SMTA International 2001 Proceedings

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TITLE AUTHOR
DIFFUSION CONTROLLED GROWTH OF TERNARY INTERMETALLIC COMPOUNDS IN PB-BASED AND PB-FREE ELECTRONIC SOLDER JOINTS A. Zribi and E. J. Cotts  Abstract
MATERIALS AND SYSTEMS CHOICES FOR BLUETOOTH AND BEYOND Alan Rae  Abstract
LOW COST FLIP CHIP ON PAPER ASSEMBLY UTILIZING NON-THERMAL CURE MATERIALS Ali Tootoonchi and Jad Rasul  Abstract
BOARD MOUNTED RELIABILITY CHARACTERISTICS OF FLIP-CHIP PBGA Andrew Mawer, T. Koschmieder and D. Hodges Popps  Abstract
PACKAGING CONSIDERATIONS FOR BLUETOOTH APPLICATIONS Antonio Do-Bento-Vieira  Abstract
SOLDER JOINT RELIABILITY CHARACTERIZATION OF LBGA CONFIGURATIONS FOR AUTOMOTIVE UNDER-THE-HOOD APPLICATIONS Antonio Do-Bento-Vieira  Abstract
CHARACTERISATION OF THE POLYMER STUD GRID ARRAY (PSGA), A LEAD-FREE CSP FOR HIGH PERFORMANCE & HIGH RELIABLE PACKAGING Bart Vandevelde  Abstract
REAL TIME STATISTICAL PROCESS CONTROL OF THE SCREEN PRINT PROCESS Bill Beair  Abstract
ELIMINATING THE 'HUMAN FACTOR': IMPLEMENTING QUALITY TOOLS AND TECHNIQUES Brian Coll  Abstract
FIELD FAILURE OF A CIRCUIT DUE TO CAPACITOR DAMAGE DURING ASSEMBLY C. A. Paszkiet  Abstract
SOLDERABILITY OF LEAD-FREE FINISHES USING LEAD-FREE SOLDERS C. Fan, Y. Zhang and J. A. Abys  Abstract
INTRODUCING NEW TECHNOLOGY IN THE CONTRACT ELECTRONICS MANUFACTURING ENVIRONMENT Cameron E. Presley  Abstract
RELIABILITY OF BGA UNDER VIBRATIONS Cemal Basaran and Alexander Cartwright  Abstract
UNDERSTANDING WHISKER PHENOMENON - MECHANISMS STUDY Chen Xu  Abstract
SYSTEM-IN-PACKAGE TECHNOLOGY, APPLICATION AND TRENDS Christopher M. Scanlan and Nozad Karim  Abstract
WHAT DOES IT TAKE TO SUCCESSFULLY IMPLEMENT AOI? Chuck Gamble  Abstract
AN IMPROVED IMAGING SYSTEM FOR INSPECTING BGA, CSP, FLIP CHIP, AND OTHER HIDDEN SOLDER CONNECTIONS Cliff R. Bockard  Abstract
IPC-9850 SURFACE MOUNT EQUIPMENT CHARACTERIZATION OFFICIAL PROPOSAL UPDATE Craig C. Ramsey, Ph.D.  Abstract
SURFACE MOUNT PLACEMENT EQUIPMENT CHARACTERIZATION Damian Hujic  Abstract
THERMAL MANAGEMENT OF POWER FLIP CHIPS AS USED IN PRINTED CIRCUIT BOARD BASED ELECTRONIC ASSEMBLIES Darrel Peugh  Abstract
INDUSTRY-UNIVERSITY RESEARCH IN ELECTRONICS MANUFACTURING: THE BINGHAMTON UNIVERSITY MODEL Daryl L. Santos, Ph.D.  Abstract
INVESTIGATION OF ANISOTROPIC CONDUCTIVE ADHESIVE INTERCONNECT ASSEMBLY PROCESS ONTO AN ORGANIC SUBSTRATE David Geiger  Abstract
TEST AUTOMATION, A COST EFFECTIVE AND RELIABLE ALTERNATIVE TO LABOR David W Dooley  Abstract
DESIGN CONSIDERATIONS FOR FABRICATION OF LARGE AREA, HIGH DENSITY, HIGH LAYER COUNT CIRCUIT BOARD ASSEMBLIES Deepak K. Pai  Abstract
LOW COST SOLDER BUMPING VIA PASTE REFLOW Dr. Benlih Huang and Dr. Ning-Cheng Lee  Abstract
FLIP CHIP BGA RELIABILITY STUDY STATISTIC APPROACH FOR PACKAGE RELIABILITY ASSESSMENT AND PROCESS DEVELOPMENT Dr. Paul P.E. Wang, Ken Kochi, and Livia Hu  Abstract
PREDICTION OF NON-VOLATILE RESIDUE FOR SOLDER PASTE FORMULATION BY WEIGHT LOSS BEHAVIOR STUDY OF RAW MATERIALS Dr. Quan Sheng and Charles Bradshaw  Abstract
EVALUATION OF TWO NOVEL LEAD-FREE SURFACE FINISHES Dr. Richard Ludwig and Dr. Ning-Cheng Lee  Abstract
PROCESS AND MATERIAL SELECTION FOR ZERO DEFECTS AND SUPERIOR ADHESION LEAD FREE SMT SOLDERING Dr. Sammy Shina and Hemant Belbase  Abstract
FIBER OPTICS STRUCTURAL MECHANICS: ATTRIBUTES AND REVIEW Ephraim Suhir  Abstract
CRITICAL MANUFACTURING ISSUES AND SOLUTIONS FOR TRACKING MOISTURE SENSITIVE DEVICES (MSDS) François Monette  Abstract
USING INDUSTRY DPMO STANDARDS - AN IN-DEPTH LOOK AT IPC-9261 AND IPC-7912 Fritz Byle  Abstract
FACTORS AFFECTING VOIDING IN UNDERFILLED FLIP CHIP ASSEMBLIES George Carson, PhD and Maury Edwards  Abstract
THERMOPLASTIC CONNECTOR HOUSINGS IN A LEAD-FREE WAVE SOLDERING ENVIRONMENT Gerald Keep  Abstract
THE WHY, WHERE, WHAT, HOW, AND WHEN OF AUTOMATED X-RAY INSPECTION Glen Leinbach and Stig Oresjo  Abstract
PHOTONICS ASSEMBLY IN AN EMS ENVIRONMENT Glenn Woodhouse  Abstract
0201 COMPONENT ISSUES: SUPPLY CHAIN, DESIGN, AND MANUFACTURING PROCESS Greg Hansen, Kevin Kent, and Rich Anderson  Abstract
AUTOMATED PROCESS CONTROL FOR THE REFLOW PROCESS Greg Jones, Ph.D  Abstract
INTERCONNECT RELIABILITY OF WIRE BOND BGA SUBSTRATES USING VIA-IN-PAD TECHNOLOGY Greg Ridsdale  Abstract
BOARD LEVEL RELIABILITY OF LEAD-FREE SOLDERED INTERCONNECTS ON CONVENTIONAL AND AREA ARRAY COMPONENTS H.-J. Albrecht, K. Wilke  Abstract
WAVE SOLDER BRIDGING REDUCTION THROUGH PHOTO IMAGED SOLDER MASK GLOSS LEVEL CONTROL Hank Sanftleben and John Borneman  Abstract
e-MANUFACTURING SOFTWARE FOR PRODUCT AND PROCESS REAL-TIME MONITORING Hersh Kohli, Ranjan Chatterjee, Dan Kauss  Abstract
MOISTURE SENSITIVE COMPONENT STORAGE Hiro Suganuma and Alvin Tamanaha  Abstract
MULTI-LAYER 3D SYSTEM-ON-PACKAGE (SOP) ARCHITECTURES FOR HIGHLY INTEGRATED MICROWAVE AND MILLIMETER WAVE RADIO FRONT-END J. Laskar  Abstract
BROWSER-BASED COMPUTER INTEGRATED MANUFACTURING SOFTWARE FOR ELECTRONICS ASSEMBLERS Jason Spera  Abstract
CNES APPROACH FOR THE QUALIFICATION OF MEMS FOR SPACE APPLICATIONS Jean-Pierre Fortéa  Abstract
EVALUATIONS TO VALIDATE NEW CHEMICAL ETCH SUBSTRATE PROCESSING ABILITY TO PASS TEMPERATURE CYCLE AND MOISTURE REQUIREMENTS ON MAP BGA Jeannie Miller  Abstract
SRM: LEVERAGING THE SUPPLY BASE FOR COMPETITIVE ADVANTAGE Jeff Herrmann and Brian Hodgson  Abstract
ADVENTURES IN OUTSOURCING: THE APPLIED USE OF THE BOOTSTRAP METHOD Jeff Renz  Abstract
ANALYSIS OF ACCELERATION FACTORS USED TO PREDICT BGA SOLDER JOINT FIELD LIFE Jesse E. Galloway  Abstract
KEY FACTORS IN THE DESIGN FOR MANUFACTURABILITY (DFM) PROCESS Joe Belmonte  Abstract
SMALL PBGA RELIABILITY CONSIDERATIONS FOR UNDER-HOOD AUTOMOTIVE ELECTRONICS John L. Evans, Ph.D.  Abstract
PROCESSING THROUGH-HOLE TERMINALS IN A PURE SMT REFLOW PROCESS Joshua K. Brown  Abstract
ADVANCED POWER PACKAGING USING COPPER/TUNGSTEN COMPOSITES Juan L. Sepulveda and David E. Jech  Abstract
UNDERFILL : VOID FORMATION AND COUNTER MEASURES K. Mizuike, K. Kanaji, K. Watanabe and T. Mizutani  Abstract
THE BENEFITS OF IN-LINE TEST AUTOMATION: NEW PROCESSES AND A CREATIVE APPROACH TO TEST AUTOMATION CAN CREATE COMPETITIVE ADVANTAGE Keith B. Henry  Abstract
THERMAL AGING RELIABILITY OF SOLDER BALL JOINT FOR SEMICONDUCTOR PACKAGE SUBSTRATE Kiyoshi Hasegawa  Abstract
ACCOMPANYING QUALITY ASSURANCE WITH INTELLIGENT PROCESS COORDINATION Klaus Feldmann and Rüdiger Holzmann  Abstract
ARE YOU IN CONTROL OF YOUR ELECTROLESS NICKEL/IMMERSION GOLD PROCESS? Kuldip Johal  Abstract
WAFER-LEVEL REDISTRIBUTION USING ELECTROLESS CU DEPOSITION L. Boettcher  Abstract
PLATED GOLD THICKNESS EFFECTS ON ORGANIC SUBSTRATE WIREBOND PULL STRENGTH AND BGA BALL SHEAR M. D. Holcomb  Abstract
QUALITY PROCESS OPTIMIZATION BY USING "DYNAMIC PROGRAMMING" M. Oppermann, W. Sauer, H. Wohlrabe and T. Zerna  Abstract
GUIDELINES FOR FINE FEATURE STENCIL PRINTING Mandar Painaik, Daryl L. Santos, Ph.D.  Abstract
THE NEW MILLENNIUM FOR CCGA - BEYOND 2000 I/O Marie S. Cole  Abstract
SELECTIVE SOLDER FIXTURES : COST EFFECTIVE MIXED TECHNOLOGY SOLDERING Marie Spalding  Abstract
DIFFERENCES BETWEEN ALUMINUM AND COPPER WAFER METALLIZATION IN THE WAFER SAW PROCESS FOR THIN BGA PACKAGES Mark Gerber, Daniel Cavasin and Noel Arguello  Abstract
ADVANCES IN AUTOMATIC OPTICAL INSPECTION: GRAY SCALE CORRELATION vs. VECTORAL IMAGING Mark J. Norris  Abstract
LEVERAGING SEMICONDUCTOR TECHNOLOGY FOR SYSTEM IN PACKAGE Martin Goetz  Abstract
SOLDERING PROCESS USING LIGHT BEAM TECHNOLOGY Masaharu Takagi  Abstract
INVESTIGATION OF LEAD FREE SOLDER PROCESSING Mathias Nowottnick, U. Pape, K. Wittke, W. Scheel  Abstract
OEM OUTSOURCING TO EMS COMPANIES BUILDING SUCCESSFUL RELATIONSHIPS Matt Srnec and Jim Gryga  Abstract
INVESTIGATION OF PRINTING ISSUE AND STENCIL DESIGN FOR 0201 PACKAGE Mei Wang  Abstract
MACHINE PLATFORM DETERMINATION WHAT’S BEST FOR YOUR FACTORY? Michael Cieslinski & Brian Mathey  Abstract
ALTERNATIVE UNDERFILL MATERIAL FOR CSP PACKAGES: LOW OUTGASSING AND IONICS EPOXY Michael Ko  Abstract
PWB CONTAMINATION & RELIABILITY DOE Michael R. Weekes  Abstract
USING QUALITY AS A CUSTOMER-CENTRIC ASSESSMENT FOR CAPITAL INVESTMENT Mike Buseman  Abstract
COMPONENT AND BOARD LEVEL RELIABILITY OF HIGH PIN COUNT FLIP CHIP PACKAGES Mike Loo  Abstract
PERFORMANCE EVALUATION OF LEAD-FREE SOLDER PASTES Minna Arra  Abstract
EVALUATION AND OPTIMIZATION OF THE SPEEDLINE MPM CLOSED-LOOP RHEOMETRIC PUMP HEAD Muffadal Mukadam and Daryl Santos  Abstract
POLYMER STENCILS FOR FINE PITCH APPLICATIONS Nils Heininger  Abstract
IMPLEMENTATION OF NO FLOW UNDERFILL MATERIALS FOR LOW COST FLIP CHIP ASSEMBLY P. N. Houston, B. A. Smith, and D. F. Baldwin  Abstract
RELIABILITY OF 27MM, 1.0MM PITCH PLASTIC BALL GRID ARRAYS (PBGAS) FOR AUTOMOTIVE APPLICATIONS Patrice Langford* and Diane Hodges Popps  Abstract
THERMAL FATIGUE RESISTANCE OF Pb-FREE SECOND LEVEL INTERCONNECT Patrick Roubaud and Greg Henshall  Abstract
BOARD-LEVEL OPTRONICS ASSEMBLY AND PACKAGING Peter Arrowsmith  Abstract
FLUX CHEMISTRIES AND THERMAL PROFILING: AVOIDING SOLDERING DEFECTS IN SMT ASSEMBLY Peter Biocca  Abstract
PLANE UNDER BGA RELIABILITY Phil Geng and Scott Dixon  Abstract
DESIGN AND TEST MUST WORK TOGETHER TO SOLVE LIMITED ACCESS TEST PROBLEMS Randy Bird and Jim Arient  Abstract
RELIABILITY OF COTS MEMS ACCELEROMETER UNDER SHOCK AND THERMOMECHANICAL CYCLING Reza Ghaffarian  Abstract
RAPID QUALIFICATION OF CSP ASSEMBLIES BY INCREASE OF RAMP RATES AND CYCLING TEMPERATURE RANGES Reza Ghaffarian  Abstract
LOGIC CORE DESIGN AND DEVELOPMENT FOR HARSH ENVIRONMENT AUTOMOTIVE APPLICATIONS Riccardo Groppo  Abstract
DESIGN FOR TESTABILITY UNDERSTANDING THE OVERALL APPROACH Rich Freiberger  Abstract
AN OVERVIEW OF IPC STANDARDS RELATED TO MOISTURE SENSITIVE COMPONENTS Robert Rowland  Abstract
FLIP-CHIP UNDERFILLING INNOVATIVE ADHESIVE SYSTEMS FOR AN INNOVATIVE APPLICATION Robert Saller  Abstract
DEALING WITH THE "BLACK PAD DEFECT" - A FAILURE ANALYST’S PERSPECTIVE Roger Jay & Alfred Kwong  Abstract
Fatigue of Plastic Ball Grid Array and Plastic Quad Flat Packages under Automotive Vibration Ron S. Li and Larry Poglitsch  Abstract
PRINT PROCESS CHARACTERIZATION FOR BGA, FINE PITCH BGA AND CSP COMPONENTS S. Manian Ramkumar and Richard Clouthier  Abstract
AN ALTERNATIVE APPROACH TO HIGH DENSITY INTERCONNECT PCB Samuel Tilakraj  Abstract
WAVE SOLDER: OPTIMIZE THE PROCESS? DESIGN IT OUT Scott Martin AND Heidi Martin  Abstract
PBGA RELIABILITY FOR AUTOMOTIVE ELECTRONICS Scott Post  Abstract
CERAMIC CSP ; RELIABLE BOARD LEVEL INTERCONNECTION UNDER SEVERE TEMPERATURE CYCLING TEST CONDITION Shoji Uegaki  Abstract
INVESTIGATION OF IMMERSION SILVER PCB FINISHES FOR PORTABLE PRODUCT APPLICATIONS Srinivas Chada and Edwin Bradley, III  Abstract
HIGH VOLUME LEAD FREE PRODUCTION Stephen Wong, Myron Nestor  Abstract
DEFECT LEVELS FOR DIFFERENT COMPONENT TYPES AT THE PCBA MANUFACTURING PROCESS Stig Oresjo  Abstract
CONSIDERATIONS IN THE DESIGN OF IMPINGEMENT-COOLED SYSTEMS Suresh V. Garimella  Abstract
RELIABILITY OF LEAD FREE SOLDER JOINTS ON MANUFACTURING CONDITIONS Th. Herzog , K.-J. Wolter, Th. Zerna  Abstract
PRINTED BOARD PROCESS CAPABILITY, QUALITY AND RELATIVE RELIABILITY (PCQR 2 ) BENCHMARK TEST STANDARD Thomas D. Newton  Abstract
ANALYSIS OF RELIABILITY CONCERNS IN UNDERFILLED FLIP CHIPS USING SCANNING ACOUSTIC MICROSCOPY Todd Snively and Bruce Oliver  Abstract
DPMO - A KEY METRIC FOR PROCESS IMPROVEMENT IN PCB ASSEMBLY Tom Woody  Abstract
TEST EFFECTIVENESS: A METRIC FOR COMPARING TEST EQUIPMENT AND TEST PROCESSES Tracy Ragland  Abstract
STRENGTH AND FATIGUE BEHAVIOR OF JOINTS MADE WITH Bi-42Sn-1Ag SOLDER PASTE: AN ALTERNATIVE TO Sn-3.5Ag-0.7Cu FOR LOW COST CONSUMER PRODUCTS V. Schroeder, F. Hua,* and J. Gleason  Abstract
MICROSYSTEM TECHNOLOGIES FOR MOBILE COMMUNICATION PRODUCTS Vladimir Ermolov  Abstract
STENCIL PRINT PERFORMANCE STUDIES William E. Coleman  Abstract
QUANTIFYING THE EFFECTS OF THE FACTORS THAT INFLUENCE YIELD IN AN EMS ENVIRONMENT X. Zhou & H. Ladhar  Abstract
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