Pan Pacific Symposium 2001 Proceedings

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TITLE AUTHOR
EMC-ORIENTED 3D MICROELECTRONICS DESIGN A. Gandelli  Abstract
FLUXLESS SOLDER NCP TECHNIQUE Akira Yamauchi, Toshiyuki Mori  Abstract
FAST UNDERFILL PROCESSES FOR LARGE TO SMALL FLIP CHIPS Alec J. Babiarz, Horatio Quinones and Robert Ciard  Abstract
EMI REJECTION AND EMC PROBLEMS IN MICROELECTRONIC SENSORS FOR AUTOMOTIVE APPLICATIONS Alessandro Gandelli  Abstract
DEVELOPING A ROBUST STENCIL PRINTING PROCESS FOR DIVERSE INTERCONNECTION TECHNOLOGIES Ashish D. Alawani  Abstract
HOW TO PACKAGE AND INDUSTRIALIZE MEMS B. Brox, L. Bergstedt and K. Persson  Abstract
PRODUCT DEVELOPMENT AND IMPLEMENTATION OF A SELF–FLUXING UNDERFILL (FluxFill) INTO WIRELESS COMMUNICATION PRODUCTS Bryan Anderson  Abstract
DESIGN AND ASSEMBLY FACTORS FOR 0201 COMPONENTS Christina Piasky  Abstract
EFFECTS OF NO-LEAD PCB FINISHES ON DISK DRIVE ASSEMBLY PROCESS Dale Lee  Abstract
AN ACCELERATED AGING STUDY OF OSPs AND THEIR SOLDERABILITY ASSAYS VIA THREE TEST METHODS Daryl Santos, Ph.D.  Abstract
FLIP-CHIP ON ORGANIC CARRIER ASSEMBLY EVALUATION Donald R. Banks  Abstract
ADVANCED WAFER LEVEL CSP PACKAGING USING NEW LIQUID BISMALEIMIDE POLYMERS Dr. Ben Santos, Art Burkhart  Abstract
ECONOMIC, PERFORMANCE AND ENVIRONMENTAL CONSTRAINTS: HOW DO WE RECONCILE THEM? Ed Kanegsberg and Barbara Kanegsberg,  Abstract
INTEGRAL INDUCTIVE ELEMENTS ON THE BASE OF POLYCRYSTALLINE SILICON FILMS Farida F. Kasimova,  Abstract
THE INFLUENCE OF ELECTROERROSION TREATMENT ON Ni/6H-SiC CONTACTS Fuad Kasimov  Abstract
PROBES FOR CHIPS, WAFERS, PACKAGES AND PCBs Gabe Cherian  Abstract
HIGH-DENSITY SOCKETS FOR TEST & BURN-IN OF MICRO-BGAs, CHIPS and WAFERS Gabe Cherian  Abstract
ACCURATELY MONITORING TOTAL ORGANIC CARBON IN ULTRA HIGH PURITY WATER BY NEW INSTRUMENTATION Hai Wei Zhu, Ph.D.  Abstract
TEST PROCESS OPTIMIZATION IN SMT-MANUFACTURING LINES Heinz Wohlrabe  Abstract
LIQUID CRYSTAL POLYMER FILM WITH HIGH HEAT RESISTANCE AND HIGH DIMENTIONAL STABILITY Hiroshi Inoue, Sunao Fukutake, Hiroyuki Ohata  Abstract
UNDERFILLING CHIP SCALE PACKAGES WITH REWORKABLE UNDERFILLS FOR CONSUMER PRODUCT APPLICATIONS Horatio Quinones  Abstract
QUALITY CONSIDERATIONS FOR SOLDER SPHERES IN BGA PACKAGING Hubert K. Chow  Abstract
THE NEW HYBRID ELECTRONIC IGNITION CIRCUITS FOR DISCHARGE LAMPS J.Pawelczyk  Abstract
FREQUENCY DOMAIN ANALYSIS FOR IMPROVED SAM INSPECTION OF MICROELECTRONIC COMPONENTS James C. P. McKeon  Abstract
MATERIAL PROPERTY EFFECTS ON FOCUSED BEAM TRANSDUCERS James C. P. McKeon  Abstract
GENERAL RULE IN DETERMINING PELLET WEIGHT OF THE TSOP PACKAGES James Fan, C. L. Lin, F. J. Tsai, R. B. Tsai  Abstract
APPLICATION STUDY OF HIGH SPEED SEPARABLE INTERCONNECT FOR HIGH DENSITY AREA ARRAY PACKAGING James Rathburn  Abstract
EVALUATION OF SILICON ON INSULATOR (SOI) BONDED WAFERS USING AUTOMATED ACOUSTIC MICRO IMAGING Janet E. Semmens and Bryan P. Schackmuth  Abstract
PACE OF INNOVATION DEMANDS CLOSER COLLABORATION WITH MATERIALS PROVIDERS Joe McGonnell  Abstract
SYSTEMATIC ANALYSIS TOWARDS THE MINIMIZATION/ELIMINATION OF FLUX SPATTER ON GOLD FINGER CONTACTS Karthik Vijayamadhavan  Abstract
DEVELOPMENT OF FLIP-CHIP MOUNTING PROCESS BY METALLIC JOINT WHICH USES SUPERSONIC(ULTRASONIC) WAVE ENERGY Kazushi Higashi  Abstract
A SMORGASBORD OF PACKAGES - PETITE & LIGHT Ken Gilleo  Abstract
THE NEO-MANHATTAN BUMP INTERCONNECTION FOR B²IT BUILD-UP PRINTED WIRING BOARDS AND AREA ARRAY IC PACKAGE SUBSTRATES Kenji Ohsawa  Abstract
SIGNIFICANT RELIABLITY ENHANCEMENT USING NEW ANISOTROPIC CONDUCTIVE ADHESIVES FOR FLIP CHIP ON ORGANIC SUBSTRATES APPLICATIONS Kyung-Wook Paik  Abstract
ADVANCED IC PACKAGING DESIGN OPTIMIZATION Les Ammann  Abstract
CHARACTERIZATION OF OSP FOR FLIP CHIP PBGA PACKAGING Li Ann Wetz, Keri Kirschenbaum  Abstract
HIGH DENSITY MICROELECTRONICS PACKAGING ROADMAP FOR SPACE APPLICATIONS Lissa Galbraith, PhD  Abstract
ADHESION OF FLIP-CHIP UNDERFILLS TO VARIOUS DIE PASSIVATIONS BEFORE AND AFTER ACCELERATED ENVIREMENTAL EXPOSURE Mark Dimke, Ph.D.  Abstract
RELIABILITY STUDY AND FAILURE ANALYSIS OF ASSEMBLED AND REWORKED CERAMIC COLUMN GRID ARRAY PACKAGES Mei Wang  Abstract
UNDERFILLING CHIP SCALE PACKAGES WITH REWORKABLE UNDERFILLS FOR CONSUMER PRODUCT APPLICATIONS Nael Hannan and Puligandla Viswanadham  Abstract
LASER PROCESSING OF HIGH DENSITY INTERCONNECTS Neal Hofmann  Abstract
CONSTRUCTION AND OPTIMIZATION OF THE REACTOR FOR RAPID THERMAL PROCESSING OF LARGE DIAMETER WAFERS Oleg A. Agueev  Abstract
ADVANCED WARPAGE CHARACTERIZATION: LOCATION AND TYPE OF DISPLACEMENT CAN BE EQUALLY AS IMPORTANT AS MAGNITUDE Patrick B. Hassell  Abstract
ADVANCED WARPAGE CHARACTERIZATION: LOCATION AND TYPE OF DISPLACEMENT CAN BE EQUALLY AS IMPORTANT AS MAGNITUDE Patrick B. Hassell  Abstract
A SHEAR STRENGTH STUDY OF LEAD-FREE SOLDER SPHERES FOR BGA APPLICATIONS ON DIFFERENT PAD FINISHES Prashant Chouta  Abstract
USE OF AUGER DEPTH PROFILING AND SURFACE ANALYSIS TO IDENTIFY FAILURE MECHANISMS IN THIN FILMS USED IN TAB AND OTHER DEVICE PACKAGING Ronald S. Nowicki  Abstract
IMPEDANCE AND PROPAGATION DELAY CHARACTERIZATION FOR FR-4 PRINTED CIRCUIT BOARDS S. Pochareddy  Abstract
CSP BOARD LEVEL RELIABILITY TESTING OF PB-FREE SN-AG-X (X=CU, IN) AND POLYMER-CORE SOLDER BALL Seung Wook Yoon and Ik Seung Park  Abstract
DIMPLED BALL GRID ARRAY PROCESS DEVELOPMENT FOR SPACE FLIGHT APPLICATIONS Sharon L. Barr and Atul Mehta  Abstract
IMPACT OF PCB SURFACE PAD FINISH AND CONTAMINATION ON BGA SOLDER JOINT VOIDING Shawn Eckel, Naveen Kini, Du Le  Abstract
SUPERIOR STRUCTURE BUILD-UP SUBSTRATE, "ADVANCED DV-MULTI" FOR PACKAGING Shinji Sumi, Hirofumi Nakamura, Hisaya Takahashi,  Abstract
ENHANCING YIELD WITH SOLDER FLUX AND SOLDER PASTE PROCESS CONTROL Stacy Kalisz  Abstract
300 MM WAFER STEPPER FOR BUMP AND WAFER LEVEL SCALE PACKAGING (CSP) APPLICATIONS Stephen Kay, Doug Anberg  Abstract
PLATING CHEMICAL EVALUATIONS AND RELIABILITY OF LEAD-FREE LEADFRAME PACKAGES Swaminath Prasad & Flynn Carson  Abstract
ADVANCED WAFER LEVEL CSP PACKAGING USING NEW LIQUID BISMALEIMIDE POLYMERS T. Wakabayashi, O. Kuwabara  Abstract
RELIABILITY STUDIES OF FLIP CHIP PACKAGE WITH REFLOWABLE UNDERFILL Tie Wang  Abstract
RELOCATING THE MANUFACTURING FACILITY Tim Crawford  Abstract
“LIFE-TESTING .... SAVE TIME AND MONEY, GET BETTER DATA" Tom Clifford  Abstract
IC PACKAGE SOLUTIONS FOR HIGH PERFORMANCE MEMORY Vern Solberg  Abstract
THE PRACTICAL WIRE SWEEP ANALYSIS SOFTWARE- INPACK, AND VERIFICATION FOR PBGA, STACKED CSP Vincent Tu  Abstract
A CASE-BASED DECISION SUPPORT MODEL FOR SEMICONDUCTOR ASSEMBLY Yun-ok Yang, Cheolwoo-Kwak  Abstract
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