2001 Advanced Packaging Technology Proceedings

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TITLE AUTHOR
MATERIALS AND SYSTEMS CHOICES FOR BLUETOOTH™ AND BEYOND Alan Rae  Abstract
Compatibility of Lead-free Solders and Surface finishes Alan Rae, Gene Smelik, Jim McLenaghan  Abstract
THE LEAD-FREE SOLDER ALTERNATIVES ISSUE: A DEFENSE INDUSTRY PERSPECTIVE Anthony J. Rafanelli  Abstract
LEAD-FREE REWORK PROCESS FOR CHIP SCALE PACKAGES Arun Gowda and K. Srihari, Ph.D.  Abstract
IMPLEMENTING BALL GRID ARRAYS IN AN ELECTRONICS MANUFACTURING SERVICE PROVIDER’S ENVIRONMENT Arun Gowda, Robert Murcko, and K. Srihari, Ph.D.  Abstract
MICROSTRUCTURE BEHAVIOR OF LEAD-FREE SOLDER JOINTS Blaine L. Partee  Abstract
AUTOMATING OPTO-ELECTRONIC PACKAGING Bryan Pate  Abstract
EVALUATING SOLDER JOINT FATIGUE RELIABILITY BY MOIRÉ INTERFEROMETRY Cemal Basaran  Abstract
ELECTRICAL TESTING OF NO-LEAD –NO-CLEAN PASTE RESIDUES, NO-CLEAN PASTE RESIDUES, AND CONDUCTIVE ADHESIVE RESIDUES TO PREDICT ICT TESTABILITY Charles Bradshaw  Abstract
THE INFLUENCE OF STORAGE TIME ON MOISTURE MIGRATION IN POLYMERIC ENCAPSULANTS Charles J. Koehler and Martin A. Seitz  Abstract
CONSIDERATIONS FOR THE PIN PROBE TESTING OF NO-CLEAN SOLDER PASTE RESIDUES David Suraski  Abstract
WHEN ARE CONDUCTIVE ADHESIVES AN ALTERNATIVE TO SOLDERS? Dr. Ken Gilleo  Abstract
Flux Technology For Lead-Free Alloys & Its Impact On Cleaning Dr. Ning-Cheng Lee  Abstract
LEAD FREE SOLDER ON COMPAQ’S AERO HANDHELD COMPUTER Elizabeth Elias Benedetto  Abstract
CRITICAL MANUFACTURING ISSUES ASSOCIATED WITH MOISTURE SENSITIVE DEVICES (MSD) François Monette  Abstract
LEAD-FREE SN3.5AG AND SN0.7CU WAVE SOLDER EVALUATION WITH VOC-FREE NO-CLEAN AND WATER SOLUBLE FLUXES Jasbir Bath  Abstract
COMPARING MANUFACTURING PERFORMANCE OF STAGGERED AND INLINE SECOND BOND FINGERS FOR WIRE BONDED BGA SUBSTRATES Jeannie Miller, Mark Gerber and Christina Corona  Abstract
DEVELOPING WORLD-CLASS OPTICS ASSEMBLY CAPABILITY John G. Davis  Abstract
JOINT FAILURES, LEAD CONTAMINATION AND OTHER IMPORTANT CONSIDERATIONS FOR LEAD-FREE ELECTRONICS ASSEMBLY Karl Seelig and David Suraski  Abstract
EVALUATION OF ADVANCED MATERIALS TO SATISFY HIGHER REFLOW AND SOLDER JOINT LIFE REQUIREMENTS ON MAP BGA Mark Gerber, Trent Thompson and Shawn O'Connor  Abstract
ATMOSPHERE EFFECTS ON THE COMPARATIVE SOLDERABILITY OF EUTECTIC TIN-SILVER-COPPER AND TIN-LEAD ALLOYS Sean Adams and Paul Stratton  Abstract
BOARD-LEVEL RELIABILITY FOR LEAD-FREE QFP ASSEMBLY Shan-Pu Yu  Abstract
ENVIRONMENTAL PACKAGING SOLUTIONS WITH NO-PB MATERIALS AND LGA OPTIONS Thomas Koschmieder, Michael Leoni, and Jesse Phou  Abstract
A RELIABILITY INVESTIGATION OF Bi-42Sn-1Ag SOLDER PASTE: AN ALTERNATIVE TO Sn-3.5Ag-0.7Cu FOR LOW COST CONSUMER PRODUCTS V. Schroeder  Abstract
Lead-Free Solder Bump Technologies for Flip-Chip Packaging Applications Zaheed S. Karim  Abstract
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