SMTA China East 2014 Proceedings

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TITLE AUTHOR
Collaboration Between OEM and EMS to Combat Head on Pillowing Defects: Part 2 - Warpage Acceptance Proposal Alex Chan, Paul Brown, Richard Coyle, Lars Bruno, Anne-Kathrine Knoph, Thilo Sack, David Geiger, David Mendez, Ron Kulterman, Mulugeta Abtew, Iulia Muntele, and Kirk VanDreel  Abstract
Solder Paste Residue Corrosivity Assessment: Bono Test Celine Puechagut, Anne-Marie Laiigt, Emmanuelle Guene, Richard Anisko (presented by Steven Teh)  Abstract
Package on Package Module Assembly Process Development Chuan Xia, Charles Gui and Scott Priore  Abstract
Impact of Low Ag SAC Solder Pastes on BGA Solder Joint Quality Colin Wang, Wu Jin Chang, Wang Xin, Tang Kok Kwan, Raiyo F. Aspandiar  Abstract
The Effect of the Pre-treatment of Metal Foil on Sulfur's Corrosive Reaction Rate in Flower of Sulfur Test Applied in Electronics Dem Lee, Cheng Chih Chen, Jeffrey ChangBing Lee, Peggy Liou, Jason Jiangg, Jane Li, Karlos Guo  Abstract
Is High Phosphorus Content in the Nickel Layer a Root Cause for Black Pad on ENIG? Dipl.-lng. Mustafa Ozkok, Joe McGurran, and Kenneth Lee, Ph.D.  Abstract
Low Volume n=1 Automatic Visual Inspection Dr. Jim Long, Steve Hsu, Kent Lien, Mitsuhiro Noguchi Landrex and Newly Tsuchiyama  Abstract
A Case Study of Production Productivity Improvement through Witness Modeling and Simulation Henley Zhou, Andy Liang, Robben Wang, Isaias Daguio, RSivam VRajoo  Abstract
NxTGen PoP (Shrinking the Package-on-Package) Jim Adriance, John Almiranez, and Peng Ji  Abstract
The Creep and Printing Behavior of Water Soluble Solder Pastes Li Tianpeng, Jorcelyn Tan Yin Ru, C. D. Breach and A. Hawkins  Abstract
The Special Hot Bar Soldering with Copper Balls Process Development for Mixed Signal Module Application Louis Lv, Isaias Daguio, Jumbo Huang, Henley Zhou, RSivam VRajoo, Engsiang Khor, JoJo Vigo, Dragon Chin, and Murad Kurwa  Abstract
Study on Microstructure of Vippo Desinged PCB in Lead Free Rework May Yan, Bendy Cai, Scott Priore  Abstract
Compatibility of Conformal Coatings with No Clean Flux Residue Mitch Holtzer, Karen Telefsen, Westin Bent (presented by William Yu)  Abstract
Jetting Solder Paste Opens Up New Possibilities in Your SMT Production Nico Coenen (presented by Sam Zhao)  Abstract
Cleaning Soldering Residues from High Lead Soldered PCBs Ram Wissel, Mike Bixenman and Jason Chan  Abstract
Complicated Board Programming for KOH Young SPI Without CAD Data File Run-Sheng Mao, Ph.D. and Ning-Cheng Lee, Ph.D.  Abstract
Development of a Fatigue Resistant Lead-Free Alloy for High Reliability under Hood Applications Steve Brown (presented by William Yu)  Abstract
The Truth Behind Shop-Floor Data Capture Tony Shao  Abstract
Concentration Monitoring & Closed Loop Control - A Technological Advancement Umut Tosun, M.S.Chem.Eng., Axel Vargas, Jerry Ji, and BH Kim  Abstract
The Second Generation Shock Resistant And Thermally Reliable Low Ag SAC Solder Doped With Mn Vahid Goudarzi, Matthew Brown, Weiping Liu, Ning-Cheng Lee, and Jeffrey ChangBing Lee  Abstract
Voiding and Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys Van Liu, Joanna Keck, Erin Page, and Ning-Cheng Lee  Abstract
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