2002 NEPCON West - Fiberoptic Expo Proceedings

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TITLE AUTHOR
OPTOELECTRONICS - MAINSTREAM OR TRIBUTARY? NEMI’S OPTOELECTRONICS INITIATIVES Alan Rae  Abstract
RELIABILITY EVALUATION OF CCGA MODULES SUBJECTED TO THERMAL CYCLING USING ELECTRON-BEAM MOIRE TECHNIQUE Arvind Sinha  Abstract
NANO-OPTICS: NEW OPTICAL STRUCTURES AND LITHOGRAPHY ENABLE STANDARDIZED MANUFACTURING FOR MULTIPLE COMPONENTS Barry J. Weinbaum and Hubert Kostal  Abstract
OPTOELECTRONIC PACKAGING FOR AUTOMATION Ben Velsher and Jeff Venegas  Abstract
PXI 101 - AN OVERVIEW OF THE PXI ARCHITECTURE Bob Stasonis  Abstract
PRECISION ASSEMBLY AUTOMATION Brian Carlisle  Abstract
HIGH RELIABILITY, AUTOMATED FIBER RECOAT PROCESS THAT INCREASES FIBER RECOATING YIELDS Bryon J. Cronk et al.  Abstract
DESIGN GUIDELINES FOR AVOIDING FLEX CRACKING IN CERAMIC CAPACITORS C. Hillman, N. Blattau, and D. Barker  Abstract
INVESTIGATING MASS IMAGING LEAD FREE MATERIALS USING ENCLOSED PRINT HEAD TECHNOLOGY Clive Ashmore and Rick Goldsmith  Abstract
LEAN ENTERPRISE TRANSFORMATION AT LASER SURGERY DEVICE MANUFACTURER Collin McLoughlin  Abstract
ELECTRODEPOSITED RESIST - A COMPARISON BETWEEN POSITIVE AND NEGATIVE RESIST Daniel Paine, Ph.D. et al.  Abstract
PROCESS CHARACTERIZATION OF PCB ASSEMBLY USING 0201 PACKAGES WITH LEAD-FREE SOLDER David Geiger et al.  Abstract
TWO FUNDAMENTAL APPROACHES TO ENABLING HIGH PERFORMANCE LGA CONNECTIONS Dirk D. Brown et al.  Abstract
A STUDY OF SMALL AND TAPERED APERTURE TRANSFER EFFICIENCY Dr. Gerald Pham-Van-Diep, F. Andres and I. Fleck  Abstract
LEAD-FREE SOLDER INTERCONNECTIONS FOR SMT MANUFACTURING Dr. Jennie S. Hwang  Abstract
FLEXIBLE CIRCUITS - THE NEXT 100 YEARS Dr. Ken Gilleo  Abstract
SURFACE MOUNT OPTICS - A NEW APPROACH TO PHOTONIC ASSEMBLY Dr. Steven K. Case  Abstract
EPOXY FLUX - AN ANSWER FOR LOW COST NO-CLEAN FLIP CHIP ASSEMBLY Dr. Wusheng Yin et al.  Abstract
LOW COST NO-FLOW UNDERFILLING BEING A REALITY FOR MANUFACTURING Dr. Wusheng Yin et al.  Abstract
MARKET PULL VS. TECHNOLOGY PUSH: TRENDS IN PHOTONIC DEVICE PACKAGING & AUTOMATED ASSEMBLY AFTER THE BUBBLE Edward Palen, Ph.D., P.E.  Abstract
LASER SOLDER ATTACHING FOR OPTOELECTRONICS AND MEMS PACKAGES Elke Zakel et al.  Abstract
ADVANCES IN STACKED-DIE PACKAGING Flynn Carson and Marcos Karnezos  Abstract
SYSTEM-IN-PACKAGE: A WIRELESS SOLUTION FOR CELL PHONES Frank Juskey  Abstract
BACKPLANE ASSEMBLIES FOR > 10 Gb/s Franz Gisin and Dr. Sundar Kamath  Abstract
FLUX-LESS / VOID-FREE - AN ENVIRONMENTALLY FRIENDLY SOLDERING PROCESS FOR OPTOELECTRONICS ASSEMBLIES Gary Pangelina  Abstract
OPTIMIZING THE FEAR FACTORS IN 0201 ASSEMBLY Harjinder Ladhar and Sundar Sethuraman  Abstract
THE EFFECT OF AGING ON THE SHEAR STRENGTH OF LEAD-FREE AND LEAD-BEARING BGA SOLDER SPHERES Indraneel Chatterji, Daryl Santos, & Frank Andros  Abstract
INCREASING QUALITY & PRODUCTIVITY 30-60% WITHOUT ADDING PEOPLE OR EQUIPMENT Ingrid Gudenas, M.Ed.  Abstract
MIXED SIGNAL DESIGN ISSUES James C. Blankenhorn  Abstract
AUTOMATION'S PLACE IN FIBER OPTIC INDUSTRY RESTRUCTURING Jeff D. Montgomery  Abstract
INTELLIGENT SPC METHODOLOGY USING AOI/XRAY DATA CORRELATION Jeff Harrell  Abstract
MODEL BASED AUTOMATIC FIBER ALIGNMENT Jeongsik Sin, Dan Popa, and Harry E. Stephanou  Abstract
MICROVIA FATIGUE LIFE PREDICTION UNDER THERMO-MECHANICAL CYCLIC LOADING CONDITION Jianjun Wang et al.  Abstract
SOLDER FLUX BEARING LEAD TECHNOLOGY - AN ALTERNATIVE METHOD OF SOLDERING THROUGH HOLE CONNECTORS WITH SMT PROCESSES Jim Zanolli and Joe Cachina  Abstract
3D NONLINEAR STRESS ANALYSIS OF TIN WHISKER INITIATION ON LEAD-FREE COMPONENTS John H. Lau  Abstract
FLEXIBLE PRINTED CIRCUIT TECHNOLOGY - A VERSATILE INTERCONNECTION OPTION Joseph Fjelstad  Abstract
REDEFINING THE PERFORMANCE LIMITS OF COPPER CIRCUITS Joseph Fjelstad, B. Haba, Ph.D. and Para Segaram  Abstract
AUTOMATED PACKAGING OF MEMS DEVICES Joseph S. Bell  Abstract
FUTURE BANKS ON WIFI (802.11) & BLUETOOTH K Raghu Raghunathan  Abstract
EFFECTS OF VISION PARAMETERS ON PHOTONICS AUTOMATION SYSTEM PERFORMANCE K.M. (Timber) Yuen and Joshua Capogna  Abstract
A STUDY OF LEAD-CONTAMINATION IN LEAD-FREE ELECTRONICS ASSEMBLY AND ITS IMPACT ON RELIABILITY Karl Seelig and David Suraski  Abstract
RELIABLE SERIAL BACKPLANE DATA TRANSMISSION AT 10 GB/S Ken Lazaris-Brunner et al.  Abstract
ADHESIVE FOR OPTICAL MULTICHANNEL V-GROOVE ARRAY Kenichi Suzuki et al.  Abstract
OPTOELECTRONIC PACKAGING CONCEPTS USING ACTIVE POLYMER SYSTEMS Leo M. Higgins III, Ph.D.  Abstract
TRANSCEIVER FUNCTIONAL TESTING Leonardo Bonanomi and Stefano Meroni  Abstract
COMBINATION AOI/AXI SYSTEMS - A POWERFUL SOLUTION FOR PWA INSPECTION Lloyd Jones and William K. Pratt  Abstract
BUILDING TEST APPLICATIONS USING TIMING AND TRIGGERING USING PXI Lokesh Duraiappah  Abstract
INDUSTRY-WIDE DESIGN FOR TESTABILITY GUIDELINES Louis Y. Ungar  Abstract
ELECTRICALLY CONDUCTIVE SILICONE ADHESIVE Luis C. Montemayor  Abstract
ACCURACY MEASUREMENT TECHNIQUES: GLASS PARTS VERSUS REAL PARTS Michael Cieslinski  Abstract
LOWERING THE COST OF TESTING MULTI-CHANNEL OPTICAL DEVICES Michael Dewey et al.  Abstract
OVERCOMING THE CURRENT QUALITY PLATEAU Michael Motherway  Abstract
EFFECTIVE DIELECTRIC CONSTANT OF COMPOSITE PACKAGING MATERIALS Michael Todd and Frank Shi  Abstract
THERMAL AGING CHARACTERIZATION OF OSP METAL FINISHING FOR FLIP CHIP PACKAGING WITH FOUR LAYER LAMINATE SUBSTRATE Mike C. Loo and Lily Zhao  Abstract
GLASS SEALING MIM BOXES FOR FIBER OPTIC AND ELECTRONIC PACKAGES Mitchell N. Gross  Abstract
CPI: A POWERFUL BUSINESS STRATEGY N.T. "Bala" Balakrishnan CFPIM, CQE  Abstract
E BUSINESS: A REVIEW OF TRAINING NEEDS AND WHAT THE B SCHOOLS ARE DOING N.T. "Bala" Balakrishnan CFPIM, CQE  Abstract
DEMAND CHAIN INTEGRATION & PULL-BASED REPLENISHMENT USING eBizKanban Narayan Laksham  Abstract
VISCOSITY AND STENCIL PRINTING BEHAVIOR OF SURFACE MOUNT ADHESIVES Neil Poole, Ph.D. and Brian J. Toleno, Ph.D.  Abstract
LEAN AND GREEN: PROFIT FOR YOUR WORKPLACE AND THE ENVIRONMENT Pamela J. Gordon, Certified Management Consultant  Abstract
SEVEN STEPS TO APPROACHING CONTINUOUS PROCESS IMPROVEMENT Patricia A. Worsham  Abstract
3-D GEOMETRIC COMPONENT LIBRARY USAGE THROUGHOUT THE DESIGN THROUGH MANUFACTURING PROCESS Patrick E. McGoff  Abstract
THE ESSENTIALS OF OUTSOURCING - HIGH LEVEL, HIGH TECH, ELECTRONIC AND ELCETRO/MECHANICAL SYSTEMS Peter C. Gordon  Abstract
SIX SIGMA - MAKING IT WORK FOR YOU Praveen Gupta, Master Six Sigma Black Belt  Abstract
OPTICAL MANUFACTURING BY LEADING CONTRACT MANUFACTURERS Randall Sherman  Abstract
SUB-MICRON FIBER ATTACHMENT USING LASER-ASSISTED FLUXLESS SOLDER REFLOW Randy Heyler et al.  Abstract
GROUND BOUNCE AND BOUNDARY SCAN TESTING Ray Balzer and Phil King  Abstract
THE OPTOELECTRONIC ASSEMBLY WORKCELL Ray Gottsleben and Steve Sytsma*  Abstract
NEW STENCIL DESIGN FOR EPOXY PRINTING Rich Freiberger  Abstract
PARALLEL TESTING LOWERS THE COST OF MANUFACTURING TEST Richard McDonell  Abstract
AGILE CURING FOR PHOTONICS ASSEMBLY Richard S. Garard and Joseph Wander  Abstract
SMT FAILURES ASSOCIATED WITH THE HASL SURFACE FINISH Roger Jay and Alfred Kwong  Abstract
ADVANCED CHIP TEST TECHNIQUES AT HIGHER INTEGRATION LEVELS Ron Press  Abstract
FINITE ELEMENT MODELING OF BALL GRID ARRAY PACKAGES IN SYSTEM PACKAGING VIBRATION ANALYSIS Ron S. Li  Abstract
PIGTAILING OF FABRY-PEROT LASER DIODE TO CLEAVED AND WEDGE-SHAPED SINGLE MODE FIBERS: ALIGNMENT DEPENDENT RIN AND LASER-FIBER COUPLING EFFICIENCY Rong Zhang and Frank G. Shi  Abstract
EVALUATION OF FUSION SPLICERS FOR HIGH STRENGTH SPLICING Salil Pradhan et al.  Abstract
HOW TO WIN THE NPI GAME Salim Merchant  Abstract
THE SECRET TO SUCCESSFULLY MANAGE TODAY’S MANUFACTURING ENTERPRISE BEYOND THE FOUR WALLS Sharone Zehavi  Abstract
WHEN TO USE AOI, WHEN TO USE AXI, AND WHEN TO USE BOTH Stig Oresjo  Abstract
FROM SUPPLIERS TO EMS: REVIEW OF THE FACTORS AFFECTING CLEANLINESS OF FIBER OPTIC CONNECTORS Tatiana Berdinskikh et al.  Abstract
SIX SIGMA AT 3M Thomas A. Roth  Abstract
AUTOMATED OPTICAL INSPECTION (AOI) - A YIELD MANAGEMENT SOLUTION FOR THE HIGH DENSITY INTERCONNECTION (HDI) INDUSTRY Thomas Cinque et al.  Abstract
LIFE-TESTS OF SMALL SAMPLE SIZES = TROUBLE... OR WHAT CAN YOU LEARN, IF YOU TEST ONLY A FEW? Tom Clifford  Abstract
A NOVEL FLIP CHIP APPROACH FOR MICROWAVE/HIGH SPEED DATA CHIP PACKAGING Tong Chen and Suchet Chai  Abstract
IMPLEMENTATION AND QUALIFICATION OF 0201 ASSEMBLY Tony Huang and Rudolph Yu  Abstract
X-RAY INSPECTION FOR OPTOELECTRONIC COMPONENTS Vikram Butani  Abstract
DESIGN FOR SIX SIGMA AT SEAGATE Vince Sanchez  Abstract
INJECTION MOLDED SURFACE MOUNT 32 PIN VISION PACKAGE COMPETES WITH CERAMICS Wayne Louie, N. Li, T. Shaffer and R. Ross  Abstract
BALL STACKED PACKAGE DEVELOPMENT FOR HIGH DENSITY DRAM MODULE APPLICATIONS Young Gon Kim, Ph.D. and Ji-Bum Kim  Abstract
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