Journal of SMT Article

YIELD ENHANCEMENT AND YIELD MODELING FOR MASS REFLOW PROCESS OF 0201 COMPONENTS

Authors: Susan Lu, Sarah Lam, and Wei-Yun Cheng
Company: State University of New York
Date Published: 10/1/2004   Volume: 17-4

Abstract: 0201 technology is becoming more popular in electronics manufacturing industry to produce high-density circuit boards. To enhance the 0201 assembly's manufacturability, some design/process parameters that may affect the 0201 assembly yield need to be thoroughly studied.

In this research, a full factorial experimental design was conducted to study the effects of pad design parameters, component orientation, and different reflow assembly processes on the manufacturing yield. Yield models were developed to assist engineers to make decisions during the design periods to facilitate design for manufacturability.



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