Pan Pacific Symposium 2016 Proceedings

While abstracts in the Knowledge Base are accessible to all visitors, the full articles (PDF format) are FREE FOR SMTA MEMBERS to download.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

< Back to Conferences List

Corrosion Study on BGA Assemblies A. Guédon-Gracia, H. Frémont, J.-Y. and K. Weide-Zaage  Abstract
Graphene Nanoribbons for Next-Generation Electronics Alan Rae, Paul Clayson and Justin Clayson  Abstract
X-Ray Inspection Methods for Controlling PCBA Potting Process – 2DX and Partial Angle Computer Tomography Andy Liu, ChengYong Zou, Tianhui Lin, Jeff Li, CK Tan, Zhen (Jane) Feng, Ph. D., David Geiger, Sunny Liu, JP Wen, Baselec Suzhou, Jiangsu, China Jimmy Xiao, Louis Liu, and Evstatin Krastev, Ph.D.  Abstract
Progress and Application of Through Glass Via (TGV) Technology Aric B. Shorey and Rachel Lu  Abstract
Roadmapping the Electronics Manufacturing Supply Chain Takes a “Village” Bill Bader, Chuck Richardson and Paolo Gargini  Abstract
Part, Material, and Process Requirements Impact on Reliability Casey Cooper  Abstract
Low-Temperature and Low-Pressure Direct Copper-To-Copper Bonding By Highly (111)-Oriented Nanotwinned Cu Chih Chena,, Chien-Min Liua, Han-wen Lina, Yi-Sa Huanga, Yi-Cheng Chua, Dian-Rong Lyub, Kuan-Neng Chenb and K. N. Tuc  Abstract
COSIVU - Compact, Smart and Reliable Drive Unit for Fully Electric Vehicles Dag R. Andersson, Klas Brinkfeldt, Stefan Nord, Jonas Ottosson, Gorazd Lampic, Gorazd Gotovac, Olaf Zschieschang, Hauke Baumgärte, Matthias Brusius, Eberhard Kaulfersch, Florian Hilpert, Alexander Otto, and Sophia Frankeser  Abstract
The Return of the Red Retardant Dock Brown  Abstract
A Novel Piezoelectric Printhead for High Melting Point Liquid Metals Dominik Rumschoettel, Florian Künzel, Franz Irlinger and Tim C. Lueth,  Abstract
Formation of Metal Interconnects and Their Resistancechange Behavior during Tensile Stretching for Stretchable Packaging Applications Donghyun Park, Dae Ung Park, Kee-Sun Han, Soo Jin Shin, Hyun-Ah Oh, Tae Sung Oh, Ph.D. and Jung-Yeol Choi, Ph.D.  Abstract
Critical Success Factors for Electronic Manufacturing Services Eddie Kobeda, Phil Isaacs and Larry Pymento  Abstract
X-Ray Inspection Study with Pcb Cavity Press-Fit Connectors Golden Xu, Engsiang Khor, Lea Su, Weifeng Liu, Ph. D., Zhen (Jane) Feng, Ph. D., David Geiger, Lim Lay Ngor, Wang Yun, Choo Hong Hwa, and Seow ZiYang  Abstract
Embedded Camera Module for Automotive Camera System Hyunho Kim and Jongtae Lee, Se-meyung Hwang, and Sangsuk Cha  Abstract
Effects of Molding Compound Properties on Acoustic Evaluation Of Encapsulated Microelectronic Devices Janet E. Semmens  Abstract
High-Density Assembly and Root Cause Analyses Jonas Sjoberg, Chris Nash, David Sbiroli and Wisdom Qu  Abstract
Failure Mechanisms in IGBTs Related to Voiding Keith Bryant and Thorsten Rother  Abstract
Recent Advances in X-Ray Technology Keith Bryant and Ragnar Vaga  Abstract
Improving Design Performance with System-Level Co-Design and Multi-Physics Analysis: Thermal and Stress-Aware Design for Three Dimensional Stacked IC Package Kiyohisa Hasegawa, Kazunari Koga, and Humair Mandavia  Abstract
Development Status of Photoresist As Mask Material for Injection Molded Solder (Ims) Technique Koichi Hasegawa, Jun Mukawa, Seiichirou Takahashi, Chihiro Kobata, Kenzo Ohkita, Shiro Kusumoto, Toyohiro Aoki, Eiji Nakamura, Takashi Hisada, Hiroyuki Mori and Yasumitsu Orii  Abstract
High-Density Packaging Technology Solution for Smart ICT Koukou Suu  Abstract
Flexibility of Anisotropic Conductive Films (ACFS) Bonded CiF(Chip In Flex) Package for Wearable Electronics Applications Kyung W. Paik, Ph.D., Ji-Hye Kim, and Young R. Kim  Abstract
Signal and Power Integrity Design of 2.5D HBM (High Bandwidth Memory Module) on Si Interposer Kyungjun Cho, Hyunsuk Lee, and Joungho Kim  Abstract
Electronic Assembly Warranties Challenge The Industry To Improve Risk Mitigation Test Methods Mark McMeen, Jason Tynes Mike Bixenman , DBA and David Lober  Abstract
Characterizing Materials at the Component Interface Can Improve Reliability Mike Bixenman, David Lober, Mark McMeen, and Jason Tynes  Abstract
An Efficient Micro Control Unit Vlsi Design for Wearable Electronics and Sensor Networks Min-Chun Tuan, Shih-Lun Chen*, Ph.D. and Ting-Lan Lin, Ph.D. and Ho-Yin Lee, Ph.D.  Abstract
Multipurpose Lead-Free Reliability Prediction Model Olli Salmela, D.Sc.(E.E.), Jussi Putaala, D.Sc. (E.E.), Olli Nousiainen, D.Sc., Antti Uusimäki, D.Sc., Jussi Särkkä, D.Sc. and Markku Tammenmaa, D.Sc.  Abstract
Nano Anchoring Copper Foil for Next Generation Printed Wiring Boards Osamu Suzuki, Akito Yoshi, Hironobu Tsubura, Makiko Sato, Naoki Obata, and Yoshinobu Kokaji  Abstract
Interpreting Accelerated Test Results for Lead Free Solder Joints P. Borgesen, S. Hamasha, L. Wentlent, D. Watson, and C. Greene  Abstract
Optimising Thermo Mechanical Behaviour of Power Electronic Module Structures P. Rajaguru, C. Bailey, H. Lu  Abstract
New Technology, Small Footprint (9’ X 4’), Vertical Circuit Washing System for PCBAS (< 3” X 3”) Peter Fritsche  Abstract
What Makes No-Clean Flux Residue Benign? Phil Isaacs & Terry Munson  Abstract
Conformal Coating Challenges: Detection, Rework and Failure Analysis Priyanka Dobriyal, Suriyakala Ramalingam, Shu Lee Lim, and Anil Kurella  Abstract
Effect of Bath Contamination on Electroplated Solder Bumps Sam Lee, Marvin Bernt and Prayudi Lianto  Abstract
Development of Tools and Techniques for Mechanical Property Testing and Analysis of Experimental Nano Solder SammyShina, Ph.D., P.E Albert Appiah, Craig Johnson, Andrew Rugg, Matthew Sanderson and Osei Serebour  Abstract
Glass Interposers with Metalized Through Via Satoru Kuramoch, Sumio Koiwa, Hiroyuki Nagano, Jiro Iida,Miyuki Akazawa, Hiroshi Mawatari, Kousuke Suzuki, and Yoshitaka Fukuoka  Abstract
Comprehensive Correlation of Inline Inspection Data for the Evaluation of Defects in Heterogeneous Electronic Assemblies Stefan Härter, Tobias Klinger, Jörg Franke and Detlef Beer  Abstract
Hybrid Bonding Technology with Cu-Cu/Adhesives for High Density 2.5D/3D Integration Taiji Sakai, Nobuhiro Imaizumi and Seiki Sakuyama  Abstract
Mode Size Converter Designs for Fabrication of Ultra-Low Loss Optical Interconnects Terry Bowen, Jonathan Lee, Tao Ling, Jibin Sun, Haipeng Zhang  Abstract
Making the Connections in Electronic Circuitry- The Continuing Evolution of Joining Technologies Tetsuro Nishimura  Abstract
Joining of Pure Copper Using Cu Nanoparticles Derived from CuO Paste Tomoyuki Fujimoto, Tomo Ogura, Tomokazu Sano, and Akio Hirose  Abstract
Near-Field Scan Tools for Embedded Electronic Analysis Tristan Dubois, Geneviève Duchamp, Julien Weckbrodt, and Stephane  Abstract
A Design for Highly Robust AlCu - W-Plug – Metallization Stack V. Hein, M. Ackermann, M. Erstling, J. and K. Weide-Zaage  Abstract
AlCu- Metal Heater for Interconnect Monitoring Test Structures Verena Hein and Marco Erstling  Abstract
Advanced Interconnect Technologies in the Era of Cognitive Computing Yasumitsu Orii, Akihiro Horibe, Keiji Matsumoto, Toyohiro Aoki, Kuniaki Sueoka, Sayuri Kohara, Keishi Okamoto, Shintaro Yamamichi, Kohji Hosokawa and Hiroyuki Mori  Abstract
Directly Attached Airbag Sensor Packaging For Automobiles Yeong K. Kim, Ph.D., Hyunjin Kang and Joon Ki Kim, Ph.D.  Abstract
Fine-Pitch Chip-on-Flex Packaging of Optoelectronic Devices Using Low Temperature Optodic Bonding Yixiao Wanga, Melanie Gauchb, Detlev Ristaub, and Ludger Overmeyera,  Abstract
Piezoelectric Materials for High Performance Energy Harvesting Devices Young-Ku Jin, Subrata Sarker, Ki-Seong Lee, Hyun Woo Seo, Dong Min Kim  Abstract
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819