Journal of SMT Article
AN OVERVIEW OF IPC STANDARDS RELATED TO MOISTURE SENSITIVE COMPONENTS
Company: RadiSys Corporation
Date Published: 10/1/2003 Volume: 16-4
Common failure modes include internal separation (delamination) of the plastic from the die or leadframe, wire bond damage, die damage, and internal cracks that do not extend to the surface of the component. In extreme cases, cracks will extend to the surface of the component, and in the most severe cases the component will bulge and pop (commonly referred to as the "popcorn" effect).
Prevention is the key to success when dealing with moisture absorption and moisture sensitive components. Industry standards describe a moisture sensitive component handling strategy that is being utilized by most component suppliers and end users.
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