Pan Pacific Symposium 2002 Proceedings

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TITLE AUTHOR
SPECIAL ISSUES IN 3D-MICROELECTRONICS INTERNAL COUPLINGS A. Brandolini, A. Gandelli and R.E. Zich  Abstract
CHALLENGES IN LEAD-FREE REWORK Arun Gowda  Abstract
MECHANICAL RELIABILITY OF UNDERFILLED CSP ASSEMBLIES Arun Gowda et al.  Abstract
PRODUCT COST ESTIMATION USING ACTIVITY-BASED COSTING Ashish Tarhalkar & K. Srihari, Ph.D.  Abstract
A SIMPLIFIED REFLOW SOLDERING PROCESS MODEL David C. Whalley  Abstract
ULTRA HIGH Q INDUCTOR AND RF INTEGRATED PASSIVE DEVICES ON THICK OXIDE SI SUBSTRATE Dong-Wook Kim et al.  Abstract
A LOW COST RELIABILITY ASSESSMENT FOR DOUBLE-SIDED MIRROR-IMAGED FLIP CHIP BGA ASSEMBLIES Dr. A.C. Shiah and Xiang Zhou  Abstract
OPTOELECTRONICS - ADDING A LITTLE LIGHT TO THE NANO-WORLD Dr. Ken Gilleo  Abstract
AFFORDABLE 'STRUCTURES' FOR LOW VOLUME PRODUCTION Dr. Ramesh Sharma  Abstract
PREDICTIVE MODELING OF THERMALLY INDUCED STRESSES IN MICROELECTRONIC AND PHOTONIC STRUCTURES: ROLE, ATTRIBUTES, REVIEW E. Suhir  Abstract
FACTORS AFFECTING VOIDING IN UNDERFILLED FLIP CHIP ASSEMBLIES George Carson, PhD and Maury Edwards  Abstract
A STUDY OF MICROSTRUCTURAL CHANGE OF LEAD-CONTAINING AND LEAD FREE SOLDERS Hans-Jurgen Albrecht  Abstract
DEVELOPMENT OF HIGH DENSITY PRINTED WIRING BOARD WITH FINE STACKED VIA HOLES Hideki Higashitani et al.  Abstract
ENCAPSULATION TECHNOLOGY FOR 3D STACKED PACKAGES Horatio Quinones et al.  Abstract
ENHANCED SCANNING ACOUSTIC MICROSCOPY THROUGH F-SCAN IMAGING James C.P. McKeon  Abstract
LEAD-FREE SOLDER BOND EVALUATION USING ACOUSTIC MICRO IMAGING (AMI) Janet E. Semmens  Abstract
ACOUSTIC MICRO IMAGING IN THE FOURIER DOMAIN FOR EVALUATION OF ADVANCED PACKAGING Janet E. Semmens and Lawrence W. Kessler  Abstract
PROCESS QUALIFICATION STRATEGIES FOR FLIP CHIP IN THE EMS ENVIRONMENT Jeff Kennedy  Abstract
ELECTRICAL CHARACTERIZATION OF LEAD-FREE SOLDER SEPARABLE CONTACT INTERFACES Ji Wu, Michael Pecht et al.  Abstract
BALL SHEAR STRENGTH OF 63Sn-37Pb SOLDER BUMP WITH TEST CONDITIONS Jin-Won Choi, Jae-Hoon Choi, and Tae-Sung Oh  Abstract
PATTERNING THREE-DIMENSIONAL STRUCTURES ON WAFERS WITH ELECTROPHORETIC PHOTORESIST John Klocke  Abstract
DEVELOPMENT OF A COMPLIANT SOLDER John Ranieri, Hsingching Crystal Hsu  Abstract
DESIGN CHALLENGES IN SMT TERMINAL BLOCK DESIGN Jonathan France  Abstract
MULTICHIP MODULE ON SILICON FOR SAW FILTER EMBEDDED RF RECEIVER Jong-Soo Lee et al.  Abstract
CAPACITY REQUIREMENTS PLANNING IN A HIGH VOLUME, MEDIUM/HIGH MIX EMS PROVIDER'S ENVIRONMENT K. Srihari, Ph.D.  Abstract
mBGA's SOLDER & OVEN PROFILES - CRITICAL PROCESS VARIABLES Kathleen S. Palumbo  Abstract
STUDY ON LOW-STRESS FLIP CHIP PACKAGING USING ADVANCED NON CONDUCTIVE PASTE (ANCP) Kenichi Suzuki et al.  Abstract
CSP FLUX-FREE UNDERFILL RESIN FOR ELECTRICAL CONNECTION AND PHYSICAL ADHESION Kenji Kitamura et al.  Abstract
THERMAL AGING RELIABILITY OF SOLDER BALL JOINT FOR SEMICONDUCTOR PACKAGE SUBSTRATE Kiyoshi Hasegawa et al.  Abstract
ADHESION AND RELIABILITY OF UNDERFILL/SUBSTRATE INTERFACES IN FLIPCHIP BGA PACKAGES: METROLOGY AND CHARACTERIZATION Kumar Nagarajan  Abstract
STUDY ON COINED SOLDER BUMPS ON PCB PADS Kyung W. Paik et al/  Abstract
MASKLESS DEPOSITION TECHNOLOGY TARGETS PASSIVE EMBEDDED COMPONENTS M. J. Renn, B. H. King, and M. Essien  Abstract
FROM BATCH TO BREAKTHROUGH: UNDERSTANDING PHASE CONVECTION TECHNOLOGY Mark J. Norris  Abstract
AUTOMATED OPTICAL INSPECTION (AOI): USING THE DATA TO ACHIEVE THE "ZERO DEFECT LINE" Mark J. Norris  Abstract
SOC VS SIP: ALTERNATIVE PATHS TO HDI (SLI)? Martin Goetz  Abstract
THERMAL PACKAGE ENHANCEMENT IMPROVES HARD DISK DRIVE DATA TRANSFER PERFORMANCE Michael Ko  Abstract
THE BUSINESS, PRODUCT LIABILITY AND TECHNICAL ISSUES ASSOCIATED WITH USING ELECTRONIC PARTS OUTSIDE THE MANUFACTURER'S SPECIFIED TEMPERATURE RANGE Michael Pecht  Abstract
DIELECTRIC CHARACTERISTICS OF ENCAPSULATION MATERIALS USED IN MICROELECTRONIC PACKAGING Michael Todd  Abstract
SOLDER JOINT STRENGTH VERSUS INSERTION, EXTRACTION AND IN-FIELD FORCES APPLIED TO A SURFACE MOUNT DEPLUGGABLE CONNECTOR Michel Hodak  Abstract
A STATISTICAL BASED STUDY FOR COMPARISON AND OPTIMIZATION OF AN ENCLOSED PRINT HEAD TECHNOLOGY Muffadal Mukadam et al.  Abstract
PROCESS CHALLENGES AND SOLUTIONS FOR EMBEDDING CHIP-ON-BOARD INTO MAINSTREAM SMT ASSEMBLY Mukul Luthra  Abstract
SMART MEMS MODULE ASSEMBLY FOR AIRCRAFT APPLICATIONS Namsoo P. Kim, Chung-Ping Chien, and Minas H. Tani  Abstract
THERMAL ENHANCEMENT OF PBGA BY HIGH THERMAL CONDUCTIVITY MOLD COMPOUND AND PACKAGE DESIGN OPTIONS Navas Khan et al.  Abstract
UNDERFILL FLOW MODELING FOR FLIP CHIP ON BOARD ASSEMBLY P.Venkataraman, C. Fullone, M. Ramkumar  Abstract
SOLDER FATIGUE RELIABILITY ISSUES IN LEAD-FREE BGA PACKAGES Pedro Chalco  Abstract
A RELIABLE FLIP-CHIP FLEX BGA WITH REFLOWABLE UNDERFILL Poi-Siong Teo et al.  Abstract
THE NEW FILM INTELLIGENT ELECTRONIC CONVERTERS USING NEW DUPONT AND ESL HIGH TECHNOLOGY MATERIALS FOR LOW POWER DISCHARGE LAMPS Prof. Tadeusz Sobczyk  Abstract
"CURING" LOW YIELDS & RELIABILITY ISSUES IN PHOTONICS ASSEMBLY Richard S. Garard and Bruce A. Adams  Abstract
INSIDER THREAT RISK MANAGEMENT FOR TRADE SECRETS AND INTELLECTUAL PROPERTY Richard Sheiman  Abstract
LINE BALANCING AND PRODUCTIVITY IMPROVEMENTS IN ELECTRONICS ASSEMBLY USING MODELING AND SIMULATION TECHNIQUES S. Manian Ramkumar  Abstract
NEW PROCESS/PRODUCT INTRODUCTION: DO IT RIGHT THE FIRST TIME Salim Merchant  Abstract
DRAM PACKAGING AND SMT ASSEMBLY OF MEMORY MODULES Sarah Shen and Wayne Koh  Abstract
AN INVESTIGATION ON COPPER CONDUCTIVE PASTE FOR HDIIVH SUBSTRATES Shen-Li Fu et al.  Abstract
DEVELOPMENT OF A CLOSELY DUCTED HEATSINK COOLING SOLUTION FOR AN ARRAY OF PARALLEL PROCESSORS Steven J. Young and Julius Caesar T. Zerna  Abstract
MIL/AERO MEMS: BENEFITS AND BARRIERS Tom Clifford  Abstract
X-RAY INSPECTION ... AVOID RADIATION DAMAGE Tom Clifford  Abstract
DEVELOPMENT OF SHORTENING PROCESS TIME IN SBB Toshiyuki Kojima et al.  Abstract
STACKED MULTI-CHIP PACKAGING FOR THE NEXT GENERATION ELECTRONICS Vern Solberg  Abstract
THIN FILM EMBEDDED PASSIVES FOR MICROWAVE AND MILLIMETER WAVE APPLICATIONS W. de Raedt, E. Beyne, R. Mertens  Abstract
PERSPECTIVES ON DIGITAL CONSUMER GOODS AND SYSTEM LSI Yukio Furuta  Abstract
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