Brandolini  Abstract
MULTILAYER HIGH DENSITY FLEX INTERCONNECT Bill Chou  Abstract
CONSIDERATIONS IN AN INTERNATIONAL BUSINESS ENVIRONMENT FOR HIGH VOLUME ULTRA-THIN MULTILAYER PRINTED CIRCUIT BOARD FABRICATION Dale Lee  Abstract
ULTRA-THIN PRINTED CIRCUIT ASSEMBLY – A SOLUTION FOR LIGHT WEIGHT & COMPACT ELECTRONIC PRODUCTS Dale Lee  Abstract
EVALUATING THE MECHANICAL RELIABILITY OF REBALLED BGA MODULES Daryl L. Santos  Abstract
FABRICATION AND ASSEMBLY OF A 3D SRAM MEMORY MCM David Scheid  Abstract
INDIVIDUAL PART LEVEL TRACEABILITY IN THE BACK END OF SEMICONDUCTOR MANUFACTURING Ed Caracappa  Abstract
CSP TECHNOLOGY DEVELOPMENT FOR NON-COMMERCIAL APPLICATIONS Emmanuel J. Siméus  Abstract
ADVANCEMENTS IN HIGH DENSITY "IMPRINTED" CIRCUITS George D. Gregoire  Abstract
LEADING EDGE TECHNOLOGIES USING ADVANCED CHIP SHOOTERS Günter Schiebel  Abstract
OPTIMIZATION OF THERMAL BEHAVIOR FOR RESISTORS IN LTCC AND POSSIBILITIES TO INCREASE THE PERFORMANCE Heiko Thust  Abstract
TEMPERATURE EFFECTS ON ENCAPSULANT DISPENSING Horatio Quinones  Abstract
VIA-FILLING USING ELECTROPLATING FOR BUILD-UP PRINTED CIRCUIT BOARDS I. Kobayashi  Abstract
DEVELOPMENT OF THE REAL CHIP SIZE PACKAGE USING THE WAFER LEVEL ASSEMBLY PROCESS Ichiro Mihara  Abstract
THE NEW POSSIBILITIES FOR MANUFACTURABILITY OF THICK – FILM INTELLIGENT GLUCOSE BIOSENSORS IN MCM-C TECHNOLOGIES J. J. Gondek  Abstract
WAFER LEVEL CHIP SCALE PACKAGING BENEFITS FOR INTEGRATED PASSIVE DEVICES James L. Young  Abstract
CONSIDERATIONS FOR PRACTICAL IMPLEMENTATION OF CSP TEST AND BURN-IN James Rathburn  Abstract
ACOUSTIC MICROSCOPY OF FLIP CHIP PACKAGES Joel Sigmund  Abstract
TRANSFORMING FLIP CHIP INTO CSP WITH REWORKABLE WAFER-LEVEL UNDERFILL Ken Gilleo  Abstract
STUDY ON THE UNDER BUMP METALLURGY(UBM) OF ELECTRO-PLATED EUTECTIC Pb/Sn SOLDER BUMPS ON ORGANIC SUBSTRATES Kyung-Wook Paik  Abstract
CHOOSING THE CORRECT CHIP SIZE PACKAGE FOR THE RIGHT APPLICATION Marc Papageorge  Abstract
FUJITSU/SUN MICROSYSTEMS ULTRASPARC-IIi MCM: MINIATURIZATION TO THE EXTREME Michelle Hou  Abstract
INFLUENCE OF COEFFICIENT OF THERMAL EXPANSION OF ADHESIVE RESIN IN A RESIN PRESSURE CONTACT FLIP CHIP Mitsuru Mura  Abstract
DEVELOPING A BEST PRACTICES ENVIRONMENTAL DATABASE (BePED) FOR IRISH SMALL TO MEDIUM SIZED ENTERPRISES P. Wycherley  Abstract
ULTRA CSP(tm) A WAFER LEVEL PACKAGE Peter Elenius  Abstract
BOARD LEVEL RELIABILITY EVALUATIONS OF 40, 32 AND 30 MIL PITCH BALL GRID ARRAY PACKAGES OVER -40 TO 125 C Puligandla Viswanadham  Abstract
THE WORLDWIDE PCB ASSEMBLY MARKET Randall Sherman  Abstract
MANAGEMENT STRATEGIES FOR DEVELOPING A VERSATILE GROUP OF MANUFACTURING ENGINEERS Reggie Malli  Abstract
PROPERTIES OF DC MAGNETRON SPUTTERED NICKEL-CHROMIUM ALLOY THIN FILMS Ronald S. Nowicki  Abstract
USE OF AUGER AND OTHER SURFACE ANALYSIS TOOLS TO IDENTIFY FAILURE MECHANISMS IN THIN FILMS USED IN TAB AND OTHER DEVICE PACKAGING Ronald S. Nowicki  Abstract
ADVANCED VIA FILLING METHODS FOR HDIS APPLICATIONS S. Pierce  Abstract
ESSENTIALS OF BALL GRID ARRAY PROCESS IMPLEMENTATION Salim Merchant  Abstract
BOARD LEVEL RELIABILITY OF HIGH 1/0 STAGGERED ARRAY EUTECTIC BGA PACKAGES Santhana S. Satagopan  Abstract
SOLDER REFLOW METHOD AND REFLOW TEMPERATURE PROFILE Yizhe Elisa Huang  Abstract
A NOVEL FLIP CHIP BONDING TECHNOLOGY USING Au STUD BUMP Yoshihiro Yoneda  Abstract
IMPACT OF RESEARCH AND DEVELOPMENT EFFORTS ON STOCK EXCHANGE EXPECTATIONS -STUDY ON SAMPLE OF CORPORATIONS Zoltán B. Farkas  Abstract
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