South East Asia Technical Training Conference on Electronics Assembly Technologies 2014 Proceedings

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TITLE AUTHOR
Applying Lean Six Sigma in Manufacturing Celine YC Chong, Ai Kiar Ang, Marvin Mamac Ortega, Michael Russell and Uy Gonzales  Abstract
TSV Barriers Create SMT Opportunities Charles E. Bauer, Ph.D. and Herbert J. Neuhaus, Ph.D.  Abstract
Gold Embrittlement in Lead-Free Solder Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen, Julie Silk, and Alex Chiu  Abstract
Failure Analysis of High Density Printed Circuit Board Assembly Inside Smartphone David Edwards-Schofield, Anil Kurella Ph.D., Choon Kheam Lim, Yi Yun Chua and Binh T Nguyen  Abstract
Bottom Termination Component Design Considerations to Improve Cleaning Dr. Mike Bixenman, Dale Lee, Bill Vuono, and Steve Stach  Abstract
Inspection Strategies for More Accurate, Faster and Smarter Inspection Dr. Subodh Kulkarni, Sean Langbridge, Dick Johnson  Abstract
High-Reliability, Pb-Free, Halogen-Free Solder Ian J. Wilding & Gavin J. Jackson  Abstract
High Density Assembly in PCBb Cavities Jonas Sjoberg, Ranilo Aranda, David Geiger and Murad Kurwa  Abstract
Lead-Free and Halogen Free Solder Flip Chips Integration on Board Using SMT Process Jonas Sjoberg, Ranilo Aranda, David Pang, David Geiger and Murad Kurwa  Abstract
Package On Package (PoP) Process Characterization And Capability Study Kenny Chiong Kung Chuan, Tan Seak Huat, Ricky Liew and Tan How Chuan  Abstract
The Use of MICRO/ATR FTIR in PCBA CRD Smearing Failure Analysis Lee Kong Hui and Jason Ho Wye Meng  Abstract
A Process for Improved QFN Reliability Lenora Toscano, John Ganjei, Ph.D., Richard Retallick, and Gu Hong, Ph.D.  Abstract
The Rheology and Printing Behaviour of Water Soluble Solder Pastes Li Tianpeng, Tan Ying Ru Jorcelyn, C. D. Breach and A. Hawkins  Abstract
Ultra Miniaturized 01005 Passives Assembly Ng Chin Fei, Ng Shirley, Ooi HockWooi, Lim SiewFong  Abstract
Optimizing Solder Voids Performance at Thermal Pad and Printability of Its Peripheral Pads for Dual Row QFN Assembly Ooi Hock Wooi, Ricky Liew, Ng Shirley, Wong Hon Sern  Abstract
Cleaning PCBs in Electronics: Understanding Today's Needs P.J.Duchi, Anne-Marie Laügt, Marie Verdier, G.Abidh  Abstract
Cleaning Soldering Residues From High Lead Soldered PCBs Ram Wissel, Dr. Mike Bixenman & Jason Chan  Abstract
0.35mm Pitch Extremely Small Outline No Lead Package (XSON) PCBA Process Characterization Ricky Liew, Shirley Ng, Lim SiewFong  Abstract
Failure Modes and Failure Analysis of LEDs in ICMs and Process and Design Optimization of LEDs within ICMs Ron Yin, Ai Kiar Ang, Curtis Grosskopf  Abstract
Impact of Low Ag SAC Solder Pastes on BGA Solder Joint Quality Tang Kok Kwan, Raiyo F. Aspandiar, Wu Jin Chang, Colin Wang, Wang Xin  Abstract
2014 Best Practices in High Reliability Soldering Terry Clitheroe  Abstract
Concentration Monitoring & Closed Loop Control - A Technological Advancement Umut Tosun, M.S.Chem.Eng., Axel Vargas, and Bryan Kim, Ph.D.  Abstract
The Second Generation Shock Resistant and Thermally Reliable Low Ag SAC Solder Doped with Mn Vahid Goudarzi, Matthew Brown, Weiping Liu, Ning-Cheng Lee, and Jeffrey ChangBing Lee  Abstract
Voiding and Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys Yan Liu, Joanna Keck, Erin Page, and Ning-Cheng Lee  Abstract
Properties and Structure of Magnetically Responsive Fe - SAC305 Solder Yiteng Lin, Xu Ke, Justin Zhou Yong, Eng Soon TOK, R. Gopala Krishnan, G. Yaadhav Raaj & G Srayes  Abstract
Reliability Improvement of Array QFN Package You-Chye How and Shaw-Wei Lee  Abstract
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