Pan Pacific Symposium 2003 Proceedings

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TITLE AUTHOR
EMI-ORIENTED DESIGN OF 3D-PACKED MICROELECTRONICS DEVICES A. Brandolini, A. Gandelli and R.E. Zich  Abstract
MICROSTRUCTURE AND SOLDERING PROPERTIES OF CSP SOLDER JOINTS USING Sn-Zn-Bi SOLDER Atsushi Yamaguchi et al.  Abstract
BUMPLESS FLIP CHIP PACKAGES Charles W.C. Lin, Ph.D., Sam Chiang, and T.A. Yang  Abstract
UNDERFILL ADHESIVE FILMS FOR FLIP CHIP AND CSP PACKAGES David Gagnon, Ph.D., Zenner, Zieminski, and Kropp  Abstract
LOW STRESS, EQUIVALENT SOLDER BGA REWORK Don Saunders  Abstract
PRINTABLE DIE ATTACH ADHESIVES FOR SUBSTRATE-ON-CHIP PACKAGING Dr. Kevin Becker  Abstract
µPGA SOCKET AND SOLDER JOINT RELIABILITY STUDY Dr. Paul P.E. Wang et al.  Abstract
EFFECTIVE TECHNIQUES FOR HIGH ACCURACY EUTECTIC DIE BONDING Edward J. Wills  Abstract
HIGH DENSITY ADVANCED PACKAGING 100-MICRON RESIST APPLICATION Eric Huenger et al.  Abstract
METHOD AND MATERIAL FOR MAINTAINING CLEANLINESS OF HIGH DENSITY CIRCUITS DURING ASSEMBLY Gary M. Freedman and Evelyn Baldwin  Abstract
CHOOSING YOUR MANUFACTURING PARTNER Grant Bunting  Abstract
LIFETIME PREDICTION BY FE-SIMULATION AND EXPERIMENTAL VERFICATION FOR VIAS AND MICROVIAS IN HDI-SUBSTRATES H.-J. Albrecht et al.  Abstract
FAILURE MODE AND EFFECTS ANALYSIS IN ELECTRONICS MANUFACTURING J. Patel, F. Jusufagic, S. Phadnis, and K. Srihari  Abstract
EFFECT OF WATER BATH TEMPERATURE ON SAM INSPECTIONS James C. P. McKeon  Abstract
POWER GOLD FOR 175°C Tj-max James J. Wang and Bob Baird  Abstract
EVALUATION OF MEMS (MICRO-ELECTRO-MECHANICAL SYSTEMS) USING ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler  Abstract
STATE OF THE ART DETECTION & QUANTIFICATION OF OUTGASSED COMPOUNDS FOR THE OPTO ELECTRONICS & MICRO ASSEMBLY INDUSTRIES John C. Hulteen, Ph.D.  Abstract
SIGNAL INTEGRITY SYSTEM SOLUTIONS FOR HIGH SPEED BACKPLANE TRANSMISSION AND CONNECTORS INTEGRATED IN PACKAGES Josh G. Nickel et al.  Abstract
DEVELOPMENT OF METAL JOINT FLIP CHIP MOUNTING PROCESS USING SURFACE ACTIVATED BY PLASMA ENERGY Kazushi Higashi and Shinji Ishitani  Abstract
CAN ET PULL US UPWARD? Ken Gilleo  Abstract
Ag-Sn ALLOYS AS CONDUCTIVE FILLERS IN ICAS Kenichi Suzuki  Abstract
MICROELECTRONICS PACKAGING RESEARCH DIRECTIONS FOR AEROSPACE APPLICATIONS Lissa Galbraith, Ph.D.  Abstract
ANALYSIS OF WETTING AND TENSILE STRENGTH OF SOLDER ALLOYS Mark T. McMeen and Jason B. Gjesvold  Abstract
CARBON NANOTUBES AND AN OPTICAL METHOD FOR LIFE CONSUMPTION MONITORING OF ELECTRONIC ASSEMBLIES Paul Casey, Davinder K. Anand, and Michael Pecht  Abstract
MICRO AND NANO -SMT PARADIGMS ON THE HORIZON: FACT OR FICTION? Rao R. Tummala  Abstract
TECHNOLOGY ROADMAP FOR SILICONE ADHESIVES IN THIN MULTI-CHIP PACKAGES S. J. Dent, K. Mine, Y. Ushio, M. J. Watson  Abstract
ACHIEVING INCREASED PRODUCTIVITY AND PROFITABILITY IN AN EMS ENVIRONMENT USING LEAN MANUFACTURING TOOLS AND TECHNIQUES S. Manian Ramkumar  Abstract
SMT ASSEMBLY PROCESS COMPARISON OF PB-FREE ALLOY SYSTEMS - PART I Shafi Saiyed and Daryl Santos, Ph.D.  Abstract
SIX-SIGMA PROCESS DEVELOPMENT FOR SOLDER PASTE DEPOSITION IN A HIGH VOLUME - LOW MIX SMT LINE Sharafali Shaherwala et al.  Abstract
A STUDY ON THE CONDUCTIVE BEHAVIOR OF COPPER FILLED PASTES FOR MICROELECTRONIC PACKAGING SUBSTRATES Shen-Li Fu , YS Lin, SS Chiu, and CS Shi  Abstract
A NEW POWER MEMS COMPONENT WITH VARIABLE CAPACITANCE Sterken, Baert, Puers, Borghs, Mertens  Abstract
DESIGN ISSUES RELATED TO AREA ARRAY PACKAGING TECHNOLOGY Steve R. Stegura and Emmanuel J. Siméus  Abstract
AN INVESTIGATION ON THE RELIABILITY OF CSP SOLDER JOINTS WITH NUMEROUS UNDERFILL MATERIALS Sunny Zhang, Fowler Chang, and Dr. Shelgon Yee  Abstract
JOINT RELIABILITY OF FLIP CHIP INTERCONNECTION WITH SN-BI SOLDER T. Akamatsu, H. Ueda, M. Ochiai, and E. Horikoshi  Abstract
REAL CHIP SIZE 3-DIMENSIONAL - STACKED PACKAGE Takao Yamazaki et al.  Abstract
WLP TODAY: MARKET DRIVERS AND OPPORTUNITIES Thomas Goodman and Peter Elenius  Abstract
PRACTICAL AND COST EFFECTIVE SOLUTIONS FOR 3D IC PACKAGING Vern Solberg and Craig Mitchell  Abstract
THREE-DIMENSIONAL PACKAGING AND ASSEMBLY OF HIGH-CAPACITY MEMORY MODULES Wei Koh, Ph.D.  Abstract
LOW COST HIGH PERFORMANCE BGA - C2BGA William Rugg et al.  Abstract
THE THERMO-MOIST MECHANICAL GENERALIZED HYBRID/MIXED SINGULAR FEA OF GBA PACKAGING STRUCTURES WITH SMT STRESSES AND SEALING CRACKS Wu Zhang et al.  Abstract
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