Journal of SMT Article
AN INVESTIGATION ON THE RELIABILITY OF CSP SOLDER JOINTS WITH NUMEROUS UNDERFILL MATERIALS
Company: Solectron Technology Co., Ltd.
Date Published: 7/1/2003 Volume: 16-3
This paper will discuss the impact of non-reworkable and reworkable undefill on the mechanical strength of CSPs. Reliability tests performed include drop, shear, bending, and thermal shock tests. The goal is to understand the reliability and degree of protection each of these underfill material offers.
Key words: underfill, CSP, mechanical, reliability.
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