2002 Advanced Technology Symposium Proceedings

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TITLE AUTHOR
DEVELOPMENT AND APPLICATION OF A PRESS-PIN/PTH RELIABILITY MODEL A. Kulkarni, et al.  Abstract
SOLDER SELECTION FOR PHOTONIC PACKAGING Brian O’Neill  Abstract
CONDUCTIVE EPOXY ADHESIVES AS VIABLE ALTERNATIVES TO SOLDER: Sn/Pb COMPONENT COMPATIBILITY C. Cheng, S. Smith, W. O’Hara, and V. Buffa  Abstract
BMI RESINS AS LOW-STRESS ALTERNATIVES TO EPOXIES FOR OPTOELECTRONIC PACKAGE ASSEMBLY Chris Perabo, B. Eng.  Abstract
MEMS AND MOEMS PACKAGING / 3D INTERCONNECTION Christian VAL  Abstract
CHALLENGES AND SOLUTIONS FOR PACKAGING MEMS AND MICROSYSTEMS Daniel F. Baldwin  Abstract
COMPARISON OF MICROSTRUCTURES IN SAC305 AND SAC405 SOLDER JOINTS AND THE INFLUENCE OF SURFACE FINISH Daryl Santos, et al.  Abstract
EFFECTS OF REFLOW PROFILE ON SHEAR STRENGTH OF Sn/4.0Ag/0.5Cu SOLDER SPHERES FOR BALL GRID ARRAY APPLICATIONS Daryl Santos, et al.  Abstract
ZERO CLEARANCE SOLDER MASK FOR HIGH DENSITY SMT Dominique Numakura  Abstract
A NICKEL-PALLADIUM-GOLD IC LEAD FINISH AND THE POTENTIAL FOR SOLDER JOINT EMBRITTLEMENT Donald Abbott, Douglas Romm and Bernhard Lange  Abstract
REAL TIME VISUALIZATION AND PREDICTION OF SOLDER PASTE FLOW IN THE CIRCUIT BOARD PRINT OPERATION Dr. Gerald Pham-Van-Diep  Abstract
A SYSTEMATIC APPROACH TO FAILURE ANALYSIS J. Roepsch, C. Snively, and R. Champaign  Abstract
ASSEMBLY COST REDUCTIONS THROUGH OPTICAL FIBER RIBBON SPLICING Jason Holman  Abstract
DEVELOPMENT OF A COMPLIANT SOLDER John Ranieri and Hsingching Crystal Hsu  Abstract
RELIABILITY ASSESSMENT OF FLIP CHIP ON LAMINATE CSP Julia Y. Zhao, Ph.D.  Abstract
A CLOSED-LOOP CONTROL ALGORITHM FOR STENCIL PRINTING Leandro G. Barajas  Abstract
TEST RESULTS FROM THE LEAD-FREE COMPONENT FOCUS GROUP Lee Whiteman, et al.  Abstract
ORGANIC POLYMER-BASED NONHERMETIC OPTOELECTRONIC PACKAGING OPPORTUNITIES AND ISSUES Leo M. Higgins III, Ph.D.  Abstract
2003 HIGH DENSITY MICROELECTRONICS PACKAGING ROADMAP FOR SPACE APPLICATIONS Lissa Galbraith, Ph.D.  Abstract
HERMETICITY OF METAL INJECTION MOLDED BOXES FOR FIBER OPTIC AND ELECTRONIC PACKAGES Mitchell N. Gross  Abstract
CASE STUDY: THE EFFECT OF SEVERE BLACK PAD DEFECT ON SOLDER BONDS ON BALL GRID ARRAY COMPONENTS R. Champaign, J. Roepsch, and M. Downey  Abstract
STATIC & DYNAMIC CHARACTERISTICS OF INTERPOSER SOCKETS Raymond J. Iannuzzelli  Abstract
SURFACE MOUNT CONDUCTIVE ADHESIVE: AN ALTERNATIVE TO LEAD-BASED SOLDER Rita Mohanty, PhD  Abstract
IN-LINE AUTOMATION OF FIBER-OPTIC PROCESSES William L. Emkey  Abstract
PATENT DATABASES AND ANALYTICAL TOOLS FOR SURFACE MOUNT TECHNOLOGY RESEARCH AND DEVELOPMENT William N. Hulsey, III, and John R. Schell  Abstract
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