SMTA International 2015 Proceedings

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TITLE AUTHOR
Rosin Vs. Non-Rosin Wave Flux - Which Creates More Reliable Electronic Assemblies? Adam Murling and Ron Lasky, Ph.D.  Abstract
Thermo-Mechanical Warpage and Stress Simulation for 2.5D and 3D IC Packaging Akash Agrawal, Guilian Gao, Bongsub Lee, Laura Mirkarimi, Sitaram Arkalgud  Abstract
There Is No Instant Pudding - Understanding the Roles Test Plays in Managing the Quality of Electronic Printed Circuit Board Assemblies Alan Albee  Abstract
Effect of Test Specimen on Fracture Behavior of Lead-Free Solder Joints Amir Nourani, Saeed Akbari, Jan K. Spelt  Abstract
Quantifying Qualitative Attributes of Cored Solder Wire in LED Luminaire Soldering - Part I Amit Patel, Steve Prokopiak, Nicholas Herrick, Bin Mo, Rahul Raut, Ranjit Pandher, Ph.D.  Abstract
Plasma Based VOC-Free Fluxing for Selective and Wave Soldering Andreas Reinhardt, Ph.D. and Sonja Wege, Ph.D.  Abstract
Thermal Shock Reliability Test On Multiple Doped Low Creep Lead Free Solder Paste And Solder Ball Grid Array Packages Anto Raj, Sivasubramanian Thirugnanasambandam, Thomas Sanders, Sharath Sridhar, John Evans, Ph.D., Michael Bozack, Ph.D., and Wayne Johnson, Ph.D.  Abstract
Solder Joint Fatigue Characterization of DDR3 SDRAMS and Other Advanced BGA Packaging Memory Types Arnaud Grivon, Damien Baudet, Michel Brizoux, Aurélien Lecavelier, and Wilson Maia  Abstract
Wise and Icarus: New X-Ray Algorithms to Improve the Detection of Counterfeit Components Bill Cardoso, Ph.D., Glen Thomas, Ph.D., Griffin Lemaster, Carlos Valenzuela, Brian Wagner, Tom Gasaway, and Jesse Squire  Abstract
Advanced Closed Loop Process Control for Selective Soldering Bob Klenke  Abstract
Improved SMT and BLR of 0.35mm Pitch Wafer Level Packages Brian Roggeman and Beth Keser  Abstract
Defining Mechanical Load Limits for Thermal Solutions on High Performance FCBGA Packages Brian Roggeman, Jiantao Zheng, Mark Schwarz, and Ahmer Syed  Abstract
Reactivity of No-Clean Flux Residues in Electronic Assemblies: A Systematic Study Bruno Tolla, Ph.D., Denis Jean, Hemal Bhavsar, Yanrong Shi, Ph.D., Xiang Wei, Ph.D.  Abstract
Solder-Joint Reliability of 0.8mm BGA Packages for Automotive Applications Burton Carpenter and Thomas Koschmieder  Abstract
Wearable Electronics & Big Data = High Volume, High Mix SMT! Charles E. Bauer, Ph.D. & Herbert J. Neuhaus, Ph.D.  Abstract
Assembly Challenges for 2.5D and 3D IC Packaging Charles G. Woychik, Guilian Gao, Cyprian Uzoh, Hong Shen, Liang Wang, Sangil Lee, Roseann Alatorre, Scott McGrath, Mohamed Elassar and Sitaram Arkalgud  Abstract
Multi-Array PCB Traceability System Christoph Wimmer  Abstract
Determination of Total Halogen Content in Halogen-Free Fluxes by Inductively Coupled Plasma and Some Limitations of Ion Chromatography Christopher J. Pontius, George Kraeger, Ron Lasky, Ph.D., P.E.  Abstract
Video Analysis of Solder Paste Release from Stencils Chrys Shea, Mike Bixenman, D.B.A., Wayne Raney, and Ray Whittier  Abstract
Long Term Aging Effects on the Reliability of Lead Free Solder Joints in Ball Grid Array Packages with Various Pitch Sizes and Ball Alignments Cong Zhao, Chaobo Shen, Zhou Hai, Jiawei Zhang, M. J. Bozack, and J. L. Evans  Abstract
European Union RoHS Leaded Solder Exemption Update Curtis Grosskopf, Marie S. Cole, Pam Lembke, Jeff Lagler, and Kurt Van der Herten  Abstract
Optimization of X-Ray Inspection for Solder Charge Connectors David Geiger, Zhen (Jane) Feng, Ph. D., Jennifer Nguyen, Weifeng Liu, Ph.D., Anwar Mohammed, Murad Kurwa, Golden Xu, Lea Su, and George Tint, Ph.D.  Abstract
Voiding Control Beneath Bottom Terminated Components Using Solder Fortification® Preforms Derrick Herron, Christopher Nash, Raymond Luo, Andy Wei  Abstract
The Return of the Red Retardant Dock Brown, CRE  Abstract
Development and Characterization of Solder Pastes Based on Two Alternative Alloys: Bismuth-Tin-Silver (BiSn42Ag0.4-1%) for Low Temperature and Tin-Antimony (SnSb5-8.5) for High Temperature Emmanuelle Guéné  Abstract
Determining the Effect of Water Quality on Cleaning Effectiveness Eric Camden  Abstract
Ultrathin Fluoropolymer Coatings to Mitigate Damage of Printed Circuit Boards Due to Environmental Exposure Erik Olson, Molly Smith, Greg Marszalek, Karl Manske, Nikesh Dhar  Abstract
Using Manufacturing Analytics as a Competitive Strategy Farid Anani, M.S.E.E., MBA, and Jay Gorajia, B.Sc.E.E., MBA  Abstract
Evaluation of High Reliability Reworkable Edge Bond Adhesives for BGA Applications Fei Xie, Ph.D., Han Wu, Daniel F. Baldwin, Ph.D., Swapan Bhattacharya, Ph.D., Kelley Hodge, and Qing Ji, Ph.D.  Abstract
WLCSP and BGA Reworkable Underfill Evaluation and Reliability Fei Xie, Ph.D., Han Wu, Daniel F. Baldwin, Ph.D., Swapan Bhattacharya, Ph.D., Kelley Hodge, Qing Ji, Ph.D., and Ben Bo  Abstract
The Risk and Solution for No-Clean Flux Not Fully Dried under Component Terminations Fen Chen and Ning Cheng Lee, Ph.D.  Abstract
Final Finish Specifications Overview IPC Plating Subcommittee 4-14 George Milad  Abstract
Achieving Repeatable, Consistent Control over the Selective Production Process Gerjan Diepstraten  Abstract
On the Smart Move: Industry 4.0 in Electronics Production Günter Schindler  Abstract
Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber: Phase 2 Haley Fu, Prabjit Singh, Aamir Kazi, Wallace Ables, Dem Lee, Jeffrey Lee, Karlos Guo, Jane Li, Simon Lee and Geoffrey Tong  Abstract
Isothermal Fatigue of High Temperature Solder Joints Harry Schoeller, Ph.D.  Abstract
Thermo-Mechanical Evaluation of Alternative Pb-Free Die Attach Materials Harry Schoeller, Ph.D., Sandeep Mallampati, and Junghyun Cho, Ph.D.  Abstract
The Quantitative Assessment of Mixed BGA Joint with the Elimination of Low-Melting Point Alloy Re-Melting Process Hongqin Wang, Guanghui He and Daojun Luo  Abstract
Are You Leveraging Unit Level Traceability Fully? James Trego and Kirk Griffin  Abstract
Board, Package and Die Thickness Effects under Thermal Cycling Conditions Jean-Paul Clech  Abstract
Design Considerations in the Use of Phase Change Materials in Data Center Cooling Jeff Luttrell, Abhishek Guhe, and Dereje Agonafer, Ph.D.  Abstract
Assessment of Thermal Pastes for Use in Space Electronics Jeffrey Marcus Jennings, Susan M. Marlowe, and Peter F. Ruggiero  Abstract
The Future of Nanotechnology in Electronics Assembly and the Investigation of Nano-Coating Materials for Water Resistant Applications Jennifer Nguyen, David Geiger, Anwar Mohammed and Murad Kurwa  Abstract
Harsh Environment Reliability of Micro-Leadframe (QFN) Components and Conformal Coating Effects Jim Wilcox, Michael Meilunas, and Martin Anselm  Abstract
A Packaging Physics of Failure Based Testing Methodology for Semiconductor IC Part Reliability Assessment Jingsong Xie, Ming Sun, and Fei Xie  Abstract
Evaluating the Effects of Plasma Treatment Prior to Conformal Coating on Electronic Assemblies to Enhance Conformity of Coverage John D. Vanderford, MSEE, Ann E. Paxton, and Dave Selestak  Abstract
A Selected Comparison from ATC Test: Industry Progress from 2005 to Present Day John McMahon, Russell Brush, and Brian Standing  Abstract
Reliability Improvements by the Creation of Intermetallic Connections Jörg Trodler, Dipl.-Ing. and Dr. Ing. Habil Heinz Wohlrabe  Abstract
Avionics Vibration Durability Between Tin-Lead and Lead-Free Solder Interconnects Joseph M. Juarez, Jr., Ph.D.  Abstract
Innovating the Microstructure of Polyurethane Conformal Coatings for Tin Whisker Mitigation Junghyun Cho, Suraj Maganty, and Stephan J. Meschter  Abstract
SIR and ECM Testing of Soldering Materials vs. Soldering Processes Karen Tellefsen, Ph.D.  Abstract
Evolution of the Performance and Reliability Requirements of Soldering Fluxes Karl Seelig and Timothy O'Neill  Abstract
Development of Low Cost and High Pin Count Wafer Level Packaging Karthik Thambidurai, Viren Khandekar, Tiao Zhou Ph.D. and Kaysar Rahim Ph.D.  Abstract
Man vs. Machine Keith Bryant and Thorsten Rother  Abstract
The Effects of Phosphorus in Lead-Free Solders Keith Sweatman, Takatoshi Nishimura and Takuro Fukami  Abstract
Advanced Analysis of Package-on-Package Interconnect Gaps During Reflow Assembly Ken Chiavone  Abstract
Development of Advanced Embedded Die Modules for Power Electronics Applications Lars Boettcher, Stefan Karaszkiewicz, Dionysios Manessis and Andreas Ostmann  Abstract
Controlling Copper Roughness to Enhance Surface Finish Performance Lenora Toscano and Ernest Long, Ph.D.  Abstract
Challenges of SMT Assembly of PoP Packages Lilia May, Rajen S. Sidhu, Chang Lin, Srinivasa R. Aravamudhan, Pubudu Goonetilleke, Huiyang Fei, Satyajit S. Walwadkar, Katherine J. Downes  Abstract
Alternative Methods for Cross-Sectioning of SMT and PCB Related Architectures Manuel J. Solis  Abstract
The Development of a 0.3mm Pitch CSP Assembly Process Part 2: Assembly & Reliability Mark Whitmore and Jeff Schake  Abstract
High Efficient Heat Dissipation on Printed Circuit Boards Markus Wille  Abstract
CGA Trends and Capabilities Marti McCurdy, Isabel de Sousa, Robert Martel and Alain Lessard  Abstract
CCGA - Solder Column Attachment for Absorbing Large CTE Mismatch Martin Hart  Abstract
A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications Mary Liu, Ph.D. and Wusheng Yin, Ph.D.  Abstract
Peak Temperature Limitation of Electronic Assemblies with Phase Change Materials Mathias Nowottnick, Andrej Novikov, Daniel Lexow  Abstract
Via-In-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware Matt Kelly, Mark Jeanson, Timothy Younger, Jim Bielick, Theron Lewis, and Mitch Ferrill  Abstract
Sulfur Corrosion of Printed Circuit Board Surface Finishes in Three Different Sulfur-Rich Environments Matthew D. Weeks, Ph.D., David J. Zueck  Abstract
Effect of Bi Content on Properties of Low Silver SAC Solders Mehran Maalekian, Ph.D., Yuan Xu, and Karl Seelig  Abstract
Lean Flow on the SMT Factory Floor Michael Ford  Abstract
A Different Perspective on Solder Paste Printing: Perfecting the Print Process with Practical Solutions Michael J. Cieslinski and Brent A. Fischthal  Abstract
Metallization and Surface Finish Effects on Pb-Free WLCSP Thermal Cycle Reliability Michael Meilunas and Jim Wilcox  Abstract
Cleanliness Makes a Difference When Miniaturization Kicks In Mike Bixenman, DBA, David Lober, Mark McMeen and Jason Tynes  Abstract
Electronic Assembly Pitting / Crevice Corrosion Research Mike Bixenman, DBA, Wallace Ables, Richard Kraszewski, Chin Siang Kelvin Tan, Julie Silk, Keith Howell, Takatoshi Nishimura, Jim Hartzell, Karl Sauter, and Robert Smith  Abstract
Nickel Hydroxide Corrosion Residues on Metallized Ni/Au Ceramic Packages Minerva M. Cruz and Russell T. Winslow  Abstract
In House Dross Recovery- Do You Know What You Are Putting Back in Your Solder Bath? Mitch Holtzer and Jason Fullerton  Abstract
Comprehensive Report on Low Temperature Solder Alloys for Portable Electronics Morgana Ribas, Ph.D., Anil Kumar, Ranjit Pandher, Ph.D., Rahul Raut, Sutapa Mukherjee, Siuli Sarkar, Ph.D. and Bawa Singh, Ph.D.  Abstract
Factors Impacting the Reliability of Ultralow Silver Lead Free Alloys Neil Poole, Ph.D., Brian J. Toleno, Ph.D., and Mark Curie, Ph.D.  Abstract
Epoxy Flux Material and Process for Enhancing Electrical Interconnections Neil Poole, Ph.D., Elvira Vasquez, and Brian J. Toleno, Ph.D.  Abstract
Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups Formed by Reflow Soldering SAC Solder Balls BGAs with BiSnAg and Resin Reinforced BiSn-Based Solder Pastes Olivia H. Chen, Al Molina, Raiyo Aspandiar, Kevin Byrd, Scott Mokler, and Kok Kwan Tang  Abstract
Long Term Monitoring and Failure Detection of Tin Whiskers Bridging Adjacent Leads on SOIC Components Owen Thomas, Chris Hunt, Martin Wickham and Kate Clayton  Abstract
Establishing a Ti-Cu-Pt-Au Thin Film – On – Low Temperature Co-Fired Ceramic (LTCC) Technology for High Temperature Electronics P. Vianco, J. Rejent, M. Grazier, A. Kilgo, B. McKenzie, A. Allen, E. Guerrero and W. Price  Abstract
Thermal Mechanical Fatigue of a 56 I/O Plastic Quad-Flat Nolead (PQFN) Package Paul Vianco, Ph.D., and Michael K Neilsen, Ph.D.  Abstract
Characterization of Conformal Coatings Prabjit Singh  Abstract
Deformation and Strain Measurements in Operational Electronics Using X-Ray Micro-CT and Digital Volume Correlation Pradeep Lall and Junchao Wei  Abstract
Corrosion and Contaminant Diffusion Multi-Physics Model for Copper-Aluminum Wirebonds in High Temperature High Humidity Environments Pradeep Lall, Yihua Luo, and Luu Nguyen  Abstract
Development of Lead-Free Alloys with Ultra-High Thermomechanical Reliability Pritha Choudhury, Ph.D., Morgana Ribas, Ph.D., Ranjit Pandher, Ph.D., Anil Kumar, Sutapa Mukherjee, Siuli Sarkar, Ph.D., Bawa Singh, Ph.D.  Abstract
On-Board Package Decapsulation Techniques for Failure Analysis Priyanka Dobriyal, Anil Kurella, and Suzi Southwick  Abstract
High-Volume-Manufacturing (HVM) of BVA Enabled Advanced Package-On-Package (POP) Rajesh Katkar, Ashok S. Prabhu and Wael Zohni  Abstract
Ensuring Performance and Reliability of High Temperature Electronics through Thermally Stable Parylene HT at Nano/Micro Levels Rakesh Kumar, Ph.D.  Abstract
Connector Design for Wearables Randy Schueller, Ph.D.  Abstract
iNEMI Pb-Free Alloy Characterization Project Report: Part IX - Summary of the Effect of Isothermal Preconditioning on Thermal Fatigue Life Richard Coyle, Richard Parker, Joe Smetana, Elizabeth Benedetto, Keith Howell, Keith Sweatman, Weiping Liu, Michael Osterman, Julie Silk, Aileen Allen, Mitch Holtzer, Rafael Padilla, and Tomoyasu Yoshikawa  Abstract
Assessing Backward Compatible Solder Joint Reliability under Standard and Mildly Accelerated Test Conditions Richard Coyle, Vasu Vasudevan, Raiyo Aspandiar, Iulia Muntele, Steve Tisdale, Peter Read, Richard Popowich, and Debra Fleming  Abstract
Direct Metallization System for Flexible Printed Circuit Board Rita Mohanty, Albert Angstenberger, Melanie Rischka, Han Verbunt  Abstract
Eleminating False Positive ICT Response through the Use of Organic-Metal Final Finish Rita Mohanty, John Fudala, Sathiya Narayana  Abstract
Comparing PCB Surface Finishes and their Assembly Process Compatibility Rob Rowland and Ray Prasad  Abstract
Board Level Reliability Comparison of BGA and LGA Packages Mounted to an LGA Footprint Motherboard Robert Darveaux, Howard Chen, Shaul Branchevsky, Bhuvaneshwaran Vijayakumar, Ben Zarkoob, Wyatt Huddleston, Christopher J. Berry, Fenimore Chen  Abstract
Key Technical Challenges And Process Improvements For An Electronics Manufacturing Service Provider Robert Farrell, Bruce Tostevin, Rick Wyman, Paymon Adl-zarabi  Abstract
The Impact of Improper Conformal Coating Processes on BGA Solder Joint Integrity Ross Wilcoxon, Dave Hillman, Doug Pauls, Dan White  Abstract
Strategic Environmental Research and Development Program (SERDP) Nanoparticle Enhanced Conformal Coating Project: Coating Modeling For Tin Whisker Mitigation S. McKeown, S. Meschter, P. Snugovsky, J. Kennedy, Z. Bagheri, J. Keeping, J. Cho, D. Edwards and K. Elsken  Abstract
Bending Strength of Solder Joints as a Function of Joint Length Saeed Akbari, Amir Nourani, Jan K. Spelt  Abstract
Agile Scrum Methods For Cross Functional Product Development Scott Gleason  Abstract
Assembly Process Development for a 14mmx14mm Bond Via Array (BVA) Package-On-Package (POP) Shane M. Lewis Ph.D., Tushar Tike, Charles G. Woychik, Ph.D., Ashok Prabhu, and Vineeth Bastin  Abstract
Evaluation of the Stencil Printing for Highly Miniaturized SMT Components with 03015mm in Size Stefan Härter, Jörg Franke, and Carmina Läntzsch  Abstract
Innovative BGA Defect Detection Method for Transient Discontinuity Steven Perng, Weidong Xie, Tae-Kyu Lee, and Cherif Guirguis  Abstract
The Corrosion Failure Risk Assessment of Memory Module at Data Center in Harsh Environmental Conditions Sungwon Han, Yuchul Hwang, Biao Cai and Marie Cole  Abstract
A New Method of Increasing the Reliability of Lead-Free Solder Takatoshi Nishimura, Keith Sweatman, Akira Kita, Shuhei Sawada  Abstract
Critical Parameters of a No Clean Process Terry Munson  Abstract
Component Level Reliability for High Temperature Power Computing with SAC305 and Alternative High Reliability Solders Thomas Sanders, Sivasubramanian Thirugnanasambandam, John Evans, Ph.D., Michael Bozack, Ph.D., Wayne Johnson, Ph.D., and Jeff Suhling, Ph.D.  Abstract
Addressing High Precision Automated Optical Inspection Challenges with Unique 3D Technology Solution Todd Liberty and Tim Skunes  Abstract
Reducing Labor Content As A Strategy To Improve Competitiveness - An Analysis That Addresses The Value Of Designing For Automation And An Empirical Analysis That Exploits The Automation Using Meta Process Control Tom Borkes and Lawrence Groves  Abstract
Formulation of a New Liquid Flux for High Temperature Soldering Tony Lentz  Abstract
The Impact of P Content in Pd Deposit for Solder Joint Reliability and Wire Bonding Reliability of ENEPIG Deposits Tsuyoshi Maeda, Shinsuke Wada, Katsuhisa Tanabe, Yukinori Oda, Shigeo Hashimoto, Don Gudeczauskas and George Milad  Abstract
Impact of Multiple Thermal Cycles on the Cleaning Process Umut Tosun, M.S.Ch.E. and Jigar Patel, M.S.Ch.E.  Abstract
An Attempt to Study the MFG Test Pollutant Chemistry Effect to Match Filed Data Vasu Vasudevan, Karumbu Meyyappan, Anil Kurella, Karl Pazdernik and Balu Pathangey  Abstract
Digital Image Correlation Using High Magnification Optical Microscopy W. Carter Ralph, Cheri B. Moss, Kevin B. Connolly  Abstract
Detection of Pad Crater Initiation in Shock Using Acoustic Emission Detection W. Carter Ralph, Gregory N. Morscher, Elizabeth Elias Benedetto, Keith Newman, Aileen Allen, and Julie Silk  Abstract
Applying Lean Philosophies to Supply Chain Management in EMS Wally Johnson  Abstract
Novel Lead-Free Solder Alloys Development for Automotive Applications Weiping Liu, Ph.D. and Ning-Cheng Lee, Ph.D.  Abstract
Low Voiding, High Reliability Solder Paste for Automotive, LED and Other Demanding Applications Westin Bent, Rahul Raut, Michael Liberatore, Tek Ong, and Morgana Ribas  Abstract
Partially-Activated Flux Residue Influence on Surface Insulation Resistance of Electronic Assembly Xiang Wei, Ph.D., Kyle Loomis, Jennifer Allen, Bruno Tolla, Ph.D.  Abstract
Influence of Surface Finishes and Solder Alloys on Solder Ball Joint Reliability Yoshinori Ejiri, Takaaki Noudou, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki Tsubomatsu, Kiyoshi Hasegawa  Abstract
Fatigue Life Estimation of Electroplated Through Hole in PWB by FEM with Thin Cu Material Properties Yoshiyuki Hiroshima, Shunichi Kikuchi, Akiko Matsui, Yoshiharu Kariya, Ph.D., Naoyuki Yajima, Kizuku Obinata, Hiroshi Shimizu, and Kazuhiko Nakamura  Abstract
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