SMTA International 2002 Proceedings

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TITLE AUTHOR
DEVELOPMENT OF LASER TRIMMING OF EMBEDDED RESISTORS FOR PRINTED CIRCUIT BOARD MANUFACTURING Andrei Naumov, Dave Mahon and Anton Kitai  Abstract
IMPACT OF 0201 COMPONENTS ON CURRENT MANUFACTURING SYSTEMS Andrew Butterfield  Abstract
FLIP CHIP PBGA FOR COMPUTING AND TELECOMM APPLICATIONS Andrew Mawer, Thomas Koschmieder, and Diane Hodges  Abstract
INSPECTION STRATEGIES FOR 0201 COMPONENTS Andy Yates et al.  Abstract
INHIBITING GROWTH OF Au-Ni-Sn TERNARY COMPOUNDS AT THE INTERFACES OF Pb-BASED AND Pb-FREE SOLDER JOINTS Anis Zribi et al.  Abstract
HIGH IMPINGEMENT CLEANING OF ELECTRONIC FLIP CHIP ASSEMBLIES Ann Shang  Abstract
EVALUATION AND SELECTION OF OPTICAL FIBER FUSION SPLICERS FOR OPTOELECTRONICS ASSEMBLY Bill Newell and Jinsoo Kim  Abstract
LEAD-FREE SELECTIVE SOLDERING: THE WAVE OF THE FUTURE Bob Klenke  Abstract
SYSTEM IN PACKAGE PROCESS SOLUTIONS BASED ON FLIP CHIP PROCESSING Brian J. Lewis et al.  Abstract
SOLDER SELECTION FOR PHOTONIC PACKAGING Brian O’Neill and David Suraski  Abstract
ASSEMBLY AND RELIABILITY OF EXPOSED PAD TQFP DEVICES Carlos Fiol  Abstract
EVALUATION OF THE COMPARATIVE SOLDERABILITY OF LEAD-FREE SOLDERS IN NITROGEN - PART II Christopher Hunt et al.  Abstract
LOW COST HIGH PERFORMANCE BGA - C2BGA Claudio M. Villa  Abstract
THE INTEGRATION OF CAM TOOLS INTO PCBA MANUFACTURING Dale Lee  Abstract
DESIGNING A HIGH YIELD 0201 ASSEMBLY PROCESS FOR NEW PRODUCT INTRODUCTION Daniel F. Baldwin et al.  Abstract
MODULAR, DEVICE-SCALE, DIRECT-CHIP-ATTACH PACKAGING FOR MICROSYSTEMS Daniel F. Baldwin, Ph.D.  Abstract
X-RAY TUBE SELECTION CRITERIA FOR BGA / CSP X-RAY INSPECTION David Bernard  Abstract
UNDERFILL ADHESIVE CHOICES FOR CHIP AND PACKAGE APPLICATIONS David R. Gagnon, Ph.D. et al.  Abstract
SOLDERABILITY AND PROCESS INTEGRATION STUDIES OF IMMERSION SILVER AND TIN SURFACE FINISHES Dongji Xie, Ph.D., et al.  Abstract
VOIDING OF LEAD-FREE SOLDERING AT MICROVIA Dr. Hyoryoon Jo, B. Nieman, and Dr. N.C. Lee  Abstract
WILL MEMS BECOME ALL PERVASIVE? Dr. Ken Gilleo  Abstract
THE RELEVANCE OF NEWER GENERATION LASER REWORK TECHNOLOGY IN TODAY’S HIGH DENSITY MANUFACTURING PROCESSES Dr. Paul P.E. Wang  Abstract
SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Fay Hua et al.  Abstract
CASE STUDIES IN MULTIPLE DIE PACKAGE ASSEMBLY OF LEADED AND BALL GRID ARRAY PACKAGES Fonzell Martin and Ken Thompson  Abstract
TAPE BASED SUBSTRATE SOLUTIONS ADVANTAGES AND DISADVANTAGES Fonzell Martin, Yushi Matsuda, and Trent Thompson  Abstract
SYSTEM-IN-PACKAGE: THE NEXT GENERATION IN IC PACKAGING Frank Juskey  Abstract
SOLDER PASTE PRINTING DATA ANALYSIS: A VISUAL APPROACH Fritz Byle  Abstract
REDUCTION OF HIGH-FREQUENCY SIGNAL LOSS THROUGH THE CONTROL OF CONDUCTOR GEOMETRY AND SURFACE METALLIZATION Gary Brist et al.  Abstract
ACHIEVING PROCESS CONSISTENCY AND BEST PRACTICES WITHIN DISPARATE MANUFACTURING PLATFORMS Glenn Woodhouse and Bill Barthel  Abstract
A CASE STUDY FOR IMPLEMENTING 1149.1 BOUNDARY SCAN Greg Noeninckx  Abstract
IMPACT OF COMPONENT TERMINAL FINISH ON THE RELIABILITY OF Pb-FREE SOLDER JOINTS Gregory Henshall et al.  Abstract
VACUUM SOLDERING IN ELECTRONICS PACKAGING Gunter Hagen, Klaus Wolter, and Armin Wagner  Abstract
BOARD LEVEL RELIABILITY OF LEAD-FREE SOLDERED INTERCONNECTIONS H.-J. Albrecht, K. Wilke, D.S. Brodie  Abstract
INTEGRATED TEST TECHNOLOGIES TO IMPROVE YIELDS AND REDUCE COST TO TEST Haydn Povey  Abstract
A NEW DIMENSION IN STENCIL PRINT OPTIMIZATION Ian Fleck and Prashant Chouta  Abstract
HI-REL LEAD-FREE PRINTED WIRING ASSEMBLIES J.K. "Kirk" Bonner, L. del Castillo, A. Mehta  Abstract
FLIP CHIP ON PAPER ASSEMBLY UTILIZING ANISOTROPIC CONDUCTIVE ADHESIVE Jad S. Rasul and Bill Olson  Abstract
FATIGUE PROPERTIES OF Sn3.5Ag0.7Cu SOLDER JOINTS AND EFFECTS OF Pb-CONTAMINATION James Oliver, M. Nylén, O. Rod, and C. Markou  Abstract
AN AUTOMOTIVE INDUSTRY’S PERSPECTIVE ON HIGH-TEMPERATURE ELECTRONICS James R. Thompson et al.  Abstract
AOI: FACING THE CHALLENGES OF 0201 Jean-Marc Peallat and Mark J. Norris  Abstract
0201 COMPONENT INSPECTION- AOI BEST PRACTICES AND RECOMMENDATIONS Jeff Bishop  Abstract
INTELLIGENT SPC METHODOLOGY USING AOI/XRAY DATA CORRELATION Jeff Harrell  Abstract
EFFECTS OF BACKGRIND AND PLASMA CLEAN ELIMINATION IN THE MANUFACTURING PROCESS FLOW ON PACKAGE PERFORMANCE Jesse Phou and Trent Thompson  Abstract
STRENGTH TEST OF PIN SOLDERING ON PCB Jiachun Zhou (Frank), K. Elmadbouly, and O. Sorian  Abstract
EVALUATING THE EFFECTS OF REFLOW PROFILE CONTROL ON SOLDER JOINT QUALITY AND RELIABILITY John L. Evans and Greg Jones  Abstract
RELIABILITY OF NEXT GENERATION COMPONENTS AND SUBSTRATES FOR UNDER-THE-HOOD AUTOMOTIVE ELECTRONICS John L. Evans et al.  Abstract
X-RAY INSPECTION IN THE THIRD DIMENSION WITH AIM TECHNOLOGY Jon Dupree  Abstract
A STUDY OF LEAD-CONTAMINATION IN LEAD-FREE ELECTRONICS ASSEMBLY AND ITS IMPACT ON RELIABILITY Karl Seelig and David Suraski  Abstract
FURTHER STUDY OF CHIP SCALE PACKAGES IN HARSH ENVIRONMENT CONDITIONS Keith Easler  Abstract
MANUFACTURING AND RELIABILITY OF CHIP SCALE AREA ARRAY PACKAGING IN AVIONICS ENVIRONMENTS Keith Kirchner and David Nelson  Abstract
ALL LASER PROCESS FOR HIGH DENSITY MULTI-LAYER CIRCUIT BOARDS Ken Inaba  Abstract
FLIP CHIP UNDERFILL: VOID DETECTION AND CORRECTION Kris Slesinger et al.  Abstract
MEMS INTEGRATED OPTICAL MONITORING FOR FAULT DETECTION AND CLOSED-LOOP CONTROL L. A. Hornak et al.  Abstract
WAFER-LEVEL REDISTRIBUTION USING FULLY-ADDITIVE CU/NI/AU METALLIZATION Lars Boettcher et al.  Abstract
ELECTRICALLY CONDUCTIVE SILICONE ADHESIVE Luis C. Montemayor  Abstract
SELECTIVE SOLDERING TECHNOLOGY Marc Dalderup  Abstract
COMPRESSIVE LOAD EFFECTS ON CCGA RELIABILITY Marie S. Cole, J. Jozwiak, E. Kastberg, G. Martin  Abstract
CONDENSATION HEATING PROCESS FOR LEAD-FREE SOLDERING Mathias Nowottnick  Abstract
COMPONENT TEMPERATURE STUDY ON TIN-LEAD AND LEAD-FREE ASSEMBLIES Matthew Kelly et al.  Abstract
ASSEMBLY AND REWORK PROCESS INVESTIGATION ON NEW CERAMIC COLUMN GRID ARRAY PACKAGES Mei Wang et al.  Abstract
ASSEMBLY PROCESS QUALIFICATION ON 0201 PACKAGES FOR VOLUME MANUFACTURING Mei Wang et al.  Abstract
CONTROLLING MOISTURE-SENSITIVE DEVICES (MSDS) FOR DOUBLE-SIDED REFLOW APPLICATIONS Michael Blazier  Abstract
ACCURACY MEASUREMENT TECHNIQUES: GLASS PARTS VERSUS REAL PARTS Michael Cieslinski  Abstract
OVERCOMING THE CURRENT QUALITY PLATEAU Michael Motherway  Abstract
PROGRAMMABLE LOGIC USED TO CONTROL BOUNDARY SCAN CHAINS Michael Spofford  Abstract
EFFECT OF SURFACE TENSION OF SOLDER ON UNDERSIDE DEVICE SUPPORT DURING REFLOW OF A PCBA Mulugeta Abtew  Abstract
STANDARDIZATION OF FUNCTIONAL TEST FOR IPF BASED SERVERS AND WORKSTATIONS Myke Predko  Abstract
HALOGEN AND ANTIMONY-FREE EPOXY THERMOUNT® LAMINATE FOR PRINTED WIRING BOARD (PWB) FABRICATION Ousama Najjar, Ph.D  Abstract
ANALYSIS OF SOLDER PASTE RELEASE IN FINE PITCH STENCIL PRINTING PROCESSES Paul Houston  Abstract
PROCESS CAPABILITY CASE STUDY ON 0201 PROCESSING UTILIZING 3D AUTOMATED OPTICAL INSPECTION Paul Houston  Abstract
ADVANCED PACKAGES REQUIRE A GOOD REWORK PROCESS Paul Wood  Abstract
MONITORING MOTHERBOARD SHOCK STRAIN RESPONSE NEAR BGA SOLDER JOINTS Phil Geng and Willem M Beltman  Abstract
SOLDER JOINT FORMATION WITH Sn-Ag-Cu AND Sn-Pb SOLDER BALLS AND PASTES Polina Snugovsky et al.  Abstract
RELIABILITY AND PASTE PROCESS OPTIMIZATION OF EUTECTIC AND LEAD-FREE FOR MIXED PACKAGING Prof. S. Manian Ramkumar et al.  Abstract
INVESTIGATION OF THE MECHANICAL PROPERTIES OF Pb-FREE SOLDER JOINTS BY NANOINDENTATION R.R. Chromik, R.P. Vinci, S.L. Allen & M.R. Notis  Abstract
ROAD TO GROWTH AND PROFITABILITY STARTS WITH EFFECTIVE SUPPLIER RELATIONSHIP MANAGEMENT Rajiv Varshney and Praveen Gupta  Abstract
MAXIMIZING PICK-AND-PLACE MACHINE UTILIZATION USING A MANUFACTURING OPTIMIZATION AND EXECUTION SYSTEM Ranko Vujosevic  Abstract
LONG-LIFE RELIABILITY OF CSP ASSEMBLIES WITH AND WITHOUT UNDERFILL Reza Ghaffarian, Ph.D.  Abstract
CSP AND BGA ASSEMBLY RELIABILITY IN A FAST RAMP RATE THERMAL CYCLE ENVIRONMENT Reza Ghaffarian, Ph.D.  Abstract
SIP QUALIFICATION AND PRA APPROACHES Reza Ghaffarian, Ph.D.  Abstract
EVALUATING AUTOMATED OPTICAL INSPECTION Rob Mitchell  Abstract
HIGHER THERMAL STABILITY WITH BROMINE-FREE SUBSTRATES Robert Demaree  Abstract
SIMPLIFYING PWB ASSEMBLY BY UTILIZING EMBEDDED PASSIVES Robert T. Croswell et al.  Abstract
A DESIGNER’S LOOK AT THE TOOLS Rodney W. Simon  Abstract
ESTABLISHING A CONTINUOUS IMPROVEMENT PLAN TO DRAMATICALLY INCREASE PROFITS Ronald C. Lasky, Ph.D., PE  Abstract
MATERIALS AND PROCESS CHALLENGES IN RF AND OPTOELECTRONICS ASSEMBLY Ronald C. Lasky, Ph.D., PE  Abstract
DFM NPI SYNERGY Scott Buttars  Abstract
QUALIFICATION OF 3-D SOLDER PASTE INSPECTION SYSTEMS FOR EFFECTIVE IN-LINE PROCESS CONTROL Sharafali Shaherwala et al.  Abstract
THE EFFECTS OF COPPER CONTENT ON THE RELIABILITY OF Sn-Ag BASED BUMP ALLOYS IN FLIP CHIP APPLICATIONS Shing Yeh  Abstract
COST SAVINGS AND BENEFITS OF REWORKING BGA, CSP AND PWB MODIFICATIONS FOR HIGH PERFORMANCE APPLICATIONS Stephen R. Stegura et al.  Abstract
ADVANCED CAPILLARY UNDERFILL FOR FLIP CHIP ATTACHMENT Steve Hackett, Ph.D.  Abstract
NEW THOUGHTS ON TEST STRATEGIES Stig Oresjo  Abstract
STRATEGIC CONSIDERATIONS IN MANAGING OEM CUSTOMER RELATIONSHIPS Susan E. Mucha  Abstract
AGEING CHARACTERISTICS OF IMMERSION TIN SURFACE FINISHES Sven Lamprecht, Dr. H-J Schreier, and Dr. R. Vogel  Abstract
CHARACTERIZATION OF ENVIRONMENT-FRIENDLY HALOGEN-FREE MATERIALS FOR RADIO FREQUENCY ELECTRONICS USE Terry Fischer  Abstract
PROCESS CAPABILITY, WETTING BEHAVIOR AND TEMPERATURE DEPENDENT SHEAR STRENGTH OF ALTERNATIVE LEAD FREE SOLDER JOINTS Th. Herzog , S. Rudolph, and K.-J. Wolter  Abstract
IMPLEMENTING ‘INTEGRATED PREDICTIVE MANUFACTURING’ AT AN EMS PROVIDER - A CONTINUOUS IMPROVEMENT APPROACH Thanigai Kumar S. Vellore et al.  Abstract
UNDERFILLED PBGA PACKAGES AND THEIR BOARD LEVEL CYCLING AND VIBRATION PERFORMANCE Thomas Baumann et al.  Abstract
PRACTICAL TIPS IN IMPLEMENTING THE "PIN IN PASTE" PROCESS Tim Jensen and Ronald C. Lasky, Ph.D., PE  Abstract
UNDERFILLED FLIP CHIP DEFECT DETECTION: X-RAY ANALYSIS VS. SCANNING ACOUSTIC MICROSCOPY: AN ASSESSMENT OF ANALYTICAL TECHNIQUES Todd Snively  Abstract
A STATISTICAL APPROACH TO 0201 COMPONENT PACKAGE UTILIZATION Tom Borkes  Abstract
A NOVEL FLIP CHIP APPROACH FOR MICROWAVE/HIGH SPEED DATA CHIP PACKAGING Tong Chen and Suchet Chai  Abstract
GETTING FACTORY READY FOR 0201 ASSEMBLY Tony Huang and Rudolph Yu  Abstract
IC PACKAGE SOLUTIONS FOR HIGH PERFORMANCE MEMORY Vern Solberg and Ignacio Osorio  Abstract
EFFECT OF COPPER CONCENTRATION ON THE SOLID-STATE AGING REACTIONS BETWEEN TIN-COPPER LEAD-FREE SOLDERS AND NICKEL W. T. Chen et al.  Abstract
SIMULATION FOR 0201 LEADLESS COMPONENT REFLOW DESIGN AND DEFECT ANALYSIS Xiaohua Wu, Joe Tomase, and Matt Kas  Abstract
AUTOMATED X-RAY INSPECTION: SMT PROCESS IMPROVEMENT TOOL Zhen (Jane) Feng, Jacob Djaja, and Ronald Rocha  Abstract
QUALITY AND ECONOMICAL ASPECTS OF SELECTIVE WAVE SOLDERING Zsolt Nemes  Abstract
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