Pan Pacific Symposium 2015 Proceedings

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TITLE AUTHOR
Depaneling of Circuit Boards Ahne Oosterhof and Thomas Nether  Abstract
Package Level Reliability Study of a Module-In-A-Package (MIP) Assembly Ajinkya P. Ranade, Ross Havens, Krishnaswami (Hari) Srihari, PhD., Ganesh Pandiarajan, Satyanarayan (Satya) Iyer, PhD.  Abstract
Rare Earth Recovery from Electronic Materials Alan Rae  Abstract
Design and Optimization of CMOS-Compatible Silicon Nanowires Based Biosensor Anran Gao, Na Lu, Pengfei Dai, Yuelin Wang and Tie Li  Abstract
Decision Making Model for the Emerging Nanotechnologies Audré Dixon, DHA and Kewal K. Verma, Ph.D.  Abstract
Influence of Microalloying Elements on Reliability of SnAgCu Solder Joints Babak Arfaei, Francis Mutuku, Richard Coyle, Eric Cotts  Abstract
2015 iNEMI Technology Roadmap Overview Bill Bader and Chuck Richardson  Abstract
Power Conversion Trends That Will Impact System Packaging and Assembly Carl Blake  Abstract
COOL Substrate for Power and Performance Charles Lin, Ph.D., Nick Wang and Jerry Tan  Abstract
A Novel Die Sawed Trench Structure for Warpage Reduction in WLP Process Chunsheng Zhu, Gaowen Xu, Le Luo  Abstract
Smart System Integration: Moulding of Magnetic Field Sensors into AlSi9Cu3(Fe)-Alloys D. Klaas, A. Wienecke, M.C. Wurz, L. Rissing, P. Freytag, H.J. Maier  Abstract
Interconnection of Electrically Conductive Textile Fibers for Application in Smart Textiles Dag Andersson, Erik Nilsson, and Göran Wetter  Abstract
The X-Ray Metrology of TSVs and Wafer Bumps David Bernard, John Tingay, Philip Moyse, Simon White, Evstatin Krastev & Will Heeley  Abstract
The Astute Use of Commercial Off The Shelf Components Dock Brown, CRE  Abstract
3D IC Stack Characterization Using Multi-Scale X-Ray Tomography Ehrenfried Zschech, Sven Niese, Markus Löffler, Markus Gall, M. Jürgen Wolf  Abstract
Intermetallics Issues and Challenges in 2.5/3D Assembly Microjoints F. Batieha, F. Feyissa, S. Hamasha, S. Shirazi, L. Wentlent, P. Ogutu, N. Dimitrov, E. Fey, and P. Borgesen  Abstract
Deposition of Solder Paste into High Density Cavity Assemblies Fernando Coma Martinez, Jeffrey Kennedy, Thilo Sack  Abstract
Effect of Pad Design, Solder Paste Type and Stencil Printer on Fine Pitch Printing Ganesh Pandiarajan, Satyanarayan (Satya) Iyer, Ajinkya P. Ranade, Ross Havens, and Krishnaswami (Hari) Srihari  Abstract
Simulations and Measurements to Predict EMC Characteristics in Electronic Assemblies: Obsolescence Management Geneviève Duchamp, Tristan Dubois, Hélène Frémont  Abstract
Low Cost TSV (Through-Silicon-Vias) Technologies Gu-Sung Kim  Abstract
Three Micron Lines and Spaces on Printed Circuit Boards Hajime Tomokage  Abstract
Latest Topics of 2.1D/2.5D IC Integration and Challenges Henry H. Utsunomiya  Abstract
DC Power: Rebellion or Revolution Herbert J. Neuhaus, Ph.D. and Charles E. Bauer, Ph.D.  Abstract
System I/O Optimization with SOC, SIP, PCB Co-Design Humair Mandavia and Kazunari Koga  Abstract
Device Embedded Substrate with Embedding Multi Passive Components for Camera Module Hyunho Kim, Ph.D., Jongtae Lee, Minjoon Kim, Se-meyung Hwang, and Sangsuk Cha  Abstract
Memory Markets and Applications: Future Outlook Il Ung Kim, Ph.D.  Abstract
The Effects of Bath Conditions on Electroless Nickel-Iron Alloy Plating for UBM Applications Ja-Kyung Koo and Jae-Ho Lee  Abstract
Enhanced Analysis and Imaging Methods for High Resolution Acoustic Micro Imaging of Flip Chip Devices Janet E. Semmens  Abstract
Dynamic Mechanical Analysis of PCB Laminates Jing Zhang, Jason T. Wertz, Joseph P. Kuczynski, and Dylan J. Boday  Abstract
The Role of Big Data in Health and Biomedical Research John Quackenbush  Abstract
Harsh Marine Environment - Toward Corrosion Simulation K. Weide-Zaage, A. Moujbani, H. Frémont, A. Guedon-Gracia  Abstract
Self-Powered Flexible Large Scale Integration (F-LSI) Keon Jae Lee, Ph.D.  Abstract
The Impact of Recent Counterfeit Mitigation Standards and US DFAR's on The Supply Chain Kevin Sink  Abstract
Modeling and Fabrication of a SIC-Based Power Module with Double Sided Cooling Klas Brinkfeldt, Michael Edwards, Dag Andersson, Klaus Neumaier, Olaf Zschieschang, Florian Hilpert, Alexander Otto, and Eberhard Kaulfeich  Abstract
Advanced Integration Technologies - Challenges and Solutions Concerning Cyber-Physical Systems Klaus-Dieter Lang, Harald Pötter, Ivan Ndip, Michael Töpper, Karl-Friedrich Becker, Tanja Braun, Jan Hefer, Carsten Brokmann, Jürgen Wolf, Andreas Ostmann, Maik Hampicke  Abstract
ACFS Interconnection Technology for Wearable Electronics Packaging Kyung W. Paik, Tae-Hwan Kim, Ji-Hye Kim and Young R. Kim  Abstract
Component Engineering and Correct Design of Electronic Devices Lev Shapiro, M.Sc. E.E.  Abstract
3D Integration: Status, Challenges and Requirements M. Juergen Wolf and Klaus-Dieter Lang  Abstract
Hybrid Bonding for 3D Integration Markus Wimplinger, Florian Kurz, Thomas Wagenleitner, Thomas Plach, Thomas Uhrmann, Bernhard Rebhan, Günther Weidlinger  Abstract
Development of Micro Gold Bump Joints Technology for 3D IC Chip Stacking Masashiro Aoyagi, Fumito Imura, Naoya Watanabe, Shunsuke Nemoto, Wei Feng, Katsuya Kikuchi, Hiroshi Nakagawa  Abstract
Patient Connected Health: The Digital Domain Matthew K. Hudes  Abstract
Hybrid Packaging of Circuits and Devices onto Flexible Screen Printed Electical Interconnects Meriem Akin, Joe Corea, Simon Scott, Ana Claudia Arias, Marc Wurz, Lutz Rissing  Abstract
High Resolution Scanning Acoustic Microscopy for Inspection and Failure Analysis of 3D System Integration Technologies Peter Czurratis, Tatjana Djuric, Peter Hoffrogge, Sebastian Brand, Sebastian Tismer, Matthias Petzold  Abstract
The Use of No-Clean Flux Phil Isaacs, Dave Braun, Jing Zhang, and Eddie Kobeda  Abstract
Interposers, Interconnections and Assembly Technologies Rao R. Tummala, Qiao Chen, Fuhan Liu, Venky Sundaram, and Vanessa Smet  Abstract
Innovation in Entrepreneurship Education Robin Anderson, Ed.D. and Mike Tae-In Eom, Ph.D.  Abstract
The Benefits of Small Package Size for RF Applications Roy Starks  Abstract
A Nanocopper Based Alternative to High Temperature Solder S. Hamasha, A. Sharma, B. Schnabl, L. Cheng, L. Desir, K. Bretz, L. Wentlent, A. A. Zinn, J.Beddow, K. Schnabl, E. Hauptfleisch, D. Blass, and P. Borgesen  Abstract
The Reliability of 1 Mil Au Wire Bonds to Different Pad Opening Shapes, Sizes and Locations Salvatore T. Napoli, Daryl Santos, Ross Havens and Krishnaswami Srihari  Abstract
3D Packaging for Mobile and Wearable Electronics Shen-Li Fu, Wei-Chung Lo & Jia-Jung Wang  Abstract
Interposer Packaging Technologies for Optical Interconnects Terry Bowen, Sandeep Razdan, Jibin Sun  Abstract
Field Returns of Electronic Hardware – No Trouble Found (NTF) Returns Why? Terry Munson  Abstract
New Technology Waterless Cleaning Approach for High Density Assemblies and Power Electronics Tom Forsythe, Mike Bixenman, DBA, Ram Wissel, and Ryan Hulse, Ph.D.  Abstract
Progress in 3D Memory IC And 3D Intergration Wei Koh, Ph.D.  Abstract
Application of Novel Dopamine-Polypyrrole Nanofibers for Electrically Conductive Adhesives Wei Zhang, Behnam Meschi Amoli, Jeffrey d'Eon, Boxin Zhao, and Alex Chen  Abstract
Paving the Way to 3D: from Passive to Active Interposers Yann Lamy, Ph.D.  Abstract
Perspective on Required Packaging Technologies for Cognitive Computing Devices Yasumitsu Orii  Abstract
Piezoelectric Thin Film of Sodium Niobate for Energy Harvesting Devices Young-Ku Jin, Subrata Sarker, Ki-Seong Lee, Hyun Woo Seo, Dong Min Kim  Abstract
Fabrication of Micro-Pattern on Flexible Substrate Using Pulsed Electroplating Techniques Yu-Jung Huang, Wei-Han Huang and Shen-Li Fu  Abstract
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