Journal of SMT Article

AN INVESTIGATION ON THE RELIABILITY OF CSP SOLDER JOINTS WITH NUMEROUS UNDERFILL MATERIALS

Author: Sunny Zhang et al.
Company: Solectron Technology Co., Ltd.
Date Published: 7/1/2003   Volume: 16-3

Abstract: Underfill technology has been used to minimize the mismatch of the coefficient of thermal expansion (CTE) in flip chip technology. An extension of this underfill technology has been used to increase the mechanical strength of chip scale packages (CSPs).

This paper will discuss the impact of non-reworkable and reworkable undefill on the mechanical strength of CSPs. Reliability tests performed include drop, shear, bending, and thermal shock tests. The goal is to understand the reliability and degree of protection each of these underfill material offers.

Key words: underfill, CSP, mechanical, reliability.



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