SMTA International Conference Proceedings


Board, Package and Die Thickness Effects under Thermal Cycling Conditions

Author: Jean-Paul Clech
Company: EPSI Inc.
Date Published: 9/27/2015   Conference: SMTA International


Abstract: This paper presents a first-order model that enables the scaling of solder joint failure cycles for board and/or die or substrate thickness effects under thermal cycling conditions. The model also allows for the prediction of failure cycles for solder joints of double-sided, mirrored assemblies based on failure data for single-sided assemblies.



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