SMTA International 1999 Proceedings

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TITLE AUTHOR
MODEL OF PROCESS CAPABILITY OF SOLDER PASTE PRINTING A. Paproth  Abstract
MANUFACTURING ROBUSTNESS OF CSP ON AN SMT LINE Alex Chen  Abstract
CHALLENGES IN HIGH-DENSITY PCB ASSEMBLY: NEW STRATEGIES FOR IMPROVING QUALITY INSPECTION AND TEST Ana I. De Marco  Abstract
SELECTIVE SOLDERING WITH LASER OR MINI-WAVE Armin Rahn  Abstract
ALTERNATIVE FINANCING STRATEGIES OF EACH STAGE OF THE OUTSOURCED PROCESS Barry Cohen  Abstract
THE IMPACT MULTIMEDIA HAS HAD ON PRODUCTIVITY Belinda Bittner  Abstract
TEST STRATEGIES FOR COMPLEX ELECTRONIC ASSEMBLY: EVALUATING AND IMPLEMENTING FLYING PROBE TECHNOLOGY Bernard McAvinue  Abstract
REQUIREMENTS FOR RELIABLE BGA SUBSTRATES FOR WIREBOND, FLIP CHIP AND SOLDERING Bernd Guenther  Abstract
LINKING THE LINKS: CREATING THE “VALUE” IN THE HIGH-MIX VALUE CHAIN Brian Tracey  Abstract
INTRODUCING THE IPC/JPCA-4104 SPECIFICATIONS FOR HIGH DENSITY INTERCONNECT /MICROVIA MATERIALS Ceferino G. Gonzalez  Abstract
THERMOGRAVIMETRIC ANALYSIS PREDICTIONS OF REFLOW PROFILE OF SOLDER PASTES Charles Bradshaw  Abstract
INERTING THE WAVE SOLDERING PROCESS WITH MEMBRANE-GENERATED NITROGEN Chrys Shea  Abstract
A PRODUCT COST QUOTATION SYSTEM FOR CONTRACT ELECTRONICS MANUFACTURERS Daryl Santos  Abstract
EXPERIMENT-BASED COMPUTATIONAL INVESTIGATION OF THERMOMECHANICAL STRESSES IN FLIP CHIP BGA USING THE ATC4.2 TEST VEHICLE David W. Peterson  Abstract
“FLASHSOLDERING” – A NEW NON-CONTACT SELECTIVE SOLDERING PROCESS FOR SMT COMPONENTS David W. Steinmeier  Abstract
NEW GENERATION METALLIC SOLDERABILITY PRESERVATIVES: Donald P. Cullen  Abstract
IMPLEMENTING LEAD FREE SOLDDERING - EUROPEAN CONSORTIUM RESEARCH Dr. Malcolm Warwick  Abstract
REVIEW OF WAFER LEVEL CSP DEVELOPMENTS E. Jan Vardaman  Abstract
ADVANCED CSP AND FINE PITCH BALL GRID ARRAY ASSEMBLY RELIABILITY Ed Blackshear  Abstract
ELEMENTS OF STENCIL DESIGN AND MANUFACTURE Edward Hale  Abstract
EVOLVING THE NEW PRODUCT INTRODUCTION PROCESS: AN EMS CASE STUDY Edwin B. Smith, III  Abstract
MULTIMEDIA FROM A TRAINER’S PERSPECTIVE Floyd H. Bertagnolli  Abstract
DEVELOPMENT AND QUALIFICATION PROCESS FOR 1 MM CCGA TECHNOLOGY IMPLEMENTATION Ganesh Sure  Abstract
CURTAILING VOIDS IN FINE PITCH BALL GRID ARRAY SOLDER JOINTS Gary Morrison  Abstract
ENVIRONMENTAL ISSUES IN ELECTRONICS ASSEMBLY Greg Munie  Abstract
HIGH-SPEED SECOND - LEVEL CSP AND FLIP CHIP ASSEMBLY USING FLIP CHIP SHOOTERS Günter Schiebel  Abstract
CSP BOARD LEVEL RELIABILITY - RESULTS H. J. Albrecht  Abstract
THE NEW IPC HDI (MICROVIA) DESIGN GUIDELINE (IPC-2315) Happy Holden  Abstract
MACHINE AND PROCESS CAPABILITY COEFFICIENT OF SOLDER PASTE PRINTERS Heinz Wohlrabe  Abstract
DEVELOPING MULTIMEDIA TRAINING PROGRAMS James C. Blankenhorn  Abstract
SOLDER PASTE PRINTING REQUIREMENTS FOR CSP PACKAGES Jeff Kennedy  Abstract
SOLDER PASTE INSPECTION FOR SCREEN PRINTING Jeff Woolstenhulme  Abstract
SOLDERABILITY OF DIFFERENT BOARD FINISHES UNDER NITROGEN ATMOSPHERES WITH DIFFERENT ROLS Jens Tauchmann  Abstract
THE CHANGING NEEDS OF MANUFACTURING SYSTEM DESIGN Jim Kane  Abstract
DESIGN, ANALYSIS, AND MEASUREMENT OF A NOVEL PLASTIC BALL GRID ARRAY PACKAGE John Lau  Abstract
PCB MANUFACTURING AND TESTING OF THE DIRECT RAMBUS John Lau  Abstract
ECONOMICS OF BOARD TESTING & PROCESS COST OPTIMIZATION K. Douglas Werner  Abstract
PROCUREMENT LEAD TIME REDUCTION AT A CONTRACT ASSEMBLY FACILITY THROUGH AN INTELLIGENT AGENT BASED FRAMEWORK K. Srihari  Abstract
OSPS: ADDRESSING FUTURE SURFACE FINISHING NEEDS Karl Wengenroth  Abstract
ENVIRONMENTAL ISSUES IN ELECTRONICS AND THE TRANSITION TO LEAD-FREE SOLDERING Kay Nimmo  Abstract
INVESTIGATION OF THE PRINTING PROCESS FOR CSP ASSEMBLING Kazu Nakajima  Abstract
THE RELIABILITY IMPROVEMENT OF 0.5MM PITCH T-CSP Kazuaki Ano  Abstract
ROOM TEMPERATURE ADHESION IN SILICONE ENCAPSULANTS Kelly J. Wall  Abstract
OPTIMIZING PERFORMANCE IN REFLOW SOLDERING WITH DYNAMIC FLOW ENGINEERING Kerem Durdag  Abstract
IN-LINE BONDING CAVITY PACKAGING FOR GLOB-TOP REPLACEMENT Kevin Chung  Abstract
TRENDS IN ELECTRONIC PRODUCTS AND PLACEMENT EQUIPMENT Kevin Towle  Abstract
SOLDERABILITY OF DIFFERENT BOARD FINISHES UNDER NITROGEN ATMOSPHERES WITH DIFFERENT ROLS Klaus Wilke  Abstract
FLEXURE INDUCED FAILURE OF BGA SOLDER JOINTS Kuan-Shaur Lei, Jaime LLinas, and Mark Gwaltney  Abstract
MANAGING SHOP FLOOR DATA IN PCB MANUFACTURING Kyle Klatka  Abstract
COST, BENEFITS AND IMPLEMENTATION OF A SHOP FLOOR LINE MANAGEMENT SYSTEM IN PCB MANUFACTURING Kyle Klatka  Abstract
RELIABILITY EXPERIMENTS FOR DIFFERENT MICROVIA CONSTRUCTIONS L. Gopalakrishnan  Abstract
PROCESS OPTIMIZATION FOR 1.0 MM PITCH CBGA Marie Cole  Abstract
1999 STATUS OF BGA / CSP STANDARDIZATION Mark Bird  Abstract
PROCESS CONTROL FOR SOLDER PASTE DEPOSITION Mark Owen  Abstract
ANALYSIS AND OPTIMIZATION OF MANUFACTURING AND TEST PROCESS ARRANGEMENTS WITH NEW COST MODELS Martin Oppermann  Abstract
CHARACTERIZATION OF FLUX RESIDUES Mary Ann Nailos  Abstract
SOLDER JOINT STUDY OF CSP FOR USE DURING THE TRANSITION PERIOD TO LEAD FREE PROCESS Masako Watanabe  Abstract
VOLUME MANUFACTURING CHALLENGES OF HDI Mason Hu  Abstract
DISTRIBUTION SUPPLY CHAIN MANAGEMENT: INCREASE PRODUCTIVITY, DECREASE COSTS WITH EDI AND ERP + APS Mel Smith  Abstract
USING THE INTERNET WITH REAL-TIME REFLOW DATA COLLECTION Mike McMonagle  Abstract
THE EFFECT OF CONTRACT MANUFACTURING ON OEM FINANCIAL METRICS Milt Gregory  Abstract
CSP ASSEMBLY PROCESS ISSUES AND CHALLENGES Nicholas Brathwaite  Abstract
SOLDERING TECHNOLOGY FOR AREA ARRAY PACKAGES Ning-Cheng Lee  Abstract
BACK END PROCESS DEVELOPMENT FOR WAFER LEVEL CHIP SCALE PACKAGING Pamela Chang  Abstract
TRENDS IN MANUFACTURING THAT AFFECT THE SELECTION OF BGA/CSP REWORK EQUIPMENT Patrick McCall  Abstract
QUALIFYING THE BGA PROCESS IN AN ELECTRONIC CONTRACT MANUFACTURING COMPANY ON A SMALL BUDGET Paul Sperry  Abstract
SOLDER PASTE DEPOSITION FOR BGA AND CSP REWORK Paul Wood  Abstract
TBGA RELIABILITY IN TELECOM ENVIRONMENT Pennanen Virpi  Abstract
FLIP CHIP ON ORGANIC SUBSTRATES Peter Borgesen  Abstract
REFLOW SOLDERING OF THROUGH-HOLE COMPONENTS Phil Zarrow  Abstract
HIGH PERFORMANCE BALL GRID ARRAY ASSEMBLIES FOR HIGH TEMPERATURE AND HIGH ALTITUDE APPLICATIONS Puligandla Viswanadham  Abstract
PIN-IN-PASTE SOLDER PROCESS DEVELOPMENT Raiyo Aspandiar  Abstract
GENERAL ELECTRIC FLOATING PAD TECHNOLOGYTM FOR BGA AND OTHER MISMATCHED CTE INTERFACES Raymond A. Fillion  Abstract
CSP ASSEMBLY RELIABILITY: COMMERCIAL AND HARSH ENVIRONMENTS Reza Ghaffarian  Abstract
MEASUREMENT AND ANALYSIS OF BGA DEFECTS WITH ADVANCED X-RAY INSPECTION SYSTEMS Richard Amtower  Abstract
RAISING THE SPEED LIMIT OF YOUR SMT PROCESS Richard R. Lathrop Jr.  Abstract
RELIABILITY ANALYSIS OF FLIP CHIP ON BOARD ASSEMBLIES USING NO-FLOW UNDERFILL MATERIALS Ryan Thorpe  Abstract
SIMULTANEOUS LASER SOLDERING FOR SMDS ON 3D-MIDS S. Hierl  Abstract
SECOND LEVEL INTERCONNECT RELIABILITY OF REWORKED PACKAGES AND ROUTING EVALUATION FOR HIGH I/O STAGGERED ARRAY BGA PACKAGES Santhana S. Satagopan  Abstract
BROADENING THE CERAMIC CSP MARKET FOR HIGHER RELIABILITY APPLICATIONS Shoji Uegaki  Abstract
MICROSTRUCTURAL EVOLUTION OF SN-AG SOLDER JOINTS RESULTING FROM SUBSTRATE COPPER DISSOLUTION Srinivas Chada  Abstract
STENCIL MANUFACTURE AND ITS EFFECT UPON THE SOLDER PRINTING PROCESS Stanley Dudek  Abstract
ENHANCING BOARD LEVEL BGA ASSEMBLY AND RELIABILITY Steven Dunford  Abstract
TEST AND INSPECTION AS PART OF PROCESS CONTROL Stig Oresjo  Abstract
IMPLICATIONS OF FINE BALL GRID ARRAY DIMENSIONAL VARIATION Syed Sajid Ahmad  Abstract
HIGH THERMAL PERFORMANCE TAPE BGA FOR MEDIA PROCESSOR Tatsuya Ohtaka  Abstract
CERAMIC SUBSTRATE THICKNESS, TEST BOARD THICKNESS, AND PART SPACING: A SCREENING DOE Thomas Koschmieder  Abstract
PRINTED WIRING BOARD FABRICATORS - ARE THEY EQUALLY CAPABLE? Timothy A. Estes  Abstract
CHIP SCALE PACKAGE SOLDER PASTE STENCIL PRINTING OPTIMIZATION Tom Long  Abstract
CHOOSING AND IMPLEMENTING A FULLY INTEGRATED ON-LINE QUALITY SYSTEM Tom Lyons  Abstract
CONTINUOUS IMPROVEMENT APPROACHES FOR WAVE SOLDERING PROCESS Tony Huang  Abstract
MULTI CHIP POWER PACKAGING - RELIABILITY ASSESSMENT Torsten Hauck  Abstract
RELIABILITY ASSESSMENT OF A THIN (FLEX) BGA USING A POLYIMIDE TAPE SUBSTRATE Trent Thompson  Abstract
BURIED COMPONENTS IN PRINTED WIRING BOARDS Wallace D. Doeling  Abstract
IDENTIFYING THE CHEMICALS RESPONSIBLE FOR CONDUCTIVE ANODIC FILAMENT (CAF) ENHANCEMENT Westin R. Bent  Abstract
STENCIL DESIGN FOR MIXED TECHNOLOGY THROUGH-HOLE / SMT PLACEMENT AND REFLOW William E. Coleman  Abstract
CSP DESIGN AND RELIABILITY: LEAD DESIGN GUIDE FOR CENTER PAD BGA® PACKAGE Young Kim  Abstract
RELIABILITY OF PBGA ASSEMBLIES UNDER VIBRATION Z.P. Wang  Abstract
INTERCONNECT DESIGN AND RELIABILITY OF LAND GRID ARRAY CSPS Z.P.Wang  Abstract
A FAILURE ANALYSIS AND REWORK METHOD OF ELECTRONIC ASSEMBLY ON ELECTROLESS NI / IMMERSION AU SURFACE FINISH Zequn Mei  Abstract
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