Journal of SMT Article

ELECTROCHEMICAL MIGRATION ON HASL PLATED FR-4 PRINTED CIRCUIT BOARDS

Author: Elissa Bumiller et al.
Company: Naval Surface Warfare Center
Date Published: 4/1/2004   Volume: 17-2

Abstract: As the current trends toward miniaturization take hold, proper cleanliness levels become more difficult to achieve. In addition, effective cleaning requirements may not be in place. The smaller spacing between conductors also yields a larger electric field, which in conjunction with insufficient cleaning can lead to dendritic growth.

This paper investigates the effects of chloride contamination and electric field on the migration behavior of hot air solder level (HASL) plated FR-4 printed circuit boards. It was found that chloride contamination level and electric field influence which failure mechanism is occurring, electrochemical migration or electrolytic corrosion. This study concludes that current industry specifications for cleanliness may be inadequate for the next generation of electronic assemblies.

Key words: electrochemical migration, dendritic growth, electric field, contamination.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819