Journal of SMT Article
TERNARY INTERMETALLIC COMPOUND - A REAL THREAT TO BGA SOLDER JOINT RELIABILITY
Company: Solectron (Suzhou) Technology
Date Published: 4/1/2004 Volume: 17-2
This paper will demonstrate the effect of BGA pad finish on Ni-Cu-Sn ternary IMC growth. Methods for characterizing related solder joint failures and techniques for measuring the strength of the solder joints will also be discussed. Although this phenomenon is still not fully understood, it has proven to be a real threat to BGA solder joint reliability.
Key words: BGA, reliability, intermetallic, ternary IMC, SEM/EDX.
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