International Conference on Soldering & Reliability 2016 Proceedings

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TITLE AUTHOR
Effect of Nano-Particle on the Properties of Sn-3Ag-0.5Cu Solder A. Sharma, D.W. Lim, S.H. Yim, J.H. Yoon, J.Hyun Yun, K.H. Kim, S.H. Yoo, J.P. Jung  Abstract
BGA Solder Joint Fracture as a Function of Strain Rate and PCB Rigidity Amir Nourani, Saeed Akbari, Jan K. Spelt  Abstract
The Effects of Bi and Aging on the Microstructure and Mechanical Properties of Sn-Rich Alloys – Part 2 André M. Delhaise, Doug Perovic, Polina Snugovsky  Abstract
How Stencil Design and Reflow Profiles Affect Variation in QFN Voiding Data: A Case Study Brook Sandy-Smith  Abstract
Microstructural Improvements of SAC Alloys with Bi Additions During Accelerated Thermal Cycling Eva Kosiba, Polina Snugovsky, John McMahon, Doug Perovic  Abstract
In-Situ Resistance Characterization During Cure Progression of a Conductive Adhesive Geoff Rivers, Pearl Lee-Sullivan, Boxin Zhao, Alex Chen, John Persic and Robert Lyn  Abstract
Extreme Long Term Printed Circuit Board Surface Finish Solderability Assessment Gerard O'Brien and Dave Hillman  Abstract
A New Dispensing Solder Paste for Laser Soldering Technology Hsiang-Chuan Chen, Ya-Ching Chuang, Jen-Yio Shiu, Chang-Meng Wang, and Watson Tseng  Abstract
Characterization of Solvus in Ternary and Quaternary Bismuth Containing Solder Alloys Ivan Matijevic, Doug Perovic, Polina Snugovsky  Abstract
Stencil Printing Sustainability for M0201 Jeff Schake and Mark Whitmore  Abstract
Protocol Development for Testing Solder Reliability in Combined Environments John McMahon, Joseph Juarez, Polina Snugovsky, Jeffrey Kennedy, Milea Kammer, Ivan Straznicky, David Hillman, David Adams, Stephan Meschter, Subramaniam Suthakaran, Russell Brush, Doug Perovic  Abstract
Implementing PEDOT:PSS as a Co-Filler for Electrically Conductive Adhesive Applications Josh Trinidad, Wei Zhang, Boxin Zhao, Alex Chen, John Persic, and Robert Lyn  Abstract
Vapor Phase Reflow's Effect on Solder Paste Residue Surface Insulation Resistance Karen Tellefsen, Mitch Holtzer, Corne Hoppenbrouwers, and Roald Gontrum  Abstract
Recent Advances in X-Ray Technology Keith Bryant and Ragnar Vaga  Abstract
An Interesting Approach To Yield Improvement Lauri Märtin, Kristjan Piir, and Keith Bryant  Abstract
Via-In-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware Matt Kelly, Mark Jeanson, Timothy Younger, Jim Bielick, Theron Lewis, Mitch Ferrill  Abstract
The Importance of Curie Point Temperature Control in Providing Solder Joint Reliability in Lead Free Robotic and Hand Soldering Operations Michael Gouldsmith  Abstract
Why Clean A No-Clean Flux Mike Bixenman, DBA, Mark McMeen, Bruno Tolla, Ph.D.  Abstract
The Evaluation of Conformal Coatings under Condensing Conditions: Part 1 Phil Kinner, Christopher Hunt, Ling Zou  Abstract
REMAP Materials Project M2: High Temperature High Humidity Corrosion and Tin Whisker Evaluation of Bi Containing Lead-Free Alloys Polina Snugovsky, Stephan Meschter, Jeff Kennedy, and Zohreh Bagheri  Abstract
Strategic Environmental Research and Development Program (SERDP) Layered Nanoparticle Enhanced Conformal Coating for Whisker Mitigation S. Meschter, J. Cho, S. Maganty, D. Edwards, M. Romansky, J. Keeping, P. Snugovsky, J. McMahon, Zohreh Bagheri, and J. Kennedy  Abstract
A Discrete Foundation Model to Predict Load Sharing in Pairs of Solder Joints Saeed Akbari, Amir Nourani, Jan K. Spelt  Abstract
Microstructure and Property Assessments of UV-Curable Conformal Coatings for Pb-Free Electronics Suraj Maganty, Fei Dong, Stephan J. Meschter, and Junghyun Cho  Abstract
High Power Electronics: Cleaning Requirements for Improved Efficiency and Reliability Thomas Kucharek, Ravi Parthasarathy, M.S.Ch.E., Jigar Patel, M.S.Ch.E.  Abstract
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